JPH0176042U - - Google Patents
Info
- Publication number
- JPH0176042U JPH0176042U JP1987171678U JP17167887U JPH0176042U JP H0176042 U JPH0176042 U JP H0176042U JP 1987171678 U JP1987171678 U JP 1987171678U JP 17167887 U JP17167887 U JP 17167887U JP H0176042 U JPH0176042 U JP H0176042U
- Authority
- JP
- Japan
- Prior art keywords
- clamp section
- wire
- capillary
- cut clamp
- wire cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Description
第１図ａは本考案の実施例１の側面図、第１図
ｂは第１図ａのＡ―Ａ′線断面図、第２図ａは本
考案の実施例２の側面図、第２図ｂは第２図ａの
Ｂ―Ｂ′線断面図、第３図は従来例の側面図であ
る。 １…クランプホルダ、２…レール、２′…蝶番
、３…ロツクピン、４…クランプコイル、５…ワ
イヤーカツトクランプ、６…固定板、７…アーム
駆動部、８…アーム支点、９…ボンデイングアー
ム、１０…キヤピラリー、１１…クランプ支点。
ｂは第１図ａのＡ―Ａ′線断面図、第２図ａは本
考案の実施例２の側面図、第２図ｂは第２図ａの
Ｂ―Ｂ′線断面図、第３図は従来例の側面図であ
る。 １…クランプホルダ、２…レール、２′…蝶番
、３…ロツクピン、４…クランプコイル、５…ワ
イヤーカツトクランプ、６…固定板、７…アーム
駆動部、８…アーム支点、９…ボンデイングアー
ム、１０…キヤピラリー、１１…クランプ支点。
Claims (1)
- 半導体集積回路を組立てるワイヤーボンデイン
グ装置において、キヤピラリーの真上位置にワイ
ヤーカツトクランプ部を有し、該ワイヤーカツト
クランプ部をキヤピラリーに対して進退動可能に
配設し、該ワイヤーカツトクランプ部をボンデイ
ングヘツド部にロツクピンにより脱着可能に装着
したことを特徴とするワイヤーボンデイング装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171678U JPH0176042U (ja) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171678U JPH0176042U (ja) | 1987-11-10 | 1987-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176042U true JPH0176042U (ja) | 1989-05-23 |
Family
ID=31463693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171678U Pending JPH0176042U (ja) | 1987-11-10 | 1987-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176042U (ja) |
-
1987
- 1987-11-10 JP JP1987171678U patent/JPH0176042U/ja active Pending