JPH0180259U - - Google Patents
Info
- Publication number
- JPH0180259U JPH0180259U JP1987170474U JP17047487U JPH0180259U JP H0180259 U JPH0180259 U JP H0180259U JP 1987170474 U JP1987170474 U JP 1987170474U JP 17047487 U JP17047487 U JP 17047487U JP H0180259 U JPH0180259 U JP H0180259U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solder
- automatic soldering
- circuit elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第２図は本考案の実施例を示し、第
１図は、本考案要部縦断側面図、第２図ａは、要
部部品の斜視図、第２図ｂ、第２図ｃ、第２図ｄ
は、それぞれ第２図ａとは異なる構成例を示す縦
断側面図、第３図は、従来例の部分縦断側面図、
第４図は、同上における部品の斜視図、第５図は
、不良状態を示すプリント基板の部分側面図であ
る。
２……湧出路、２′……湧出口、３……半田付
部、４……段部。
Figures 1 and 2 show an embodiment of the present invention, in which Figure 1 is a longitudinal cross-sectional side view of the main parts of the invention, Figure 2a is a perspective view of the main parts, Figure 2b, Figure 2 c, Figure 2 d
2A is a longitudinal side view showing a configuration example different from that in FIG. 2a, FIG. 3 is a partial longitudinal side view of a conventional example,
FIG. 4 is a perspective view of the same components as above, and FIG. 5 is a partial side view of the printed circuit board showing a defective state. 2... Gushing path, 2'... Gushing outlet, 3... Soldering part, 4... Stepped part.
Claims (1)
移送せしめ、その途中で該プリント基板に回路素
子を半田付けするようにした自動半田付装置にお
いて、該プリント基板に向かつて湧出する溶融半
田の湧出口部に該プリント基板の送出側に対応し
て、半田の流動速度を抑制する低い段部を設け、
半田が該段部を溢流して循環するようにしたこと
を特徴とする自動半田付装置における半田湧出部
の構造。 In an automatic soldering device that transports a printed circuit board on which circuit elements are temporarily installed in a certain direction and solders the circuit elements to the printed circuit board along the way, an outlet portion of molten solder that flows out toward the printed circuit board. A low stepped portion is provided corresponding to the delivery side of the printed circuit board to suppress the flow speed of the solder,
A structure of a solder gushing part in an automatic soldering apparatus, characterized in that solder overflows and circulates through the stepped part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170474U JPH0227971Y2 (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170474U JPH0227971Y2 (en) | 1987-11-06 | 1987-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0180259U true JPH0180259U (en) | 1989-05-30 |
| JPH0227971Y2 JPH0227971Y2 (en) | 1990-07-27 |
Family
ID=31461453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170474U Expired JPH0227971Y2 (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227971Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61185560U (en) * | 1985-05-10 | 1986-11-19 |
-
1987
- 1987-11-06 JP JP1987170474U patent/JPH0227971Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61185560U (en) * | 1985-05-10 | 1986-11-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0227971Y2 (en) | 1990-07-27 |
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