JPH0180267U - - Google Patents
Info
- Publication number
- JPH0180267U JPH0180267U JP17150787U JP17150787U JPH0180267U JP H0180267 U JPH0180267 U JP H0180267U JP 17150787 U JP17150787 U JP 17150787U JP 17150787 U JP17150787 U JP 17150787U JP H0180267 U JPH0180267 U JP H0180267U
- Authority
- JP
- Japan
- Prior art keywords
- steam
- bath
- vapor phase
- outlet
- steam bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 239000012808 vapor phase Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第３図は本考案の第１の実施例を
示し、第１図は片面吹付け型の気相式半田付け装
置の要部断面図、第２図は第１図中に示す蒸気整
流板の平面図、第３図は実施例の変形例に係る蒸
気整流板の平面図、第４図及び第５図は本考案の
第２の実施例を示し、第４図は両面吹付け型の気
相式半田付け装置の全体構成を示す断面図、第５
図は第４図中に示す蒸気整流板の平面図、第６図
ないし第８図は従来技術を示し、第６図は片面吹
付け型の気相式半田付け装置の全体構成を示す断
面図、第７図は両面吹付け型の気相式半田付け装
置の全体構成を示す断面図、第８図は第７図中の
―矢示方向断面図である。
１……基板、２……部品、３，２１……蒸気浴
槽、９，２４……蒸気吹出し口、１１，２８……
蒸気発生装置、３１，３１′，４１′……蒸気整
流板、３１Ａ，３１′Ａ，４１Ａ……蒸気流通孔
、Ａ……蒸気。
1 to 3 show a first embodiment of the present invention, FIG. 1 is a sectional view of a main part of a single-sided spraying type vapor phase soldering device, and FIG. 2 is shown in FIG. 1. FIG. 3 is a plan view of a steam rectifying plate according to a modification of the embodiment, FIGS. 4 and 5 show a second embodiment of the present invention, and FIG. 4 is a double-sided blower Fifth sectional view showing the overall configuration of a soldering type vapor phase soldering device
The figure is a plan view of the steam rectifying plate shown in Fig. 4, Figs. 6 to 8 show the prior art, and Fig. 6 is a sectional view showing the overall configuration of a single-sided spraying type vapor phase soldering device. , FIG. 7 is a cross-sectional view showing the overall structure of a double-sided spraying type vapor phase soldering apparatus, and FIG. 8 is a cross-sectional view in the direction indicated by the - arrow in FIG. 7. 1... Board, 2... Parts, 3, 21... Steam bathtub, 9, 24... Steam outlet, 11, 28...
Steam generator, 31, 31', 41'...Steam rectifying plate, 31A, 31'A, 41A...Steam communication hole, A...Steam.
Claims (1)
ペーストを付着させた基板が搬入される蒸気浴槽
と、該蒸気浴槽内に搬入された前記基板に蒸気を
吹出すために、該蒸気浴槽に設けられた蒸気吹出
し口と、該蒸気吹出し口に前記半田ペーストを溶
融する蒸気を供給する蒸気発生装置とからなる気
相式半田付け装置において、前記蒸気浴槽内には
多数の蒸気流通孔を穿設した蒸気整流部材を前記
基板と蒸気吹出し口との間に位置して配設したこ
とを特徴とする気相式半田付け装置。 A steam bath into which a board loaded with parts to be soldered and with solder paste adhered to the joining position is carried in, and a steam bath provided in the steam bath to blow out steam to the board carried into the steam bath. In a vapor phase soldering apparatus comprising a steam outlet and a steam generator that supplies steam for melting the solder paste to the steam outlet, a large number of steam flow holes are bored in the steam bath. A vapor phase soldering apparatus, characterized in that a steam rectifying member is disposed between the substrate and the steam outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17150787U JPH049084Y2 (en) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17150787U JPH049084Y2 (en) | 1987-11-10 | 1987-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0180267U true JPH0180267U (en) | 1989-05-30 |
| JPH049084Y2 JPH049084Y2 (en) | 1992-03-06 |
Family
ID=31463400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17150787U Expired JPH049084Y2 (en) | 1987-11-10 | 1987-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH049084Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021154334A (en) * | 2020-03-26 | 2021-10-07 | パナソニックＩｐマネジメント株式会社 | Gas phase heating method and vapor phase heating device |
-
1987
- 1987-11-10 JP JP17150787U patent/JPH049084Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021154334A (en) * | 2020-03-26 | 2021-10-07 | パナソニックＩｐマネジメント株式会社 | Gas phase heating method and vapor phase heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH049084Y2 (en) | 1992-03-06 |
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