JPH0180978U - - Google Patents
Info
- Publication number
- JPH0180978U JPH0180978U JP1987176696U JP17669687U JPH0180978U JP H0180978 U JPH0180978 U JP H0180978U JP 1987176696 U JP1987176696 U JP 1987176696U JP 17669687 U JP17669687 U JP 17669687U JP H0180978 U JPH0180978 U JP H0180978U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component
- base material
- hole
- watu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Toys (AREA)
- Adornments (AREA)
Description
第１図ａは本考案の一実施例の斜視図、第１図
ｂは第１図ａの設計用ワツペンを用いた作業の説
明図、第２図ａは従来の設計用ワツペンの斜視図
、ｂは断面図である。
１，２０……設計用ワツペン、２……ベース基
材、３……シート状磁石、４……孔、１０……ス
チール机、１１……設計用紙、１２……基板外形
、１３……ランドパターン、２１……剥離紙、２
２……円形パターン、２３……外形パターン、２
４……突出部、２５……接着剤。
Fig. 1a is a perspective view of an embodiment of the present invention, Fig. 1b is an explanatory diagram of work using the design emblem shown in Fig. 1a, and Fig. 2a is a perspective view of a conventional design emblem. b is a cross-sectional view. 1, 20... Design badge, 2... Base material, 3... Sheet magnet, 4... Hole, 10... Steel desk, 11... Design paper, 12... Board outline, 13... Land Pattern, 21...Release paper, 2
2...Circular pattern, 23...Outline pattern, 2
4... Protrusion, 25... Adhesive.
Claims (1)
を有し、電子部品の上面からの透視外形と同一外
形で形成されたベース基材およびシート状磁石を
互いに接着したことを特徴とする印刷配線板設計
用ワツペン。 Printing characterized by bonding together a base material and a sheet-shaped magnet, each having a hole at the same position as the mounting position of the component leg of the electronic component and having the same external shape as seen from the top surface of the electronic component. Watu pen for wiring board design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176696U JPH0180978U (en) | 1987-11-19 | 1987-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176696U JPH0180978U (en) | 1987-11-19 | 1987-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180978U true JPH0180978U (en) | 1989-05-30 |
Family
ID=31468410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176696U Pending JPH0180978U (en) | 1987-11-19 | 1987-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180978U (en) |
-
1987
- 1987-11-19 JP JP1987176696U patent/JPH0180978U/ja active Pending
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