JPS6181175U - - Google Patents
Info
- Publication number
- JPS6181175U JPS6181175U JP16653684U JP16653684U JPS6181175U JP S6181175 U JPS6181175 U JP S6181175U JP 16653684 U JP16653684 U JP 16653684U JP 16653684 U JP16653684 U JP 16653684U JP S6181175 U JPS6181175 U JP S6181175U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pen
- external shape
- adhered
- antistatic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂは本考案の一実施例の設計用ワツ
ペンの斜視図および側断面図、第２図は第１図ａ
，ｂの設計用ワツペンを用いた作業フローを示す
図、第３図ａ，ｂは従来の設計用ワツペンの斜視
図および側断面図である。１……半透明シート、
１ａ，１１ａ……粗化面、２……部品外形形状、
３……円形形状、４……接着層、５，１５……剥
離紙、６，１６，２６……設計用ワツペン、２６
ａ……設計用ワツペンの隅角部、７……（部品外
形形状、円形形状の）部品用紙、８……基板外形
、１１……帯電防止剤付きの半透明シート。
Figures 1a and b are perspective views and side sectional views of a design badge according to an embodiment of the present invention, and Figure 2 is Figure 1a.
, b is a diagram showing a work flow using a design emblem pen, and FIGS. 3a and 3b are a perspective view and a side sectional view of a conventional design emblem pen. 1...Semi-transparent sheet,
1a, 11a... Roughened surface, 2... Part external shape,
3... Circular shape, 4... Adhesive layer, 5, 15... Release paper, 6, 16, 26... Design watz pen, 26
a...Corner part of design watz pen, 7... (part external shape, circular shape) component paper, 8... board external shape, 11... translucent sheet with antistatic agent.
Claims (1)
状および電子部品リード脚部の取付け位置を示す
外形枠パターンを有し、かつ裏面に接着材と剥離
紙とを付着させた半透明シートからなる印刷配線
板設計用ワツペン。 It consists of a translucent sheet with an antistatic agent adhered to its surface, an outline frame pattern indicating the external shape of the electronic component and the mounting position of the electronic component lead legs, and an adhesive and release paper adhered to the back side. Watu pen for printed wiring board design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16653684U JPH027477Y2 (en) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16653684U JPH027477Y2 (en) | 1984-11-02 | 1984-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6181175U true JPS6181175U (en) | 1986-05-29 |
| JPH027477Y2 JPH027477Y2 (en) | 1990-02-22 |
Family
ID=30724345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16653684U Expired JPH027477Y2 (en) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027477Y2 (en) |
-
1984
- 1984-11-02 JP JP16653684U patent/JPH027477Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH027477Y2 (en) | 1990-02-22 |
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