JPH0180980U

JPH0180980U -

Info

Publication number: JPH0180980U
Application number: JP1987176434U
Authority: JP
Priority date: 1987-11-20
Filing date: 1987-11-20
Publication date: 1989-05-30

Description

[Brief explanation of drawings]

第１図は本考案の第１の実施例を示す斜視図、
第２図はその縦断面図、第３図ａ〜ｄは本実施例
構造を適用した二層ＦＰＣの製造手順を説明する
説明図、第４図はＦＰＣ積層体をプレスするホツ
トプレス装置の概要図、第５図ａはハンダペース
ト印刷装置の概要図、第５図ｂはハンダリフロー
処理装置である赤外線加熱装置の概要図、第６図
は本考案の第２の実施例の縦断面図、第７図ａお
よび第８図ａは従来の二層ＦＰＣのランド部のハ
ンダ接合状態を示す斜視図、第７図ｂおよび第８
図ｂは第７図ａ、第８図ａの縦断面図である。１０，２０……ＦＰＣ、１２，２２……絶縁性
ベース、１４，２４……回路パターン、１７，２
７……ランド部、１７ａ……突出ランド部上端面
、２６……オーバーレイフイルム、２６ａ……オ
ーバーレイフイルムの円形開口部、２７ａ……ラ
ンド部の貫通孔との境界線、２８……貫通孔、２
９……ハンダ部、３０……接着剤シート。 FIG. 1 is a perspective view showing a first embodiment of the present invention;
FIG. 2 is a longitudinal cross-sectional view thereof, FIGS. 3 a to d are explanatory diagrams explaining the manufacturing procedure of a two-layer FPC to which the structure of this embodiment is applied, and FIG. 4 is a schematic diagram of a hot press device for pressing an FPC laminate. , FIG. 5a is a schematic diagram of a solder paste printing device, FIG. 5b is a schematic diagram of an infrared heating device which is a solder reflow processing device, and FIG. 6 is a vertical sectional view of a second embodiment of the present invention. 7a and 8a are perspective views showing the solder joint state of the land portion of a conventional two-layer FPC, and FIGS. 7b and 8
Figure b is a longitudinal sectional view of Figures 7a and 8a. 10,20...FPC, 12,22...Insulating base, 14,24...Circuit pattern, 17,2
7... Land portion, 17a... Upper end surface of protruding land portion, 26... Overlay film, 26a... Circular opening of overlay film, 27a... Boundary line of land portion with through hole, 28... Through hole, 2
9...Solder part, 30...Adhesive sheet.

Claims

[Scope of utility model registration request]

The two flexible printed wiring boards are bonded and laminated together such that the through hole formed in the land part of one flexible printed wiring board is located in the land part of the other flexible printed wiring board,
A part of the land portion of the other flexible wiring board protrudes into the through hole, and the land portion area projected into the through hole and the land portion of the first flexible wiring board are soldered together. The land connection structure of a two-layer flexible printed wiring board.