JPH02125366U - - Google Patents
Info
- Publication number
- JPH02125366U JPH02125366U JP3291789U JP3291789U JPH02125366U JP H02125366 U JPH02125366 U JP H02125366U JP 3291789 U JP3291789 U JP 3291789U JP 3291789 U JP3291789 U JP 3291789U JP H02125366 U JPH02125366 U JP H02125366U
- Authority
- JP
- Japan
- Prior art keywords
- patterns
- connection pattern
- connection
- multilayer printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案による多層プリント基板の加圧
、加熱前の断面図、第２図は本考案による多層プ
リント基板の加圧、加熱後の断面図、第３図ａ〜
ｃは接続パターンの実施例図、第４図は従来の多
層プリント基板の加圧、加熱前の断面図、第５図
は従来の多層プリント基板の加圧、加熱後の断面
図である。
１……基板、２……配線パターン、３……接続
パターン、４……半田バンプ、５……接着層。
Fig. 1 is a cross-sectional view of the multilayer printed circuit board according to the present invention before pressurization and heating, Fig. 2 is a cross-sectional view of the multilayer printed circuit board according to the present invention after pressurization and heating, and Fig. 3 a -
FIG. 4 is a sectional view of a conventional multilayer printed circuit board before being pressed and heated, and FIG. 5 is a sectional view of a conventional multilayer printed circuit board after being pressed and heated. 1... Board, 2... Wiring pattern, 3... Connection pattern, 4... Solder bump, 5... Adhesive layer.
Claims (1)
して貼りあわせ、各基板の回路パターンを接続パ
ターンにより接続した多層プリント基板において
、前記接続パターンの一方に凹部を設けたことを
特徴とする多層プリント基板の接続パターン構造
。 A multilayer printed board in which a plurality of boards having wiring patterns are bonded together via an adhesive layer and the circuit patterns of each board are connected by a connection pattern, characterized in that a recess is provided in one of the connection patterns. connection pattern structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3291789U JPH02125366U (en) | 1989-03-23 | 1989-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3291789U JPH02125366U (en) | 1989-03-23 | 1989-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125366U true JPH02125366U (en) | 1990-10-16 |
Family
ID=31536190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3291789U Pending JPH02125366U (en) | 1989-03-23 | 1989-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125366U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815296A (en) * | 1981-07-20 | 1983-01-28 | 松下電器産業株式会社 | Printed circuit board |
-
1989
- 1989-03-23 JP JP3291789U patent/JPH02125366U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815296A (en) * | 1981-07-20 | 1983-01-28 | 松下電器産業株式会社 | Printed circuit board |
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