JPH0180992U - - Google Patents
Info
- Publication number
- JPH0180992U JPH0180992U JP1987176785U JP17678587U JPH0180992U JP H0180992 U JPH0180992 U JP H0180992U JP 1987176785 U JP1987176785 U JP 1987176785U JP 17678587 U JP17678587 U JP 17678587U JP H0180992 U JPH0180992 U JP H0180992U
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- circuit board
- printed circuit
- shield case
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案のシールドケースの斜視図、第
２図はそれを半田デイツプする方法を説明するた
めの図、第３図は本考案のシールドケースの使用
例を示す図、第４図は従来のシールドケースを半
田デイツプする方法を説明するための図、第５図
は従来の欠点を説明するための図である。
７……金属枠体、８……プリント基板、８ａ…
…半田付け面、１１……長孔。
Figure 1 is a perspective view of the shield case of the present invention, Figure 2 is a diagram for explaining the method of soldering it, Figure 3 is a diagram showing an example of use of the shield case of the present invention, and Figure 4 is a diagram for explaining the method of soldering it. FIG. 5 is a diagram for explaining the conventional method of soldering a shield case, and FIG. 5 is a diagram for explaining the drawbacks of the conventional method. 7...Metal frame body, 8...Printed circuit board, 8a...
...Soldering surface, 11...Long hole.
Claims (1)
前記プリント基板の半田付け面に形成された接地
パターンと前記金属枠体の内壁面とを半田付けす
るようにしたシールドケースであつて、前記プリ
ント基板の半田付け面と前記金属枠体の下側開口
端面との間に対応する金属枠体の各壁面部分に長
孔を設けたシールドケース。 The printed circuit board is stored and installed inside the metal frame,
A shield case in which a ground pattern formed on a soldering surface of the printed circuit board and an inner wall surface of the metal frame are soldered to each other, the lower side of the soldering surface of the printed circuit board and the metal frame. A shield case with long holes in each wall of the metal frame corresponding to the opening end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176785U JPH0180992U (en) | 1987-11-19 | 1987-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176785U JPH0180992U (en) | 1987-11-19 | 1987-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180992U true JPH0180992U (en) | 1989-05-30 |
Family
ID=31468488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176785U Pending JPH0180992U (en) | 1987-11-19 | 1987-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180992U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292992A (en) * | 1985-06-20 | 1986-12-23 | 東芝エー・ブイ・イー株式会社 | Soldering of printed wiring board with wall member |
-
1987
- 1987-11-19 JP JP1987176785U patent/JPH0180992U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292992A (en) * | 1985-06-20 | 1986-12-23 | 東芝エー・ブイ・イー株式会社 | Soldering of printed wiring board with wall member |