JPH0183330U - - Google Patents
Info
- Publication number
- JPH0183330U JPH0183330U JP1987177620U JP17762087U JPH0183330U JP H0183330 U JPH0183330 U JP H0183330U JP 1987177620 U JP1987177620 U JP 1987177620U JP 17762087 U JP17762087 U JP 17762087U JP H0183330 U JPH0183330 U JP H0183330U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist
- lift
- adhesion layer
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Description
第１図は、本考案に係るリフトオフ装置の側断
面概略図、第２図ａ，ｂ，ｃは、基板上に被着層
をパターン形成する過程を説明する側断面概略図
、第３図ａ，ｂは、従来例を示す概略図である。
１…リフトオフ装置、２…基板、３…支持台、
４…超音波振動子、７…レジスト、８，９…被着
層、１０…レジスト溶解液。
FIG. 1 is a schematic side cross-sectional view of a lift-off device according to the present invention, FIGS. 2 a, b, and c are schematic side cross-sectional views illustrating the process of patterning an adhesion layer on a substrate, and FIG. 3 a , b are schematic diagrams showing a conventional example. 1...Lift-off device, 2...Substrate, 3...Support stand,
4... Ultrasonic transducer, 7... Resist, 8, 9... Adhesive layer, 10... Resist solution.
Claims (1)
させた基板に対し、レジスト溶解液を用いて前記
レジストを除去することにより該レジスト上の被
着層を除去して、前記基板上の被着層をパターン
形成するリフトオフ装置において、 前記基板を略水平な状態で載置させる支持台に
、前記基板に振動を与える手段を固設して成るこ
とを特徴とするリフトオフ装置。 (2) 前記振動を与える手段として、超音波振動
子を用いることを特徴とする実用新案登録請求の
範囲第１項記載のリフトオフ装置。[Claims for Utility Model Registration] (1) For a substrate on which a resist is patterned and an adhesion layer is adhered, the adhesion layer on the resist is removed by removing the resist using a resist solution. A lift-off device for removing and forming a pattern on the adhered layer on the substrate, characterized in that means for applying vibration to the substrate is fixed to a support base on which the substrate is placed in a substantially horizontal state. lift-off device. (2) The lift-off device according to claim 1, wherein an ultrasonic vibrator is used as the means for applying the vibration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177620U JPH0183330U (en) | 1987-11-24 | 1987-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987177620U JPH0183330U (en) | 1987-11-24 | 1987-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183330U true JPH0183330U (en) | 1989-06-02 |
Family
ID=31469279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987177620U Pending JPH0183330U (en) | 1987-11-24 | 1987-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183330U (en) |
-
1987
- 1987-11-24 JP JP1987177620U patent/JPH0183330U/ja active Pending