JPH0183332U - - Google Patents

Info

Publication number: JPH0183332U
Authority: JP; Japan
Prior art keywords: magnetoresistive element; chip; smooth; substrate; adhesive
Prior art date: 1987-11-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1987179206U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-11-24

Filing date

1987-11-24

Publication date

1989-06-02

1987-11-24 Application filed filed Critical

1987-11-24 Priority to JP1987179206U priority Critical patent/JPH0183332U/ja

1989-06-02 Publication of JPH0183332U publication Critical patent/JPH0183332U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Die Bonding (AREA)

JP1987179206U 1987-11-24 1987-11-24 Pending JPH0183332U (2)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1987179206U JPH0183332U (2)	1987-11-24	1987-11-24

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1987179206U JPH0183332U (2)	1987-11-24	1987-11-24

Publications (1)

Publication Number	Publication Date
JPH0183332U true JPH0183332U (2)	1989-06-02

Family

ID=31470771

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1987179206U Pending JPH0183332U (2)	1987-11-24	1987-11-24

Country Status (1)

Country	Link
JP (1)	JPH0183332U (2)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5984532A (ja) *	1982-11-08	1984-05-16	Hitachi Ltd	半導体装置の製造方法および半導体ウエ−ハ
JPS6132435A (ja) *	1984-07-24	1986-02-15	Nec Corp	半導体素子の取り付け方法
JPS61216371A (ja) *	1985-03-20	1986-09-26	Nec Corp	モ−ルド形磁気抵抗素子

1987
- 1987-11-24 JP JP1987179206U patent/JPH0183332U/ja active Pending

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5984532A (ja) *	1982-11-08	1984-05-16	Hitachi Ltd	半導体装置の製造方法および半導体ウエ−ハ
JPS6132435A (ja) *	1984-07-24	1986-02-15	Nec Corp	半導体素子の取り付け方法
JPS61216371A (ja) *	1985-03-20	1986-09-26	Nec Corp	モ−ルド形磁気抵抗素子

Publication	Publication Date	Title
JPS62154644U (2)	1987-10-01
JPS6194352U (2)	1986-06-18
JPH0369232U (2)	1991-07-09
JPS6348170U (2)	1988-04-01
JPS61182036U (2)	1986-11-13
JPS6397241U (2)	1988-06-23
JPS62201957U (2)	1987-12-23
JPH0165142U (2)	1989-04-26
JPH024235U (2)	1990-01-11
JPH0321856U (2)	1991-03-05
JPS63142855U (2)	1988-09-20
JPS63142843U (2)	1988-09-20
JPH0273740U (2)	1990-06-05
JPS6249395U (2)	1987-03-26
JPS6435756U (2)	1989-03-03
JPH02146437U (2)	1990-12-12
JPH02103284U (2)	1990-08-16
JPS59127246U (ja)	1984-08-27	樹脂封止型半導体装置
JPH0328757U (2)	1991-03-22
JPS63119258U (2)	1988-08-02
JPS63119247U (2)	1988-08-02
JPS63157944U (2)	1988-10-17
JPS6188256U (2)	1986-06-09
JPS61203549U (2)	1986-12-22
JPH0187550U (2)	1989-06-09