JPH0183384U - - Google Patents
Info
- Publication number
- JPH0183384U JPH0183384U JP1987179863U JP17986387U JPH0183384U JP H0183384 U JPH0183384 U JP H0183384U JP 1987179863 U JP1987179863 U JP 1987179863U JP 17986387 U JP17986387 U JP 17986387U JP H0183384 U JPH0183384 U JP H0183384U
- Authority
- JP
- Japan
- Prior art keywords
- circuit section
- control circuit
- output circuit
- section
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図ａは本発明の実施例の断面図、第１図ｂ
は同上のボデイの上面図、第２図は従来例の断面
図である。
１…ボデイ、９…チツプ、１０…シリコン樹脂
、１３ａ，１３ｂ…収納部、１５…金属プリント
基板、Ａ…出力回路部、Ｂ…制御回路部である。
FIG. 1a is a sectional view of an embodiment of the present invention, FIG. 1b
2 is a top view of the same body as above, and FIG. 2 is a sectional view of the conventional example. DESCRIPTION OF SYMBOLS 1...Body, 9...Chip, 10...Silicon resin, 13a, 13b...Storage part, 15...Metal printed circuit board, A...Output circuit part, B...Control circuit part.
Claims (1)
回路部とを各別に収納する収納部を形成し、出力
回路部を収納した収納部には出力回路部のパワー
素子のチツプが少なくとも隠れる程度のチツプ保
護用樹脂を充填し、制御回路部と、出力回路部と
はボデイの外底部に配設した回路基板を介して電
気的に接続して成るソリツドステートリレーの構
造。 The inside of the body is partitioned with an insulating wall to form a housing section that stores the output circuit section and the control circuit section separately. This is a solid-state relay structure that is filled with chip-protecting resin and electrically connected to the control circuit section and output circuit section via a circuit board placed on the outer bottom of the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179863U JPH0183384U (en) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179863U JPH0183384U (en) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183384U true JPH0183384U (en) | 1989-06-02 |
Family
ID=31471404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987179863U Pending JPH0183384U (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183384U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091767A (en) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | Semiconductor element |
-
1987
- 1987-11-26 JP JP1987179863U patent/JPH0183384U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000091767A (en) * | 1998-09-10 | 2000-03-31 | Toshiba Corp | Semiconductor element |