JPH0184441U - - Google Patents
Info
- Publication number
- JPH0184441U JPH0184441U JP1987180481U JP18048187U JPH0184441U JP H0184441 U JPH0184441 U JP H0184441U JP 1987180481 U JP1987180481 U JP 1987180481U JP 18048187 U JP18048187 U JP 18048187U JP H0184441 U JPH0184441 U JP H0184441U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- lower lead
- slug
- semiconductor device
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 241000237858 Gastropoda Species 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案に係る封着治具の断面図、第
２図は、ＤＨＤダイオードの断面図、第３図乃至
第５図は、従来の封着治具によるＤＨＤダイオー
ドの製造工程図、第６図は、従来の封着治具によ
る問題点を示した断面図である。
１……ＤＨＤ型ダイオード（半導体装置）、２
……上リード、３……下リード、４……上スラグ
部、５……下スラグ部、６……半導体ペレツト、
７……ガラススリーブ、８……封着治具、９……
上治具、１０……下治具、９ａ……挿入孔、１０
ａ……挿入孔、１１……シヤツター、１２……上
磁石、１３……下磁石、１４……平行磁界。
FIG. 1 is a sectional view of a sealing jig according to the present invention, FIG. 2 is a sectional view of a DHD diode, and FIGS. 3 to 5 are manufacturing process diagrams of a DHD diode using a conventional sealing jig. , FIG. 6 is a sectional view showing problems caused by the conventional sealing jig. 1...DHD type diode (semiconductor device), 2
...Top lead, 3...Bottom lead, 4...Top slug part, 5...Bottom slug part, 6...Semiconductor pellet,
7...Glass sleeve, 8...Sealing jig, 9...
Upper jig, 10...Lower jig, 9a...Insertion hole, 10
a...Insertion hole, 11...Shutter, 12...Upper magnet, 13...Lower magnet, 14...Parallel magnetic field.
Claims (1)
に設けたスラグ部間に半導体ペレツトを挟持し、
スラグ部の外周面とガラススリーブの内周面とを
封着する半導体装置の封着治具において、 下リードを、そのスラグ部を支承して吊架する
下治具と、 上リードを下リードの上方同軸位置にスラグ部
を下に保持する上治具と、 上下治具の外側に配置し、上記同軸方向に平行
磁界を形成する一対の磁石とを具備したことを特
徴とする半導体装置の封着治具。[Claim for Utility Model Registration] Semiconductor pellets are sandwiched between slugs provided at opposite ends of upper and lower leads within a glass sleeve,
A semiconductor device sealing jig that seals the outer peripheral surface of a slug part and the inner peripheral surface of a glass sleeve includes a lower jig that suspends the lower lead by supporting the slug part, and a lower lead that supports the lower lead and the lower lead. A semiconductor device comprising: an upper jig for holding a slug portion downwardly in an upper coaxial position; and a pair of magnets disposed outside the upper and lower jigs to form a parallel magnetic field in the coaxial direction. Sealing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18048187U JPH0410691Y2 (en) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18048187U JPH0410691Y2 (en) | 1987-11-26 | 1987-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0184441U true JPH0184441U (en) | 1989-06-05 |
| JPH0410691Y2 JPH0410691Y2 (en) | 1992-03-17 |
Family
ID=31471999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18048187U Expired JPH0410691Y2 (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410691Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022123871A1 (en) * | 2020-12-11 | 2022-06-16 | 公立大学法人富山県立大学 | Pin transfer device, pin transfer method, and processing device |
-
1987
- 1987-11-26 JP JP18048187U patent/JPH0410691Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022123871A1 (en) * | 2020-12-11 | 2022-06-16 | 公立大学法人富山県立大学 | Pin transfer device, pin transfer method, and processing device |
| JP2022093203A (en) * | 2020-12-11 | 2022-06-23 | 公立大学法人 富山県立大学 | Pin transfer device, pin transfer method, and processing device |
| TWI788051B (en) * | 2020-12-11 | 2022-12-21 | 公立大學法人富山縣立大學 | Pin transfer device, pin transfer method, and processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410691Y2 (en) | 1992-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0184441U (en) | ||
| JPS60160539U (en) | Container for storing semiconductor wafers, etc. | |
| JPH0390448U (en) | ||
| JPS5844848U (en) | Semiconductor wafer fixing jig | |
| JPS5868031U (en) | Weight of diode assembly sealing jig | |
| JPS6349234U (en) | ||
| JPS58138403U (en) | Isolator | |
| JPS58119962U (en) | Soldering jig | |
| JPS6318832U (en) | ||
| JPS6365224U (en) | ||
| JPS5844842U (en) | semiconductor equipment | |
| JPS6268403U (en) | ||
| JPS6226032U (en) | ||
| JPS5983036U (en) | Pellet mount structure | |
| JPS63185208U (en) | ||
| JPS5818341U (en) | Semiconductor wafer holder | |
| JPS60108612U (en) | Seal device between upper and lower frames | |
| JPS6124861U (en) | floppy disk device | |
| JPS6355549U (en) | ||
| JPS5939937U (en) | Semiconductor wafer support stand | |
| JPH01116456U (en) | ||
| JPS59173342U (en) | Semiconductor element storage container | |
| JPS589077U (en) | Rotor structure for electronic watches | |
| JPS60134779U (en) | Goldfish carrier bag | |
| JPS59157387U (en) | Magnetically shielded speaker |