JPH0184488U - - Google Patents

Info

Publication number
JPH0184488U
JPH0184488U JP1987179751U JP17975187U JPH0184488U JP H0184488 U JPH0184488 U JP H0184488U JP 1987179751 U JP1987179751 U JP 1987179751U JP 17975187 U JP17975187 U JP 17975187U JP H0184488 U JPH0184488 U JP H0184488U
Authority
JP
Japan
Prior art keywords
shield
mounting plate
attached
heat dissipation
shield housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987179751U
Other languages
Japanese (ja)
Other versions
JPH0528796Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987179751U priority Critical patent/JPH0528796Y2/ja
Publication of JPH0184488U publication Critical patent/JPH0184488U/ja
Application granted granted Critical
Publication of JPH0528796Y2 publication Critical patent/JPH0528796Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す通信機器の放
熱構造の一部横断面平面図、第２図は第１図に示
す放熱構造の―線断面図、第３図は第１図に
示す放熱構造の要部分解斜視図、第４図は第１図
に示す通信機器の放熱構造の外観斜視図、第５図
は従来の通信機器の放熱構造を示す断面図である
。 図において、１１は高周波モジユール、１２は
モジユール取付板、１３はシールド筐体、１６は
シールドリング、１７は開口、１８は放熱フイン
、１９は熱伝導体としての熱伝導ブロツク、２２
は放熱フインとシールド筐体との間のシールドリ
ングをそれぞれ示す。 Fig. 1 is a partial cross-sectional plan view of a heat dissipation structure for communication equipment showing an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along the line - -, of the heat dissipation structure shown in Fig. 1, and Fig. 3 is the same as Fig. 1. FIG. 4 is an external perspective view of the heat dissipation structure of the communication device shown in FIG. 1, and FIG. 5 is a sectional view showing the heat dissipation structure of the conventional communication device. In the figure, 11 is a high frequency module, 12 is a module mounting plate, 13 is a shield housing, 16 is a shield ring, 17 is an opening, 18 is a heat dissipation fin, 19 is a heat conduction block as a heat conductor, 22
1 and 2 respectively show the shield ring between the heat dissipation fin and the shield casing.

Claims (1)

【実用新案登録請求の範囲】 密閉形シールド筐体１３内にシールドリング１
６を介して取り付けたモジユール取付板１２上に
高周波モジユール１１を実装した通信機器におい
て、 シールド筐体１３の外側に設けられる放熱フイ
ン１８に熱伝導体１９を取り付け、 熱伝導体１９をシールド筐体１３に形成した開
口１７からシールド筐体１３の内部に挿入して高
周波モジユール１１に接触又は近接するようにモ
ジユール取付板１２上に取り付け、 シールド筐体１３と放熱フイン１８との間に開
口１７に沿つて延びるシールドリング２２を設け
たことを特徴とする通信機器の放熱構造。[Scope of claim for utility model registration] Shield ring 1 inside sealed shield casing 13
In a communication device in which a high frequency module 11 is mounted on a module mounting plate 12 attached through a module mounting plate 6, a heat conductor 19 is attached to a heat dissipation fin 18 provided on the outside of a shield housing 13, and the heat conductor 19 is attached to the shield housing. It is inserted into the inside of the shield housing 13 through the opening 17 formed in the shield housing 13 and installed on the module mounting plate 12 so as to contact or be close to the high frequency module 11. A heat dissipation structure for a communication device, characterized in that a shield ring 22 is provided that extends along the side.
JP1987179751U 1987-11-27 1987-11-27 Expired - Lifetime JPH0528796Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987179751U JPH0528796Y2 (en) 1987-11-27 1987-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987179751U JPH0528796Y2 (en) 1987-11-27 1987-11-27

Publications (2)

Publication Number Publication Date
JPH0184488U true JPH0184488U (en) 1989-06-05
JPH0528796Y2 JPH0528796Y2 (en) 1993-07-23

Family

ID=31471296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987179751U Expired - Lifetime JPH0528796Y2 (en) 1987-11-27 1987-11-27

Country Status (1)

Country Link
JP (1) JPH0528796Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017123A (en) * 2015-06-30 2017-01-19 Ｎｅｃプラットフォームズ株式会社 Housing structure and electronic equipment using the same
JP2024505271A (en) * 2021-03-10 2024-02-05 サングロー パワー サプライ カンパニー リミテッド electrical equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110688U (en) * 1980-01-14 1981-08-27
JPS5846456U (en) * 1981-09-22 1983-03-29 ソニー株式会社 Mounting structure of heat sink
JPS62199098A (en) * 1986-02-27 1987-09-02 松下電器産業株式会社 Shielding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56110688U (en) * 1980-01-14 1981-08-27
JPS5846456U (en) * 1981-09-22 1983-03-29 ソニー株式会社 Mounting structure of heat sink
JPS62199098A (en) * 1986-02-27 1987-09-02 松下電器産業株式会社 Shielding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017123A (en) * 2015-06-30 2017-01-19 Ｎｅｃプラットフォームズ株式会社 Housing structure and electronic equipment using the same
JP2024505271A (en) * 2021-03-10 2024-02-05 サングロー パワー サプライ カンパニー リミテッド electrical equipment

Also Published As

Publication number Publication date
JPH0528796Y2 (en) 1993-07-23

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