JPH018483Y2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a semiconductor storage device that automatically stores semiconductor devices sent out from the processing section of a semiconductor manufacturing device into a storage container, and is particularly applicable to ceramic storage devices. The present invention relates to a semiconductor storage device which prevents damage due to collision even when semiconductor devices made by the manufacturer are sequentially stored in a storage container.

(2) Background of the technology In the manufacturing process of semiconductor devices, there are various processing steps such as automatic marking on the semiconductor device and cutting of leads using an automatic lead cutting machine, and measurement of the characteristics of the semiconductor device. There is a measurement process in which semiconductor devices are measured, and in order to transport semiconductor devices from each process to the next process, storage containers (containers) are required.
A plurality of semiconductor devices are stored and transported.
Generally, such semiconductor storage equipment sends semiconductor devices onto an inclined guide rail, and automatically stores the semiconductor devices into a container by letting them fall naturally on the guide rail using the bent leads of the semiconductor devices as a guide. being done.

However, when semiconductor devices are stored in a container due to natural fall, especially ceramic semiconductor devices, collisions between semiconductor devices inside the storage container can cause damage or cracks. Ta.

(3) Prior Art and Problems Conventional configurations for eliminating such problems will be explained with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view of essential parts of a first conventional embodiment, in which a semiconductor device 1 is sent onto an inclined guide rail 2 after a process such as a processing process or a measurement process is completed. The guide rail 2 is the semiconductor device 1
The left and right sides are regulated using the bent leads 1a and 1b as guides, and the wire falls naturally to the horizontal portion 2a of the guide rail 2.

A horizontal portion 2a of the guide rail 2 is placed on a base 4 provided on a board 3 and covered with a rail cover 5.

At the end of the horizontal portion 2a of the guide rail 2, there is a stopper 6 made of an elastic material such as rubber, as indicated by the arrow B-.
It is arranged to be movable in the direction indicated by B'.

A semiconductor storage container 7 is provided at the end of the guide rail 2.

The storage container 7 has a length of about 500 mm and is composed of a drawing member or the like having a substantially inverted concave cross section so that a plurality of semiconductor devices can be sequentially fed into the storage container 7.

Furthermore, although not shown as it will be described later, it is transferred to the horizontal part 2a of the guide rail 2, and the stopper 6
It has a pressing device for pushing the semiconductor device 1 stopped against the storage container 7 into the storage container 7.

Assuming that the pressing claw 8 of such a pressing device is, for example, in the position shown in the first figure, the semiconductor device 1 that has fallen naturally will either collide with the pin of the stopper 6 due to gravity and stop, or bounce and stop, for example. It may return to the position indicated by 1' in Figure 1.

In the latter state, even if the pressing pawl 8 traces a trajectory 9 to accommodate the semiconductor device 1a in the storage container 7 (of course, the stopper 6 is moving upward at this time), the semiconductor device 1' and the pressing pawl 8 Since the relationship between the two is different, there arises a drawback that the semiconductor device cannot be pressed into the storage container.

Therefore, it was proposed that the stopper 6 having an elastic body configuration be abolished and a stopper 10 as shown in FIG. 2 (enlarged view of part A in FIG. 1) be detachably attached to the end face of the horizontal portion 2a of the guide rail 2. .

The stopper 10 has leaf springs 11a and 11b disposed on the left and right side walls in a cantilever manner, and the semiconductor device 1 that has fallen from the guide rail 2 has its leads 1a as shown in FIG. ,1
The spacing L ₁ between b is a leaf spring 11a, 1 that widens at the end.
1b is smaller than L ₂ , the stopper is locked at the 10 position, but as shown in Fig. 3, L ₂ < L ₁
If this relationship exists, the semiconductor device cannot be stopped.

In reality, the distance _L1 varies considerably depending on the type of semiconductor device, and it is not possible to lock all types of semiconductor devices with a single stopper 10. I try to change it each time depending on the situation. Therefore, it has the disadvantage that its handling is extremely complicated.

(4) Purpose of the invention In view of the above-mentioned drawbacks of the conventional device, the object of the present invention is to provide a stopper that can securely store a semiconductor device without bouncing it.

(5) Structure of the invention According to the invention, in a semiconductor storage device in which semiconductor devices are sent out along an inclined guide rail and stored in a storage container, a vacuum chuck portion is provided at the end of the guide rail. To provide a semiconductor storage device, characterized in that a vacuum chuck section is arranged to adsorb and stop semiconductor devices sent out, and the stopped semiconductor devices are sequentially stored in a storage container by a pressing means. achieved by.

(6) Embodiments of the invention Hereinafter, embodiments of the invention will be explained with reference to the drawings. FIG. 4 is a perspective view of the main parts of the semiconductor storage device of the present invention, FIG. 5 is a plan view of the main parts of FIG. 4, and FIG. 6 is a side sectional view of the vacuum chuck part. Although the same parts as in FIG. 1 are given the same reference numerals and redundant explanation will be omitted, a pressing means 12 is provided on the side of the horizontal portion 2a of the guide rail 2.

The pressing means includes a substantially plate-shaped base 13, and the base includes a mounting portion 13a and a cam portion 13b of the air cylinder 14. One end of the air cylinder 14 is fixed to an air cylinder mounting base 15, and the air cylinder 14 is A cylinder head 17 is fixed to the tip of the piston 16, and a roller 18 is rotatably attached to the cylinder head 17, and the roller 18 fits into a guide groove 19 provided in the cam portion 13b of the base portion 13. 5, when the piston 16 is pushed out and the cylinder head 17 moves in the direction of arrow B, it moves along the guide groove 19 of the cam portion 13b.

At this time, the trajectory 9 of the pressing pawl 8 attached to the cylinder head 17 becomes the same as the trajectory of the guide groove 19 of the cam portion 13b, as shown by the dashed line.

Reference numeral 20 denotes a spring stretched between the cylinder head 17 and the base 13, which always biases the cylinder head in the direction of arrow C so that the cylinder head moves smoothly along the slope of the cam portion.

Furthermore, in the present invention, a through hole 21 is bored at the end of the horizontal part 2a of the guide rail as shown in FIG. ) to form a vacuum chamber by creating a negative pressure inside the through hole 21.

According to the above configuration, when the semiconductor 1 slides down along the slope of the guide rail 2, the first photosensor detects that it has reached a predetermined position on the horizontal part, and turns on the solenoid valve of the vacuum pump. Then, the semiconductor device 1'' is stopped at a predetermined position.Next, the second photosensor senses that it is above the through hole 21, which is the vacuum chamber in FIG. 5, and turns the solenoid valve into the "off" state. By doing this, the pressing claw 8 of the pressing means 12 moves in the direction of arrow B by the operation of the air cylinder 14, and the pressing claw 8 presses the rear part of the semiconductor device 1'' along the trajectory 9, so that the semiconductor device 1'' is It is stored in a storage container 7. By sequentially repeating such operations, the plurality of semiconductor devices stored in the storage container 7 are transferred to the next process.

(7) Effects of the invention As explained above in detail, the semiconductor storage device of the invention reliably stops the semiconductor device at the horizontal portion 2a position of the guide rail, and allows the semiconductor device to be stopped between the leads of different types of semiconductor devices. Since it can be stopped even if the interval L ₁ changes, it has the effect that the semiconductor device can be stored in the storage container without being damaged.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of main parts of a conventional semiconductor storage device, FIG. 2 is a perspective view of another conventional semiconductor storage device showing an enlarged portion of section A in FIG. 1, and FIG.
The figure is a front view of a stopper explaining the relationship between a conventional semiconductor device and a mechanical stopper part, FIG. 4 is a perspective view of the main part of the semiconductor storage device of the present invention, and FIG. 5 is a rail and presser shown in FIG. 4. A plan view of the means, and FIG. 6 is a side sectional view of the vacuum chamber. 1... Semiconductor device, 2... Guide rail, 3...
... Board, 4... Base, 6... Stopper, 7...
Storage container, 8...Press claw, 9...Trajectory, 10...
Stopper, 12... Pressing device, 13... Base,
14... Air cylinder, 17... Cylinder head, 18... Roller, 19... Guide groove, 20...
spring.

Claims (1)

[Scope of utility model registration request] In a semiconductor storage device in which semiconductor devices are delivered along an inclined guide rail and stored in a storage container, a vacuum chuck section is disposed at the end of the guide rail, and the semiconductor devices are delivered by the vacuum chuck section. A semiconductor storage device characterized in that semiconductor devices are stopped by suction and the stopped semiconductor devices are sequentially stored in a storage container by a pressing means.