JPH0185009U - - Google Patents
Info
- Publication number
- JPH0185009U JPH0185009U JP1987181846U JP18184687U JPH0185009U JP H0185009 U JPH0185009 U JP H0185009U JP 1987181846 U JP1987181846 U JP 1987181846U JP 18184687 U JP18184687 U JP 18184687U JP H0185009 U JPH0185009 U JP H0185009U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plunger
- pot
- bypass
- tablet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Pistons, Piston Rings, And Cylinders (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る樹脂モールド装置におけ
るプランジヤの拡大断面図、第２図乃至第４図は
前記装置の正断面図である。第５図乃至第７図は
従来の樹脂モールド装置の正断面図である。
１……上金型、２……下金型、３……ポツト、
９……樹脂タブレツト、９′……溶融した樹脂、
２１……プランジヤ、２１ａ……押圧面、２３…
…可動弁、２４……バイパス。
FIG. 1 is an enlarged sectional view of a plunger in a resin molding device according to the present invention, and FIGS. 2 to 4 are front sectional views of the device. 5 to 7 are front sectional views of a conventional resin molding device. 1... Upper mold, 2... Lower mold, 3... Pot,
9... Resin tablet, 9'... Melted resin,
21... Plunger, 21a... Pressing surface, 23...
...Movable valve, 24...Bypass.
Claims (1)
がらプランジヤで押圧し、流動化した樹脂を圧送
して樹脂成形する装置において、 上記プランジヤは、ポツト内外を連通するバイ
パスと、タブレツト押圧面に突出退入し前記バイ
パスを開閉する可動弁とを有していることを特徴
とする樹脂モールド装置。[Scope of Claim for Utility Model Registration] In a device that presses a resin tablet supplied from a pot with a plunger while heating it, and pressurizes the fluidized resin to mold the resin, the plunger has a bypass that communicates between the inside and outside of the pot, and a tablet. A resin molding device comprising a movable valve that projects into and out of a pressing surface to open and close the bypass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181846U JPH0185009U (en) | 1987-11-28 | 1987-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181846U JPH0185009U (en) | 1987-11-28 | 1987-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0185009U true JPH0185009U (en) | 1989-06-06 |
Family
ID=31473314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181846U Pending JPH0185009U (en) | 1987-11-28 | 1987-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0185009U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068623A (en) * | 1983-09-26 | 1985-04-19 | Nec Corp | Molding machine for resin sealing |
-
1987
- 1987-11-28 JP JP1987181846U patent/JPH0185009U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068623A (en) * | 1983-09-26 | 1985-04-19 | Nec Corp | Molding machine for resin sealing |