JPH0186295U - - Google Patents

Info

Publication number
JPH0186295U
JPH0186295U JP1987181189U JP18118987U JPH0186295U JP H0186295 U JPH0186295 U JP H0186295U JP 1987181189 U JP1987181189 U JP 1987181189U JP 18118987 U JP18118987 U JP 18118987U JP H0186295 U JPH0186295 U JP H0186295U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
components
board components
potted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987181189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987181189U priority Critical patent/JPH0186295U/ja
Publication of JPH0186295U publication Critical patent/JPH0186295U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の一実施例の断面図である。 １……プリント基板、２……半導体素子、３…
…軟粘性樹脂、４……冷却板、５……冷媒。 The figure is a sectional view of one embodiment of the present invention. 1... Printed circuit board, 2... Semiconductor element, 3...
...Soft viscous resin, 4...Cooling plate, 5...Refrigerant.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板部品面に、軟粘性樹脂を均一な厚
みに部品が埋まる高さにポツテイングし、その上
面に冷却板を密着することを特徴とするプリント
基板部品の冷却装置。 A cooling device for printed circuit board components, characterized in that a soft viscous resin is potted on the surface of the printed circuit board components at a height that allows the components to be buried in a uniform thickness, and a cooling plate is closely attached to the top surface.
JP1987181189U 1987-11-30 1987-11-30 Pending JPH0186295U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987181189U JPH0186295U (en) 1987-11-30 1987-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987181189U JPH0186295U (en) 1987-11-30 1987-11-30

Publications (1)

Publication Number Publication Date
JPH0186295U true JPH0186295U (en) 1989-06-07

Family

ID=31472686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987181189U Pending JPH0186295U (en) 1987-11-30 1987-11-30

Country Status (1)

Country Link
JP (1) JPH0186295U (en)

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