JPH0186295U - - Google Patents
Info
- Publication number
- JPH0186295U JPH0186295U JP1987181189U JP18118987U JPH0186295U JP H0186295 U JPH0186295 U JP H0186295U JP 1987181189 U JP1987181189 U JP 1987181189U JP 18118987 U JP18118987 U JP 18118987U JP H0186295 U JPH0186295 U JP H0186295U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- components
- board components
- potted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図は本考案の一実施例の断面図である。
１……プリント基板、２……半導体素子、３…
…軟粘性樹脂、４……冷却板、５……冷媒。
…軟粘性樹脂、４……冷却板、５……冷媒。
Claims (1)
- プリント基板部品面に、軟粘性樹脂を均一な厚
みに部品が埋まる高さにポツテイングし、その上
面に冷却板を密着することを特徴とするプリント
基板部品の冷却装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181189U JPH0186295U (ja) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181189U JPH0186295U (ja) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186295U true JPH0186295U (ja) | 1989-06-07 |
Family
ID=31472686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181189U Pending JPH0186295U (ja) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186295U (ja) |
-
1987
- 1987-11-30 JP JP1987181189U patent/JPH0186295U/ja active Pending