JPH0187155U - - Google Patents
Info
- Publication number
- JPH0187155U JPH0187155U JP18250487U JP18250487U JPH0187155U JP H0187155 U JPH0187155 U JP H0187155U JP 18250487 U JP18250487 U JP 18250487U JP 18250487 U JP18250487 U JP 18250487U JP H0187155 U JPH0187155 U JP H0187155U
- Authority
- JP
- Japan
- Prior art keywords
- substrate holder
- target
- view
- sputtering apparatus
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
第１図は本考案の実施例１におけるスパツタ室
の概略の平面図、第２図ａは基板ホルダ付近の平
面図、ｂは同側面図、第３図ａは実施例２の平面
図、ｂは同側面図である。
１……スパツタ室、２……加熱ランプ、３……
反射板、４……スパツタ電極、５……スパツタ電
極、６……真空室、７……仕切り弁、８ａ，８ｂ
……基板、９……基板ホルダ、１０……基板ホル
ダ支持台、１１ａ，１１ｂ……ターゲツト、１２
……ターゲツト、１３……防着板、１４ａ，１４
ｂ……ガイド棒、１５……スプリング、１６……
アーム、１７……パレツト、１８……ホイール、
１９……パレツトキヤリア、２０……チエーン、
２１……レール、２２……モータ、２３……ボー
ルネジ、２４……ロータリーエンコーダ。
FIG. 1 is a schematic plan view of the sputtering chamber in Example 1 of the present invention, FIG. 2 a is a plan view of the vicinity of the substrate holder, b is a side view of the same, and FIG. 3 a is a plan view of Example 2, b is the same side view. 1... Spatula room, 2... Heat lamp, 3...
Reflector plate, 4... Sputter electrode, 5... Sputter electrode, 6... Vacuum chamber, 7... Gate valve, 8a, 8b
...Substrate, 9...Substrate holder, 10...Substrate holder support stand, 11a, 11b...Target, 12
...Target, 13...Adhesion prevention plate, 14a, 14
b... Guide rod, 15... Spring, 16...
Arm, 17...Pallet, 18...Wheel,
19... Palette carrier, 20... Chain,
21...Rail, 22...Motor, 23...Ball screw, 24...Rotary encoder.
Claims (1)
ダに相対向するターゲツトとを有するスパツタリ
ング装置において、前記基板ホルダとターゲツト
間の距離を任意に調整する機構を装備したことを
特徴とするスパツタリング装置。 A sputtering apparatus comprising a substrate holder for holding a processed substrate and a target facing the substrate holder, characterized in that the sputtering apparatus is equipped with a mechanism for arbitrarily adjusting the distance between the substrate holder and the target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250487U JPH0187155U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18250487U JPH0187155U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187155U true JPH0187155U (en) | 1989-06-08 |
Family
ID=31473951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18250487U Pending JPH0187155U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298263A (en) * | 1989-05-12 | 1990-12-10 | Tokyo Electron Ltd | Sputtering device |
-
1987
- 1987-11-30 JP JP18250487U patent/JPH0187155U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02298263A (en) * | 1989-05-12 | 1990-12-10 | Tokyo Electron Ltd | Sputtering device |