JPH0187534U - - Google Patents

Info

Publication number
JPH0187534U
JPH0187534U JP18296787U JP18296787U JPH0187534U JP H0187534 U JPH0187534 U JP H0187534U JP 18296787 U JP18296787 U JP 18296787U JP 18296787 U JP18296787 U JP 18296787U JP H0187534 U JPH0187534 U JP H0187534U
Authority
JP
Japan
Prior art keywords
pipe
coating device
inner diameter
resist
resist coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18296787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18296787U priority Critical patent/JPH0187534U/ja
Publication of JPH0187534U publication Critical patent/JPH0187534U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示すレジスト塗布装
置の構成図、第2図は従来の第1のレジスト塗布
装置の構成図、第3図は従来の第2のレジスト塗
布装置の構成図である。 51……レジスト容器、52,54,57,5
9,61,62,67,68……パイプ、60…
…フイルタ、53,58……逆流防止弁、55…
…ベローズ、56,65……シリンダ、63,6
6……エアバルブ、64……ダイアフラム、69
……ノズル、70……ウエハ。
FIG. 1 is a configuration diagram of a resist coating device showing an embodiment of the present invention, FIG. 2 is a configuration diagram of a first conventional resist coating device, and FIG. 3 is a configuration diagram of a second conventional resist coating device. be. 51...Resist container, 52, 54, 57, 5
9, 61, 62, 67, 68...pipe, 60...
...Filter, 53, 58...Return prevention valve, 55...
...Bellows, 56,65...Cylinder, 63,6
6...Air valve, 64...Diaphragm, 69
... Nozzle, 70 ... Wafer.

Claims (1)

【実用新案登録請求の範囲】 半導体ウエハやフオトマスク基板等の被塗布物
へのレジスト塗布装置において、 サツクバツク機構をレジスト供給経路とは別経
路に設けると共に、ノズル手前のパイプの内径を
他の箇所に配設されるパイプの内径よりも小さく
なるように形成してなるレジスト塗布装置。
[Scope of Claim for Utility Model Registration] In a resist coating device for coating objects such as semiconductor wafers and photomask substrates, a back-back mechanism is provided in a route separate from the resist supply route, and the inner diameter of the pipe in front of the nozzle is moved to another location. A resist coating device formed to have a diameter smaller than the inner diameter of the pipe in which it is installed.
JP18296787U 1987-12-02 1987-12-02 Pending JPH0187534U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18296787U JPH0187534U (en) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18296787U JPH0187534U (en) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187534U true JPH0187534U (en) 1989-06-09

Family

ID=31474405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18296787U Pending JPH0187534U (en) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187534U (en)

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