JPH0187539U - - Google Patents
Info
- Publication number
- JPH0187539U JPH0187539U JP18346687U JP18346687U JPH0187539U JP H0187539 U JPH0187539 U JP H0187539U JP 18346687 U JP18346687 U JP 18346687U JP 18346687 U JP18346687 U JP 18346687U JP H0187539 U JPH0187539 U JP H0187539U
- Authority
- JP
- Japan
- Prior art keywords
- push
- view
- pellets
- sheet
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Description
第１図と第２図と第３図は本考案に係るマウン
タの一実施例を示す要部側断面図とその概略側面
図と要部斜視図、第４図と第５図は本考案に係る
マウンタの他の２つの各実施例を示す要部斜視図
、第６図は粘着シートに半導体ウエーハも貼着し
た状態を示す斜視図、第７図は第６図の半導体ウ
エーハのペレツト分割を説明するための斜視図、
第８図は真空吸着ノズルによるペレツトピツクア
ツプを説明するための断面図、第９図と第１０図
は搬送レール上のウエーハ貼着構体を示す平面図
と断面図、第１１図は真空吸着ノズルと突き上げ
ピンによるペレツトピツクアツプを説明するため
の断面図である。
１……半導体ペレツト、３……シート、１２ｂ
……光ガイド部、１３……突き上げピン、１６…
…紫外線。
1, 2, and 3 are a sectional side view of the main part, a schematic side view, and a perspective view of the main part showing one embodiment of the mount according to the present invention, and FIGS. 4 and 5 are the main parts of the mount according to the present invention. FIG. 6 is a perspective view showing a state in which a semiconductor wafer is also attached to an adhesive sheet, and FIG. 7 is a perspective view showing the semiconductor wafer divided into pellets in FIG. 6. A perspective view for explanation,
FIG. 8 is a cross-sectional view for explaining pellet pickup using a vacuum suction nozzle, FIGS. 9 and 10 are a plan view and a cross-sectional view showing a wafer sticking structure on a transport rail, and FIG. 11 is a vacuum suction nozzle. FIG. 3 is a cross-sectional view for explaining pellet pick-up using a push-up pin. 1... Semiconductor pellet, 3... Sheet, 12b
...Light guide section, 13... Push-up pin, 16...
...ultraviolet light.
Claims (1)
態で貼着された半導体ペレツトを、シート下面よ
り突き上げピンにて押し上げ、持ち上げられたペ
レツトを取り出すようにしたものにおいて、 上記突き上げピンと同軸的に紫外線をガイドす
る光ガイド部を設けたことを特徴とするマウンタ
。[Scope of Claim for Utility Model Registration] In a device in which semiconductor pellets are aligned and adhered to a sheet coated with an ultraviolet curable adhesive and are pushed up from the bottom surface of the sheet using push-up pins, and the lifted pellets are taken out, A mounter comprising a light guide section that guides ultraviolet light coaxially with the push-up pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18346687U JPH0187539U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18346687U JPH0187539U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187539U true JPH0187539U (en) | 1989-06-09 |
Family
ID=31474887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18346687U Pending JPH0187539U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187539U (en) |
-
1987
- 1987-11-30 JP JP18346687U patent/JPH0187539U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0184434U (en) | ||
| KR102388056B1 (en) | Method and device of heat sink attachment to a circuit tape | |
| JPH0187539U (en) | ||
| TW201931488A (en) | Needle device for chip | |
| JP3611962B2 (en) | Chip push-up device | |
| JP3509538B2 (en) | Chip pushing device | |
| JP3213273B2 (en) | Chip pickup device | |
| JPH0234174B2 (en) | ||
| CN221852550U (en) | Chip carrying tray | |
| JPH10335270A (en) | Pellet pickup device | |
| JPS6027610B2 (en) | Separation method of flexible plate-like body | |
| JPS611842U (en) | Bonding equipment plunge head | |
| JPS6468938A (en) | Removal of defective semiconductor element | |
| KR100346482B1 (en) | Ejecting Device of Die Bonding | |
| JPS58123827U (en) | Palletizer | |
| JPH0465704U (en) | ||
| JPH0171446U (en) | ||
| JPH03229430A (en) | Semiconductor die-bonding apparatus | |
| JPS6129145A (en) | Picking up method and jig therefor | |
| JP2014011184A (en) | Chip transporting system and chip tray | |
| JPS6382999U (en) | ||
| JPH05160331A (en) | Die bonding method and lead frame | |
| JPH0415848U (en) | ||
| JPS6230342U (en) | ||
| JPH01127242U (en) |