JPH0187548U - - Google Patents
Info
- Publication number
- JPH0187548U JPH0187548U JP18471287U JP18471287U JPH0187548U JP H0187548 U JPH0187548 U JP H0187548U JP 18471287 U JP18471287 U JP 18471287U JP 18471287 U JP18471287 U JP 18471287U JP H0187548 U JPH0187548 U JP H0187548U
- Authority
- JP
- Japan
- Prior art keywords
- package substrate
- pins
- grid array
- mounting portion
- pin grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
斜視図及びＡ―Ａ′線断面図、第２図は従来のピ
ングリツドアレーパツケージの一例の斜視図であ
る。
１，１′……パツケージ基板、２，２′……ピ
ン、３……半導体チツプ、４……ボンデイング線
、５，５′……キヤツプ、６，６′……表示部。
1A and 1B are a perspective view and a sectional view taken along the line AA' of an embodiment of the present invention, respectively, and FIG. 2 is a perspective view of an example of a conventional pin grid array package. 1, 1'... Package board, 2, 2'... Pin, 3... Semiconductor chip, 4... Bonding line, 5, 5'... Cap, 6, 6'... Display section.
Claims (1)
パツケージ基板と該パツケージ基板に配置した外
部接続用の複数のピンとを少くとも備えたピング
リツドアレーパツケージにおいて、前記マウント
部と前記ピンとが前記パツケージ基板の同一の面
に配置したことを特徴とするピングリツドアレー
パツケージ。 A pin grid array package includes at least a package substrate provided with a mounting portion to which a semiconductor chip is fixed, and a plurality of pins for external connection disposed on the package substrate, wherein the mounting portion and the pins are connected to each other on the package substrate. A pin grid array package characterized by being arranged on the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471287U JPH0187548U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18471287U JPH0187548U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187548U true JPH0187548U (en) | 1989-06-09 |
Family
ID=31476053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18471287U Pending JPH0187548U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187548U (en) |
-
1987
- 1987-12-02 JP JP18471287U patent/JPH0187548U/ja active Pending