JPH0187568U - - Google Patents

Info

Publication number
JPH0187568U
JPH0187568U JP1987184052U JP18405287U JPH0187568U JP H0187568 U JPH0187568 U JP H0187568U JP 1987184052 U JP1987184052 U JP 1987184052U JP 18405287 U JP18405287 U JP 18405287U JP H0187568 U JPH0187568 U JP H0187568U
Authority
JP
Japan
Prior art keywords
lead frame
cup portion
light emitting
emitting diode
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987184052U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184052U priority Critical patent/JPH0187568U/ja
Publication of JPH0187568U publication Critical patent/JPH0187568U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本考案に係る発光ダイオードの斜視図
、第２図はリードにカツプ部を成形する手順を示
す説明図、第３図はカツプ部が成形されたリード
の折曲手順を示す説明図、第４図はカツプ部が形
成されたリードフレームの平面図、第５図は第４
図のＡ矢視図、第６図は第４図のＢ―Ｂ線断面図
、第７図はリードのカツプ部に複数個のＬＥＤチ
ツプを搭載した状態を示す平面図、第８図は従来
の発光ダイオードのリード部分の斜視図、第９図
はその側面図、第１０図はカツプ部の成形を示す
説明図である。 １０……ＬＥＤチツプ、２１……第１リード、
２１１……先端側面、２１２……カツプ部、３０
……モールド部。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＬＥＤチツプと、ＬＥＤチツプを搭載する略擂
    鉢状のカツプ部が成形されたリードフレームと、
    リードフレームを封止するモールド部とを有する
    発光ダイオードにおいて、前記カツプ部はリード
    フレームの先端側面に形成され、かつ当該リード
    フレームはカツプ部をモールド部の頭頂部に向け
    て折曲形成されていることを特徴とする発光ダイ
    オード。
JP1987184052U 1987-12-01 1987-12-01 Pending JPH0187568U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184052U JPH0187568U (ja) 1987-12-01 1987-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184052U JPH0187568U (ja) 1987-12-01 1987-12-01

Publications (1)

Publication Number Publication Date
JPH0187568U true JPH0187568U (ja) 1989-06-09

Family

ID=31475440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184052U Pending JPH0187568U (ja) 1987-12-01 1987-12-01

Country Status (1)

Country Link
JP (1) JPH0187568U (ja)

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