JPH0348254U - - Google Patents

Info

Publication number
JPH0348254U
JPH0348254U JP1989108467U JP10846789U JPH0348254U JP H0348254 U JPH0348254 U JP H0348254U JP 1989108467 U JP1989108467 U JP 1989108467U JP 10846789 U JP10846789 U JP 10846789U JP H0348254 U JPH0348254 U JP H0348254U
Authority
JP
Japan
Prior art keywords
lens
light emitting
emitting diode
molded
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989108467U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989108467U priority Critical patent/JPH0348254U/ja
Publication of JPH0348254U publication Critical patent/JPH0348254U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Description

【図面の簡単な説明】
第１図は本考案によるＬＥＤの一実施例の概略
斜視図、第２図Ａは第１図のＬＥＤのレンズの成
形時を、また同図Ｂは成形後を示す概略断面図で
ある。第３図は従来のＬＥＤの一例を示す概略断
面図、第４図Ａは第３図のＬＥＤのレンズ成形前
の要部を示す斜視図、同図Ｂはレンズ成形時を示
す概略断面図である。 １０……ＬＥＤ、１１，１２……リードフレー
ム、１３……ＬＥＤチツプ、１４……レンズ、１
５……ウエブ、１６……ガイド部材。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームの一端部に取り付けられた発光
    ダイオードチツプと、該発光ダイオードチツプを
    包囲するように樹脂モールドにより成形されたレ
    ンズとを含んでいる発光ダイオードにおいて、 上記リードフレームが、レンズ成形前に、成形
    されるべきレンズに対応する位置に、該レンズの
    下方領域の外周縁を画成するように少なくとも三
    方向に向かつて半径方向に延びているガイド部材
    を備えていることを特徴とする、発光ダイオード
    。
JP1989108467U 1989-09-16 1989-09-16 Pending JPH0348254U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989108467U JPH0348254U (ja) 1989-09-16 1989-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989108467U JPH0348254U (ja) 1989-09-16 1989-09-16

Publications (1)

Publication Number Publication Date
JPH0348254U true JPH0348254U (ja) 1991-05-08

Family

ID=31657108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989108467U Pending JPH0348254U (ja) 1989-09-16 1989-09-16

Country Status (1)

Country Link
JP (1) JPH0348254U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027822A (ja) * 2001-07-16 2003-01-29 Misawa Homes Co Ltd 窓サッシのレール構造および窓サッシの再生方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device
JPS60208715A (ja) * 1984-04-02 1985-10-21 Nec Corp 光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270766A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor device
JPS60208715A (ja) * 1984-04-02 1985-10-21 Nec Corp 光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027822A (ja) * 2001-07-16 2003-01-29 Misawa Homes Co Ltd 窓サッシのレール構造および窓サッシの再生方法

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