JPH0187592U - - Google Patents
Info
- Publication number
- JPH0187592U JPH0187592U JP18387587U JP18387587U JPH0187592U JP H0187592 U JPH0187592 U JP H0187592U JP 18387587 U JP18387587 U JP 18387587U JP 18387587 U JP18387587 U JP 18387587U JP H0187592 U JPH0187592 U JP H0187592U
- Authority
- JP
- Japan
- Prior art keywords
- board
- slits
- ceramic
- bending
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図乃至第３図は、本考案の一実施例を説明
する図で、第１図は基板を取付けた平面図、第２
図は要部断面斜視図、第３図は支持金具の要部斜
視図、第４図及び第５図は、従来の基板の実装構
造を説明する図で、第４図は基板を取付けた平面
図、第５図は要部断面斜視図である。
図において、１はセラミツク基板、２，５は支
持金具、３は金属ケース、４は裏蓋、２１，５１
はスリツト、２２，５３は基板支持部、５２はＵ
字状折り曲げ部、をそれぞれ示す。
1 to 3 are diagrams explaining one embodiment of the present invention, in which FIG. 1 is a plan view with a board attached, and FIG.
The figure is a cross-sectional perspective view of the main part, Fig. 3 is a perspective view of the main part of the support metal fitting, Figs. 4 and 5 are diagrams for explaining the conventional board mounting structure, and Fig. 4 is a plan view of the board attached. FIG. 5 is a cross-sectional perspective view of the main part. In the figure, 1 is a ceramic substrate, 2 and 5 are support fittings, 3 is a metal case, 4 is a back cover, 21, 51
is a slit, 22 and 53 are substrate support parts, and 52 is a U.
The character-shaped folded portions are shown respectively.
Claims (1)
実装する構造において、 弾性を有する導電体板状部材からなり、長手方
向に所定ピツチで複数のスリツト５１を形成し、
該スリツト５１間及び両端に断面視Ｕ字状の折り
曲げ部５２を設け、該折り曲げ部５２の開放端を
略直角に折り曲げて基板支持部５３を形成した支
持金具５を、前記金属ケース３の長手方向内側に
溶接し、前記支持金具５の基板支持部５３にセラ
ミツク基板１を半田付けするようにしたことを特
徴とする基板の実装構造。[Claims for Utility Model Registration] In a structure in which a ceramic substrate with components mounted thereon is mounted on a metal case, it is made of an elastic conductive plate-like member, and a plurality of slits 51 are formed at a predetermined pitch in the longitudinal direction,
A bending part 52 having a U-shape in cross section is provided between the slits 51 and at both ends, and the support fitting 5 is formed by bending the open end of the bending part 52 at a substantially right angle to form a board support part 53. A board mounting structure characterized in that the ceramic board 1 is welded to the inside in the direction and the ceramic board 1 is soldered to the board support part 53 of the support fitting 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18387587U JPH0187592U (en) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18387587U JPH0187592U (en) | 1987-12-01 | 1987-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187592U true JPH0187592U (en) | 1989-06-09 |
Family
ID=31475279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18387587U Pending JPH0187592U (en) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187592U (en) |
-
1987
- 1987-12-01 JP JP18387587U patent/JPH0187592U/ja active Pending
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