JPH0187597U

JPH0187597U -

Info

Publication number: JPH0187597U
Application number: JP18473487U
Authority: JP
Priority date: 1987-12-03
Filing date: 1987-12-03
Publication date: 1989-06-09

Description

[Brief explanation of the drawing]

第１図はこの考案の実施例を示す一部断面図、
第２図は実装状態の電子機器を示す一部断面図、
第３図は第２図の横断面図、第４図、第５図、第
６図は従来の実施例を示す同様な図である。図に
おいて、１は冷却ダクト、２はエレクトロニクス
モジユール、３はエレクトロニクス発熱体、４ａ
，４ｂはマニホルド、５ａ，５ｂはダクト、６は
平板型ヒートパイプ、７は冷媒流路である。なお
、図中、同一或いは相当部分には同一符号を付し
て示してある。 FIG. 1 is a partial sectional view showing an embodiment of this invention.
Figure 2 is a partial cross-sectional view showing the electronic device in a mounted state;
FIG. 3 is a cross-sectional view of FIG. 2, and FIGS. 4, 5, and 6 are similar views showing conventional embodiments. In the figure, 1 is a cooling duct, 2 is an electronics module, 3 is an electronics heating element, and 4a
, 4b is a manifold, 5a and 5b are ducts, 6 is a flat heat pipe, and 7 is a refrigerant flow path. In the drawings, the same or corresponding parts are designated by the same reference numerals.

Claims

[Scope of utility model registration request]

In an electronic device equipped with a plurality of electronics modules that require cooling, there is a plurality of hollow rectangular parallelepiped electronics modules, a flat heat pipe located between these electronics modules, and a coolant flow on both sides of the heat pipe. 3 with road
An electronic device that has a layered structure and is equipped with a cooling duct that swells on both sides due to the internal pressure of a refrigerant and presses against the cooled surface of an electronics module to perform a cooling effect.