JPH019176Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention has two bending guide parts that are deviated in the front, back, left and right directions and are directed downward, and are provided on the guide rail by positioning them on the solder melting tank. This invention relates to a board support frame guide device for an automatic soldering device, which guides the board support frame and the rear end portion separately.

The automatic soldering device is equipped with a guide rail that bends downward above the solder melting tank, and a board support frame is movably supported on this guide rail. There is one that is configured to be towed by a chain.

In the soldering device with this configuration, the downwardly bent part of the guide rail is composed of a downwardly inclined part, a horizontal part, and an upwardly inclined part, and is located at the front and rear ends of the board support frame. The wheels attached to each section were guided by the same slope, descended, and then raised. Therefore, on the solder melting tank, the substrate support frame descends while tilting downward, moves horizontally, and then rises while tilting upward. As a result, the printed circuit board supported by the board support frame is gradually immersed in the solder melt and is also gradually lifted out of the solder melt.

It is better to shorten the time required to complete the immersion of the printed circuit board in the solder melt and the time to lift it from the solder melt as much as possible, as well as to lengthen the time that the entire surface of the printed circuit board is immersed in the solder melt. preferable.

The purpose of the present invention is to provide a board support frame guide device for an automatic soldering apparatus that meets this demand. The feature is that the rear end is guided separately.

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numerals 1 and 2 are guide rails that pass over a solder melting tank (not shown), and this guide rail 2 has three rail members 3, 4, and 5.

The guide rails 1 and 2 have bent portions 6 and 7 that are bent downward on a solder melting tank (not shown). The bent portion 6 has a downwardly inclined portion 6a, a horizontal portion 6b, and an upwardly inclined portion 6c. The bending part 7 consists of a first bending guide part 8 and a second bending guide part 9, and the first bending guide part 8
is a downwardly inclined part 4a provided on the central rail material 4
It has a horizontal part 4b and an upwardly inclined part 4c.
The second bending guide portion 9 has a downwardly inclined portion 3a and a horizontal portion 3b provided on the rail material 3, and an upwardly inclined portion 5a provided on the rail material 5.

The bending part 6 and the first bending guide part 8 are provided in parallel, and the inclined parts 4c, 6c are parallel to the inclined parts 4a, 6a.
It is set slower than The sloped part 3a is provided in parallel with the sloped part 4a at a position rearward of the sloped part 4a, and the sloped part 5a is provided in a position rearward from the sloped part 6c in parallel with the sloped part 6c.

10 is a board support frame for supporting a printed circuit board. Wheels 11 are provided on both sides of the front end of the board support frame 10.
12 is attached, and a wheel 13 is attached to one side of the rear end of the substrate support frame 10.
A wheel 14 and a U-shaped bracket 15 are attached to the other side of the rear end of the board support frame 10. A bracket 15 straddles above the wheel 14, and a wheel 16 is attached to the outer side of the bracket 15.

The wheels 11 and 13 are placed on the guide rail 1, and the wheel 12 is placed on the rail material 4. Further, the wheels 14 are placed on the rail material 3 as shown in FIGS. 1 and 2, and the wheels 16 are set to roll on the rail material 5 at the bent portion 7. (See Figure 3).

A shaft 17 is protruded from one side of the substrate support frame 10, and a housing 19 is rotatably supported on this shaft 17 via a bearing 18 (a fourth
(see Figure 5). An engagement plate 20 serving as an engagement member is provided on the housing 19 so as to protrude laterally. Reference numeral 20a denotes an engagement hole bored at the tip of the engagement plate 20, and this engagement hole 20a faces in a direction intersecting the axis of the shaft 17.

Reference numeral 21 in FIG. 5 is a chain guide disposed along the guide rail 1. The chain guide 21 is not shown in FIGS. 1 to 4. A universal chain 22 as a drive chain is disposed in a passage within the chain guide 21. The universal chain 22 is moved in the longitudinal direction within the chain guide 21 by a motor (not shown). universal chain 22
A drive rod 23 is provided to protrude upward.
The drive rod 23 is slidably inserted into the engagement hole 20a of the engagement plate 20.

Next, the operation of the substrate support frame guide device and drive chain engagement device configured as described above will be explained.

When a motor (not shown) is operated to drive the universal chain 22, the drive rod 23 moves along the guide rail. Along with this, the substrate support frame 10 is pulled via the drive rod 23 and the engagement plate 20 and moves on the guide rails 1 and 2.

When the substrate support frame 10 moves on the guide rails 1 and 2 and on the bending parts 6 and 7, the substrate support frame 10 is tilted as follows.

First, the inclined portion 4a guides the wheel 12 and lowers it. As a result, the substrate support frame 10 is tilted downward and moved (see FIG. 6). And the wheel 11,
12 reaches the horizontal parts 6b and 4b and begins to move, the wheels 14 are guided by the inclined part 3a and begin to descend, and a part of the printed circuit board 10 supported by the board support frame 10 melts the solder (not shown). It begins to be immersed in the solder melt in the bath. At this time, since the wheels 16 are supported by U-shaped brackets and largely straddle the rail material 4, the axle does not interfere with the rail material 4, ensuring smooth movement of the board support frame 10. . Moreover, as the wheels 14 approach the horizontal portion 3b, the board support frame 1
0 gradually becomes horizontal, and the immersed area of the printed circuit board increases.

At this time, the wheel 11 is separated from the guide rail 2 and is floating in the air, but at the same time the wheels 14, 12, 13 are in contact with the guide rails 1, 2, and the drive rod 2
3 and the engagement plate 20, the stable running of the board support frame 10 is not hindered.

When the wheels 14 reach the horizontal portion 3b in this manner, the board support frame 10 becomes horizontal and the entire area of the printed circuit board is immersed in the solder melt. After this, the wheels 11 and 13 move on the horizontal part 6b and the inclined part 6c.
The wheels 12, 14 move toward the horizontal portion 4b,
3b toward the inclined part 4c, the substrate support frame 10 becomes horizontal in this part and reaches the inclined part 6.
c, 4c side (see Figure 7).
The travel time in this state is preferably about 3 seconds.

Next, when the wheel 11 is guided by the slope part 6c and starts to rise, and at the same time the wheel 12 is guided by the slope part 4c and starts to rise, the board support frame 10 gradually slopes upward and rises. start. Along with this, the printed circuit board supported by the board support frame 10 is gradually lifted out of the solder melt. When the wheels 11, 12 reach the upper ends of the slopes 6c, 4c in this way, the wheels 16 are guided by the slope 5a and begin to rise, and the printed circuit board is completely lifted from the solder melt. Although the wheels 13 are floating in the air at this time, as described above, this does not interfere with the stable running of the substrate support frame 10.

Along with such tilting movement of the substrate support frame 10,
The drive rod 23 also moves obliquely. At this time, the angle of the drive rod 23 with respect to the substrate support frame 10 gradually changes, and the vertical distance between the universal chain 22 and the guide rail gradually changes. Along with this, the engagement plate 20 rotates around the shaft 17, the engagement hole 20a changes its inclination in the same direction as the drive rod 23, and the drive rod 23 slides within the engagement hole 20a.

As explained above, the present invention provides the guide rail with two bending guide parts that are deviated in the front, back, right and left directions and directed downward, and the front and rear ends of the board support frame are guided separately to these two bend guide parts. Therefore, the angle at which the printed circuit board is immersed in the solder melt and the angle at which the printed circuit board is lifted from the solder melt can be made smaller than in the past. Moreover, according to the present invention, the time required to complete dipping the printed circuit board into the solder melt and the time required to lift it from the solder melt can be shortened compared to the conventional method, and the time during which the entire surface of the printed circuit board is immersed in the solder melt can be lengthened. Therefore, there is an advantage that good soldering can be performed.

[Brief explanation of drawings]

FIG. 1 is a partial perspective view of an automatic soldering device showing an embodiment of the present invention. FIG. 2 is a partial sectional view showing the relationship between the board support frame and the guide rail shown in FIG. 1. FIG. 3 is a wheel layout diagram showing the relationship between the wheels and guide rails shown in FIG. 1. Figure 4 shows the first
FIG. 3 is a partial perspective view showing how the engagement plate shown in the figure is attached.
FIG. 5 is a partial sectional view of the attachment portion of the engagement plate shown in FIG. 4. FIG. 6 and FIG. 7 are side views showing the moving state of the substrate support frame. 1, 2... Guide rail, 6, 7... Bent part,
8... First bending guide part, 9... Second bending guide part, 10... Board support frame, 11, 12, 13, 1
4,16...wheels.

Claims (1)

[Scope of utility model registration request] In an automatic soldering device equipped with a substrate support frame that moves downward and upward over a solder melting tank while being guided by a guide rail, the guide rail located above the solder melting tank has one rail on one side and three rails on the other side. Of the three rail materials on the other side, a central rail material and two rail materials located on both sides thereof form two bending guide portions that are out of phase in the front and rear direction, and A wheel that engages with the central rail material on the other side is disposed at the front and rear of the board support frame so as to straddle the wheel via a U-shaped bracket, and engages with two other rail materials. An automatic soldering device characterized in that a pair of wheels are provided, and the wheels are respectively guided by the two bending guide portions.