JPH0192145U - - Google Patents

Info

Publication number
JPH0192145U
JPH0192145U JP18770587U JP18770587U JPH0192145U JP H0192145 U JPH0192145 U JP H0192145U JP 18770587 U JP18770587 U JP 18770587U JP 18770587 U JP18770587 U JP 18770587U JP H0192145 U JPH0192145 U JP H0192145U
Authority
JP
Japan
Prior art keywords
side surfaces
external terminals
view
package
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18770587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18770587U priority Critical patent/JPH0192145U/ja
Publication of JPH0192145U publication Critical patent/JPH0192145U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の説明図で、aは上
面図、bはaのア―ア断面図、cは底面図、dは
キヤツプの上面図、eはキヤツプの側面図である
。第2図は従来の表面実装用パツケージの斜視図
、第3図は本考案の他の実施例の説明図、aは上
面図、bはaのイ―イ断面図、cは底面図、dは
キヤツプ上面図、eはキヤツプ側面図である。 1……外部端子、2……セラミツクケース、3
……上部ふた、4……ヒートシンク、5……セラ
ミツクケース、6―1,6―2,6―3……外部
リード端子、7……チツプ、8……キヤツプ。
Fig. 1 is an explanatory view of one embodiment of the present invention, in which a is a top view, b is a cross-sectional view of a, c is a bottom view, d is a top view of the cap, and e is a side view of the cap. . Figure 2 is a perspective view of a conventional surface mount package, Figure 3 is an explanatory diagram of another embodiment of the present invention, a is a top view, b is a sectional view of a, c is a bottom view, and d is a top view of the cap, and e is a side view of the cap. 1...External terminal, 2...Ceramic case, 3
...Top lid, 4...Heat sink, 5...Ceramic case, 6-1, 6-2, 6-3...External lead terminal, 7...Chip, 8...Cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電力用チツプを搭載するパツケージにおいて、
外部端子を底面と複数側面に設け、前記側面の外
部端子のいずれかを異なる大きさとしたことを特
徴とする高発熱用表面実装パツケージ。
In a package equipped with a power chip,
1. A surface mount package for high heat generation, characterized in that external terminals are provided on a bottom surface and a plurality of side surfaces, and any of the external terminals on the side surfaces are of different sizes.
JP18770587U 1987-12-11 1987-12-11 Pending JPH0192145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18770587U JPH0192145U (en) 1987-12-11 1987-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18770587U JPH0192145U (en) 1987-12-11 1987-12-11

Publications (1)

Publication Number Publication Date
JPH0192145U true JPH0192145U (en) 1989-06-16

Family

ID=31478838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18770587U Pending JPH0192145U (en) 1987-12-11 1987-12-11

Country Status (1)

Country Link
JP (1) JPH0192145U (en)

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