JPH0221748U - - Google Patents

Info

Publication number
JPH0221748U
JPH0221748U JP1988100283U JP10028388U JPH0221748U JP H0221748 U JPH0221748 U JP H0221748U JP 1988100283 U JP1988100283 U JP 1988100283U JP 10028388 U JP10028388 U JP 10028388U JP H0221748 U JPH0221748 U JP H0221748U
Authority
JP
Japan
Prior art keywords
heat sink
metal heat
ceramic substrates
semiconductor
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988100283U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988100283U priority Critical patent/JPH0221748U/ja
Publication of JPH0221748U publication Critical patent/JPH0221748U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第３図はそれぞれ本考案の一実施例お
よび他の実施例による放熱板付半導体容器の斜視
図、第２図は本考案の一実施例をシヤーシにネジ
止めした時の断面図、第４図は従来の半導体容器
の斜視図、第５図は従来の半導体容器をシヤーシ
にネジ止めした時の断面図である。 １，１１，１２……放熱板、２，２１，２２，
２３……溝、３１，３２……セラミツク基板、４
１，４２……キヤツプ、５１，５２，５３，５４
……リード、６１，６２……取付ネジ、７……シ
ヤーシ。 1 and 3 are perspective views of semiconductor containers with heat sinks according to one embodiment and another embodiment of the present invention, respectively, and FIG. 2 is a cross-sectional view of one embodiment of the present invention screwed to a chassis. FIG. 4 is a perspective view of a conventional semiconductor container, and FIG. 5 is a sectional view of the conventional semiconductor container screwed to a chassis. 1, 11, 12... Heat sink, 2, 21, 22,
23... Groove, 31, 32... Ceramic substrate, 4
1, 42... Cap, 51, 52, 53, 54
... Lead, 61, 62 ... Mounting screw, 7 ... Chassis.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 略長方形面の金属製放熱板に、それぞれ半導体
ペレツトを搭載した２つのセラミツク基板を近づ
けて載置し、かつ前記金属製放熱板の両端にネジ
止め用の切り込みもしくは穴を設けた構造を有し
、前記２つのセラミツク基板の間の位置の金属製
放熱板の部分に溝を設けたことを特徴とする放熱
板付半導体容器。 It has a structure in which two ceramic substrates each carrying a semiconductor pellet are placed close to each other on a metal heat sink having a substantially rectangular surface, and cuts or holes for screwing are provided at both ends of the metal heat sink. . A semiconductor container with a heat sink, characterized in that a groove is provided in a portion of the metal heat sink located between the two ceramic substrates.
JP1988100283U 1988-07-27 1988-07-27 Pending JPH0221748U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988100283U JPH0221748U (en) 1988-07-27 1988-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988100283U JPH0221748U (en) 1988-07-27 1988-07-27

Publications (1)

Publication Number Publication Date
JPH0221748U true JPH0221748U (en) 1990-02-14

Family

ID=31328226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988100283U Pending JPH0221748U (en) 1988-07-27 1988-07-27

Country Status (1)

Country Link
JP (1) JPH0221748U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219461A (en) * 2015-05-14 2016-12-22 三菱電機株式会社 High frequency high output device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016219461A (en) * 2015-05-14 2016-12-22 三菱電機株式会社 High frequency high output device

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