JPH0193438U - - Google Patents
Info
- Publication number
- JPH0193438U JPH0193438U JP18934587U JP18934587U JPH0193438U JP H0193438 U JPH0193438 U JP H0193438U JP 18934587 U JP18934587 U JP 18934587U JP 18934587 U JP18934587 U JP 18934587U JP H0193438 U JPH0193438 U JP H0193438U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- thermal head
- driving circuit
- section
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案サーマルヘツドの一実施例の要
部を示す断面図、第２図は本考案の他の実施例の
要部を示す断面図である。
１……発熱体部、２……駆動回路部、３……Ｐ
型シリコン基板、４……ｎＭＯＳ―ＦＥＴ、９…
…抵抗体、１０，１５……ポリイミド層。
FIG. 1 is a sectional view showing the main part of one embodiment of the thermal head of the present invention, and FIG. 2 is a sectional view showing the main part of another embodiment of the invention. 1...Heating element part, 2...Drive circuit part, 3...P
type silicon substrate, 4... nMOS-FET, 9...
...Resistor, 10,15...Polyimide layer.
Claims (1)
路部とを有するサーマルヘツドにおいて、 上記発熱体部と上記駆動回路部とを同一基板上
に形成したことを特徴とするサーマルヘツド。 (2) 上記発熱体部と上記駆動回路部とを低熱伝
導体層を介して熱的に分離したことを特徴とする
実用新案登録請求の範囲第１項記載のサーマルヘ
ツド。[Claims for Utility Model Registration] (1) A thermal head having a heating element and a driving circuit for driving the heating element, wherein the heating element and the driving circuit are formed on the same substrate. A thermal head characterized by: (2) The thermal head according to claim 1, wherein the heating element section and the drive circuit section are thermally separated via a low thermal conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18934587U JPH0193438U (en) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18934587U JPH0193438U (en) | 1987-12-11 | 1987-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193438U true JPH0193438U (en) | 1989-06-20 |
Family
ID=31480383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18934587U Pending JPH0193438U (en) | 1987-12-11 | 1987-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193438U (en) |
-
1987
- 1987-12-11 JP JP18934587U patent/JPH0193438U/ja active Pending