JPH0433558U - - Google Patents
Info
- Publication number
- JPH0433558U JPH0433558U JP7485190U JP7485190U JPH0433558U JP H0433558 U JPH0433558 U JP H0433558U JP 7485190 U JP7485190 U JP 7485190U JP 7485190 U JP7485190 U JP 7485190U JP H0433558 U JPH0433558 U JP H0433558U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- thin film
- heating element
- heat sink
- film substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図は本考案によるサーマルヘツドの一実施
例を示す断面図、第２図は従来のサーマルヘツド
の部分斜視図である。
１……放熱板、２……発熱体、３……薄膜用基
板、４……配線基板、５……ＩＣ、６，７……ワ
イヤボンド、８……配線、９……絶縁物。
FIG. 1 is a sectional view showing an embodiment of a thermal head according to the present invention, and FIG. 2 is a partial perspective view of a conventional thermal head. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Heating element, 3... Thin film substrate, 4... Wiring board, 5... IC, 6, 7... Wire bond, 8... Wiring, 9... Insulator.
Claims (1)
板と、配線部が形成された配線基板とを離間して
設け、薄膜用基板と配線基板との間の放熱板上に
、絶縁物を介して発熱体駆動用ＩＣを配置したこ
とを特徴とするサーマルヘツド。 A thin film substrate on which a heating element is formed on the surface and a wiring board on which a wiring part is formed are provided on a heat sink, and an insulating material is placed on the heat sink between the thin film substrate and the wiring board. A thermal head characterized in that a heating element driving IC is disposed through the thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485190U JPH0433558U (en) | 1990-07-13 | 1990-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485190U JPH0433558U (en) | 1990-07-13 | 1990-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0433558U true JPH0433558U (en) | 1992-03-18 |
Family
ID=31614909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7485190U Pending JPH0433558U (en) | 1990-07-13 | 1990-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433558U (en) |
-
1990
- 1990-07-13 JP JP7485190U patent/JPH0433558U/ja active Pending