JPH0193764U - - Google Patents
Info
- Publication number
- JPH0193764U JPH0193764U JP18893587U JP18893587U JPH0193764U JP H0193764 U JPH0193764 U JP H0193764U JP 18893587 U JP18893587 U JP 18893587U JP 18893587 U JP18893587 U JP 18893587U JP H0193764 U JPH0193764 U JP H0193764U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- adhesive layer
- wiring board
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000012787 coverlay film Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案によるフレキシブルプリント配
線板のイは断面図、ロはイにおけるＡ―Ａ切截断
面の拡大図、第２図は上記実施例における積層方
法を説明するための断面図、第３図はフレキシブ
ルプリント配線板の従来例のイは断面図、ロはイ
におけるＢ―Ｂ切截断面の拡大図、第４図は上記
従来例における積層方法を説明するための断面図
である。
１：導電パターン、２：ベースフイルム、３：
カバーレイフイルム、４：接着剤層、５：接着剤
層、８：熱硬化性接着剤層。
1 is a cross-sectional view of the flexible printed wiring board according to the present invention, B is an enlarged view of the A-A cut section in A, FIG. 3 is a cross-sectional view of a conventional example of a flexible printed wiring board, B is an enlarged view of a section taken along line B--B in A, and FIG. 4 is a cross-sectional view for explaining the lamination method in the conventional example. 1: Conductive pattern, 2: Base film, 3:
Coverlay film, 4: adhesive layer, 5: adhesive layer, 8: thermosetting adhesive layer.
Claims (1)
着剤層を介してベースフイルムとカバーレイフイ
ルムとが積層されてなるフレキシブルプリント配
線板おいて、隣接する上記導電パターン相互間の
上記各接着剤層が導電パターンを形成する金属箔
と同一厚さの熱硬化性接着剤層により接着されて
該金属箔の厚さの中心面に対して上下構造及び寸
法が対称になるよう形成されていることを特徴と
するフレキシブルプリント配線板。 In a flexible printed wiring board in which a metal foil forming a conductive pattern and a base film and a coverlay film are laminated via adhesive layers, each adhesive layer between adjacent conductive patterns is a conductive pattern. The metal foil is bonded with a thermosetting adhesive layer of the same thickness as the metal foil forming the metal foil, and is formed so that the vertical structure and dimensions are symmetrical with respect to the center plane of the thickness of the metal foil. Flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18893587U JPH0193764U (en) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18893587U JPH0193764U (en) | 1987-12-14 | 1987-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193764U true JPH0193764U (en) | 1989-06-20 |
Family
ID=31479997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18893587U Pending JPH0193764U (en) | 1987-12-14 | 1987-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193764U (en) |
-
1987
- 1987-12-14 JP JP18893587U patent/JPH0193764U/ja active Pending
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