JPH0194276A - Alignment mechanism - Google Patents
Alignment mechanismInfo
- Publication number
- JPH0194276A JPH0194276A JP25203087A JP25203087A JPH0194276A JP H0194276 A JPH0194276 A JP H0194276A JP 25203087 A JP25203087 A JP 25203087A JP 25203087 A JP25203087 A JP 25203087A JP H0194276 A JPH0194276 A JP H0194276A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- mold
- receiving stand
- work
- feed mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000013070 direct material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
ＩＣのモールド後の電気特性試験において使用される、
試験装置に装着する治具であるソケットのアライメント
機構に関する。[Detailed description of the invention] [Industrial application field] Used in electrical property testing after molding of IC,
This invention relates to an alignment mechanism for a socket, which is a jig attached to a test device.
従来のソケットは、モールドＩＣの外形寸法に近い寸法
の受け口と、コンダクターを受け台として利用していた
。Conventional sockets use a socket with dimensions close to the external dimensions of a molded IC and a conductor as a cradle.
モールドＩＣを収めた容器（以下パレット）中において
、モールドＩＣとパレットのポケットとのスキマにより
、モールドＩＣの位置がＸ、Ｙ方向に各々２〜３ｍｍず
れる。このずれがあるためアライメント機構のないソケ
ットにモールドＩＣをパレット上から供給すると位置が
合わず、モールドが斜めになり給材不良となる。従来こ
の問題の解決方法として中間位置決めを行なっている。In a container containing a molded IC (hereinafter referred to as a pallet), the position of the molded IC is shifted by 2 to 3 mm in each of the X and Y directions due to the gap between the molded IC and the pocket of the pallet. Due to this misalignment, if a molded IC is supplied from a pallet to a socket without an alignment mechanism, the position will not be aligned, and the mold will be slanted, resulting in poor material feeding. Conventionally, intermediate positioning has been used as a solution to this problem.
この中間位置決め方式の問題点として、（１）直接給材
に比ベサイクルタイムが遅い。（２）モールドＩＣの形
状が変わると中間位置決めユニットも交換する必要があ
り、切換え時間がかかる。 （３）モールドＩＣの微妙
な寸法誤差により、給材不良が出る。Problems with this intermediate positioning method include: (1) The cycle time is slow compared to direct material feeding. (2) When the shape of the molded IC changes, the intermediate positioning unit also needs to be replaced, which takes time. (3) Subtle dimensional errors in the molded IC cause material feeding defects.
Ｃ問題点を解決するだめの手段〕
テーパ状の受け口を存するガイドと、伸縮性スプリング
を内蔵し上下方向に可動なワーク受け台とを支持する保
持機構から構成され、ワーク受け台が水平状態で７−り
を受け、ワークを押え機構により垂直にソケットに収容
することを特徴とする。[Means to solve problem C] It is composed of a holding mechanism that supports a guide having a tapered socket and a workpiece holder that has a built-in elastic spring and is movable in the vertical direction, so that the workpiece holder can be held in a horizontal state. 7, and the workpiece is housed vertically in the socket by a holding mechanism.
本発明の実施例を図１を用いて以下説明する。 An embodiment of the present invention will be described below using FIG.
ソケット１には、スプリング５を保持し、止めピン４を
介し、中空円柱軸を存する、モールドＩＣ受け台６が組
み込まれているスプリング軸受ケ３と、パレットのポケ
ットより広い受け口を有するガイド７が組み込まれてい
る。まずモールドＩＣ８がパレットのポケットで生じた
Ｘ、Ｙ、 θのずれを含んで、押え搬送機構９により
吸着給材されてくる。このモールドＩＣ８は、押え搬送
機構９の吸着が切られることにより、自重落下し、ソケ
ット１に組み込まれたガイド７とモールドＩｃ受け台６
により、Ｘ、Ｙ、 θずれを完全に吸収、修正される
。更に、モールドＩＣ８はモールドＩＣ受け台により水
平に保持される。この状態から、モールドＩＣ８をソケ
ット１のコ／タクタ−２に接触するまで給材すべく、押
え搬送機構９がスプリング５よりも強い力でモールドＩ
Ｃ８を押えると、モールドＪＣ８はモールドＩＣ受け台
６とともに垂直に下降し、コンダクター２と接触給材さ
せることが出来る。The socket 1 includes a spring bearing holder 3 that holds a spring 5 and has a hollow cylindrical shaft installed therein, and a guide 7 that has a socket wider than the pocket of the pallet. It has been incorporated. First, the mold IC 8 is sucked and fed by the presser transport mechanism 9, including the X, Y, and θ deviations caused in the pocket of the pallet. This molded IC 8 falls under its own weight when the suction of the presser transport mechanism 9 is cut off, and the guide 7 incorporated in the socket 1 and the molded IC holder 6
This completely absorbs and corrects X, Y, and θ deviations. Further, the molded IC 8 is held horizontally by a molded IC holder. From this state, in order to feed the mold IC 8 until it contacts the contactor/tactor 2 of the socket 1, the presser transport mechanism 9 applies a force stronger than the spring 5 to the mold IC 8.
When C8 is pressed, the mold JC8 is vertically lowered together with the mold IC holder 6, and can be brought into contact with the conductor 2 for material supply.
本発明のアライメント機構により、パレットのポケット
に対して、位置ずれのあるモールドＩＣを、ソケットに
対し直接給材することが出来た。By using the alignment mechanism of the present invention, it was possible to directly feed a molded IC that is misaligned with respect to a pocket of a pallet into a socket.
従来の位置決め機構が不要で、既存のソケットが使える
。No conventional positioning mechanism is required and existing sockets can be used.
第１図は本発明の断面図を示したものである。
１・・・ソケット
２・・・コンダクター
３・・・スプリング軸受け
４・・・止めピン
５・・・スプリング
６・・・モールドＩＣ受け台
７・・・ガイド
８・・・モールドＩＣ
９・・・押え搬送機構
以 上
出願人 セイコーエプソン株式会社
代理人 弁理士 最 上 ＦＺ、 、他１名１”でパ
２・
岬。
ロ
スフ
覇 １ 口FIG. 1 shows a cross-sectional view of the present invention. 1... Socket 2... Conductor 3... Spring bearing 4... Stopping pin 5... Spring 6... Mold IC holder 7... Guide 8... Mold IC 9... Presser conveyance mechanism and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Mogami FZ, , and 1 other person 1” Pa 2 Misaki. Rosf Ha 1 mouth
Claims (1)
用される、ワークとしてのモールドＩＣを収容しかつ測
定するためのコンダクターを有する治具（以下ソケット
）のアライメント機構において、テーパ状の受け口を有
するガイドと、伸縮性スプリングを内蔵した上下方向に
可動なワーク受け台を支持する保持機構から構成され、
ワーク受け台が水平状態でワークを受け、ワークを押え
機構により垂直にソケットに収容することを特徴とする
アライメント機構。In the alignment mechanism of a jig (hereinafter referred to as a socket) having a conductor for accommodating and measuring a molded IC as a workpiece, which is used in the process of measuring the electrical characteristics of a molded IC, a guide having a tapered socket and a , consists of a holding mechanism that supports a vertically movable workpiece holder with a built-in elastic spring.
An alignment mechanism characterized in that a workpiece holder receives a workpiece in a horizontal state, and a holding mechanism stores the workpiece vertically in a socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25203087A JPH0194276A (en) | 1987-10-06 | 1987-10-06 | Alignment mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25203087A JPH0194276A (en) | 1987-10-06 | 1987-10-06 | Alignment mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0194276A true JPH0194276A (en) | 1989-04-12 |
Family
ID=17231606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25203087A Pending JPH0194276A (en) | 1987-10-06 | 1987-10-06 | Alignment mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194276A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57158571A (en) * | 1981-03-27 | 1982-09-30 | Hitachi Ltd | Measuring socket for small-sized semiconductor device |
| JPS58161871A (en) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | Electronic component measurement stage |
| JPS6059976B2 (en) * | 1978-12-11 | 1985-12-27 | ソシエテ フランセ−ズ デレクトロメタルルジ−−ソフレム | Method for desiliconization of manganese iron alloys |
-
1987
- 1987-10-06 JP JP25203087A patent/JPH0194276A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059976B2 (en) * | 1978-12-11 | 1985-12-27 | ソシエテ フランセ−ズ デレクトロメタルルジ−−ソフレム | Method for desiliconization of manganese iron alloys |
| JPS57158571A (en) * | 1981-03-27 | 1982-09-30 | Hitachi Ltd | Measuring socket for small-sized semiconductor device |
| JPS58161871A (en) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | Electronic component measurement stage |
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