JPH0194632A - Method of testing semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To provide a testing apparatus capable of testing an IC correctly and quickly with high accuracy while detecting presence of bent external leads in the IC and still capable of decreasing the testing cost, by applying a load which would cause the external leads to be deformed in an allowable deformation range to a package body and testing whether a planar contact section at the distal end of any external lead is contacted with an electrode pair corresponding thereto. CONSTITUTION:In order to test a plurality of external leads 2 of a semiconductor integrated circuit device (IC) whether any of the leads are bent or not, a load 5 which would cause the external lead 2 to be deformed within an allowable deformation range is applied to the package body 1 of the IC and it is electrically tested whether any of the planar contact sections 3 at the distal ends of the external leads 2 are contacted with electrode pairs 4 provided in correspondence to the external leads 2, in order to detect any bent external lead 2. For example, if the electrode pair 4 is short-circuited by the planar contact section 3 at the distal end of the corresponding external lead 2, an internal circuit 11 of the testing apparatus 11 is supplied with current and the fact can be recognized by an amperemeter. On the contrary, if the shape of the planar contact section 3 at the distal end is not appropriate, the corresponding electrode pair 4 is not short-circuited. Therefore, no current is supplied to the circuit 11 in the testing apparatus 11 and the amperemeter 7 is not actuated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the inspection of bends in external leads of, for example, small outdoor line packages (hereinafter referred to as 80F) and the like.

[Conventional technology]

Figures 4+ILI to 10 are a plan view of the 80P type machine O, a side view of a non-defective package, and a side view of a defective package, respectively.

In the figure, the package body of +11i engineering C, I2Nd
This is an external lead derived from the package body.

Current E-AJ (Japan Electronics Industry Association), JKDF
XC! (International Standard) In the final inspection of 80F according to the type regulations, the inspection for floating of the external lead 21 is performed visually.

[Problem that the invention seeks to solve]

In the conventional visual inspection of the lead 121,
Since the test is performed using human eyes, it is inaccurate, has poor accuracy, and cannot be tested quickly. To improve these issues, it is necessary to increase the number of testers, resulting in high test costs. There was a problem.

This invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to perform a bending inspection of the external lead of the process C, which enables accurate, accurate and quick inspection, and reduces the inspection cost. With the goal.

[Means for solving problems]

In the IC inspection method according to the present invention, a load that causes deformation of the external leads within the permissible deformation range is applied to the package main body in step 0, and the ends of the external leads are applied to the electrode pairs provided corresponding to the arrangement of the plurality of external leads. Inspection of whether or not the flat contact is contacted or not 〇 [action] In this invention, the external lead bend is detected by contacting the entire electrode of the plane of the external lead end. be able to.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. a shows an sOP lead 12 according to an embodiment of the present invention.
1 is a diagram showing the shape inspection method, FIG. 2 is a circuit diagram showing the configuration of the inspection device part an built in the inspection table (61),
The figure is a flow chart diagram for detecting bending of an external lead of an IC. In the figure, ... is the IO package to be inspected, (21 is the external lead of the C package fi+ to be inspected,
131#f Tip flat contact part of external lead (2), (41
is a pair of electrodes for detecting whether the tip plane contact portion (3) has the correct shape, and is provided corresponding to the arrangement of the plurality of external leads (21) of the IO package Il+ to be inspected.+61
[For the external lead +21 of the C package to be inspected, if each lead is within the allowable lead bending range, the external lead (
(31 is a load set to contact the electrode pair 141, (61 is an inspection table with a built-in inspection device unit uD, (F1 is an ammeter, (8) is a circuit protection low resistance ,
(10) is a constant voltage source.

Next, the operation of the embodiment will be explained with reference to the drawings. As shown at 6υ in FIG. 8, the position of the tip plane contact portion (31) of the workpiece to be inspected CIl+ is made to correspond to the arrangement with respect to the plurality of electrode pairs 141 and the end of the plurality of external leads fi+,
Installed on the examination table (61).

Then, as shown in (to) in FIG. 8, the external lead (load 15 that causes deformation within the allowable deformation range of 21) of the IC package main body Ill to be tested is applied to the entire IO package +11 to be tested. Next, as shown in FIG. 8 (2), the contact state between the electrode pair +41 placed on the top surface of the inspection table 161 and the tip end surface @ part (3I) of the external lead tel is inspected.

If the electrode pair (4) is short-circuited by the flat tip contact portion 131K of the external lead (21), as shown at − in FIG. Current flows.The state can be confirmed through the ammeter 171.If the tip plane contact portion 13 (as shown in Figure 3) does not have the correct shape, the electrode pair (4
1 is not short-circuited by the tip flat contact part, so the circuit OD in the inspection device section is not electrically fitted and the ammeter (71
Since the needle does not swing, bends in the external lead (21) can be detected electrically, and therefore, it is possible to easily and quickly determine whether the product is a good product or not.

In the above embodiment, the constant voltage source t1 is connected to the circuit in the inspection device sun.
01 was used, but even if the circuit is constructed using a constant current source instead of the constant voltage source (10), the same effect can be obtained by the above-mentioned embodiment and the method of Sue. Further, in the above embodiment, the case of 80F was explained, but the electrode pair +41
By changing the arrangement and number of the 80P, a similar inspection effect can be obtained for the external leads of surface mount type IC packages other than 80P.

〔Effect of the invention〕

As described above, according to the present invention, the ends of the external leads are fixed to the electrode pairs provided corresponding to the arrangement of the plurality of external leads in a load combination that causes deformation within the permissible deformation range of the IC package body and the external leads. Since it is detected whether or not the flat end contact portion of the IC makes contact, it is possible to accurately and inexpensively inspect the external leads of the IC.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing an apparatus for inspecting bending of external leads with 0 steps according to an embodiment of the present invention, FIG. 2 is a circuit diagram of the inspection and manufacturing section of the inspection apparatus shown in FIG. 1, and FIG. Flowchart showing the operation of Figure 4, 1al, ftn, +ol
A plan view of the Heop IC, a diagram showing the entire shape of the tip flat contact part 131 of the external lead (2) of the good product so'pIC, and a deformation of the tip flat contact part 13 of the external lead +21 of the defective package. FIG. In the figure, ... is the semiconductor integrated circuit device package body,
(21 is the external lead, 131 is the tip surface shaft, +41
is an electrode pair, 16+ is a load, 16) is an inspection table, (7) is an ammeter, (81 is a circuit protection resistor, (9) is a switch, fl
ol is a constant voltage source, and a is an inspection device section. In addition, the same reference numerals in the drawings indicate the parts corresponding to the same - or //'i.

Claims (1)

[Claims] In an inspection to detect bending of a plurality of external leads of a semiconductor integrated circuit device (hereinafter referred to as an IC), a load that causes deformation of the external leads within an allowable deformation range is applied to the package body of the IC, and the arrangement of the external leads is changed. A semiconductor integrated circuit characterized in that bending of the external lead is detected by electrically inspecting whether or not a planar contact portion at the tip of the external lead is in contact with a correspondingly provided electrode pair. How to test equipment.