JPH0195530A - Carrier system - Google Patents

Abstract

PURPOSE:To prevent foreign materials from sticking to a carrying load by spraying fluid to form a flow layer on the surface of a flow layer formation materials and by carrying the load upon the flow layer. CONSTITUTION:When fluid 8 is sprayed onto the surface of a flow layer formation materials 6, fluid 8 is bent along the surface of the flow layer formation materials 6 and a flow layer 9 of fluid 8 is formed thereon because of the friction with a wall surface and the inner friction through fluid 8 due to the viscosity. If a carrying load is put on the flow layer 9, the load is supported floating above the flow layer formation materials 6 through the flow layer 9, and the load is carried along the flow layer. Since the flow of fluid 8 is formed along the flow layer formation materials 6 in carrying, the load is prevented neither from being lifted to the upper surface nor from disturbing a vertical downward layer flow. Foreign materials are thus prevented from sticking to the load.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a transport technology, particularly a technology for transporting objects to be transported through a fluid layer.For example, in the manufacturing process of semiconductor devices, wafers, masks, etc. This invention relates to a technique that is effective for transporting plate-shaped objects such as.

[Conventional technology]

In the manufacturing process of semiconductor devices, a large number of air outlets are provided on a horizontally laid conveyor floor as a transfer device for transferring wafers. There is an air conveyor configured to transport the wafer while floating it above the transport floor by supporting the wafer from below.

An example of the technology for transporting wafers using an air conveyor is given in "Electronic Materials 19" published by Kogyo Choseikai Co., Ltd.
January 1982 special edition” published November 18, 1982 P
There are 109 to P116.

[Problem that the invention seeks to solve]

In such a transfer device, air is blown upward, so air gets caught on the top surface of the wafer during transfer, and the vertical downward laminar flow in the clean room is disturbed. The inventor of the present invention has revealed that there is a problem in that foreign matter adheres to the upper surface of the wafer.

An object of the present invention is to provide a transport device that can prevent foreign matter from adhering to objects to be transported.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

An overview of typical inventions disclosed in this application is as follows.

That is, a fluid is sprayed onto the surface of the flow layer forming member, and this fluid is bent along the surface to form a flow layer of the fluid on the surface of the flow layer forming member, and the transported object is transported on this flow layer. It is configured to be transported.

[Effect]

When fluid is sprayed onto the surface of the flow layer forming member, due to its viscosity, friction with the wall surface and internal friction between the fluids causes
Since the fluid is bent along the surface of the flow layer forming member,
A fluid flow layer is formed on the surface of the flow layer forming member. When an object is placed on this flow layer, the object is supported in a floating state from the flow layer forming member via the flow layer, so that the object is transported along the flow layer. become.

During conveyance, the fluid flow is formed along the flow layer forming member, so that the phenomenon of the fluid being rolled up on the upper surface of the conveyed object and the phenomenon of disturbing the vertical downward laminar flow are suppressed.

[Embodiment 1] FIG. 1 is an enlarged partial front cross-sectional view showing a wafer transfer device according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

In this embodiment, this transport device is equipped with a transport path 2 for transporting a wafer l as an object to be transported in one direction, and a transport path is substantially configured on one side of this transport path 2. A support member 3 for laying the flow layer forming member 6 is constructed using a shaped steel material or the like. That is, the flow layer forming member is made of a material that does not generate dust, such as stainless steel, and is formed into a pipe shape with a perfect circular cross section.
A plurality of rods are laid side by side in the conveyance direction, arranged in a predetermined pinch, with both ends aligned and parallel to each other, and one end of the rods is supported substantially horizontally by a support member 3. ing.

An air supply pipe 5 is installed on the other side of the conveyance path 2.
The piping 5 is connected to the other end surface of the flow layer forming member 6 so that air can be uniformly supplied into the hollow portion thereof. An air supply bag W4 is connected to the piping 5 on the other side, and the supply device 4 is configured to supply purified air by appropriately adjusting the flow rate, flow pressure, and flow rate. There is.

Each flow layer forming member 6 has a plurality of blowing lowers for blowing out air 8 as a fluid, each of which is provided so as to blow air toward the upper curved surface of the adjacent flow layer forming member 6 downstream in the conveying direction. At the same time, air blown from the upstream air outlet is blown out from the downstream air outlet in the air blowing lowers 7 provided in the flow layer forming members 6 and 7 adjacent to each other on the upstream and downstream sides of the conveyance direction. They are arranged alternately so as not to interfere with the air flow. Further, each blow-off lower is appropriately set so that the air blown out is as uniform as possible over the entire conveyance path 2.

Next, the effect will be explained.

When transporting the wafer 1, purified air 8 is supplied from the air supply device 5 through the piping 4 to the group of flow layer forming members 6. The supplied air 8 is blown out from the blowing lower group of each flow layer forming member 6 toward the upper curved surface of the adjacent flow layer forming member 6 downstream in the conveying direction.

When air is blown onto the upper curved surface of the flow layer forming member 6, due to its viscosity, the air is bent along the upper curved surface of the flow layer forming member due to friction with the surface of the flow layer forming member 6 and internal friction between the air. and the flow layer forming member 6;
Due to this air flow blowing downward through the space between the adjacent flow layer forming member 6 downstream,
Nine groups of air flow layers are formed along the upper curved surface of each flow layer forming member 6, respectively.

Here, since the air 8 blown out from the blowing lower is diffused in a fan shape, the air flow layer 9 formed on the upper curved surface of each flow layer forming member 6 forms an appropriate area.

In addition, since the blowout lowers and the 7-piece spacings provided in the flow layer forming members 6 and 6 that are adjacent to each other in the upstream and downstream directions in the conveyance direction are alternately staggered, the blowoff is emitted from the upstream blowout lower. The air 8 thus generated is blown onto the upper curved surface between the blowing lower and 7 in the flow layer forming member 6 located downstream, and is blown downward through the gap adjacent thereto.

Therefore, the air flow layer 9 formed on the upper curved surface of the flow layer forming member 6 located downstream by the air blown from the upstream blowing lower is the same as the air flow layer 9 formed on the upper curved surface of the flow layer forming member 6 located further downstream from the flow layer forming member 6. The air 8 blown toward the member 6 is not interfered with, and is properly formed in a uniform laminar flow state.

In this way, when the air flow layer 9 group is properly formed and stabilized on each flow layer forming member 6, the wafer l as the object to be transported is placed on the air flow layer 9 at the upstream position of the transport path 2. Ru.

The wafer l placed on the air flow layer 9 is supported by the air flow layer 9 and is lifted from the flow layer forming member 6, and the upper part of the air flow layer 9 that is blown onto the lower surface of the wafer l Since the air flow applies a force in the downstream direction of the conveyance path 2, the air flow layer 9
It is transported downstream on the group.

During transportation, the air in the air flow layer 9 blows downward along the upper curved surface of the flow layer forming member 6, so that the air for floating the wafer l that is being transported does not get caught up in the upper surface of the wafer l. Therefore, the attachment of foreign matter caused by the phenomenon in which air is drawn into the upper surface of the wafer 1 is prevented.

Further, in the manufacturing process of semiconductor devices, the wafer 1 is handled in a clean room, and a vertical downward laminar flow is formed in the clean room to reduce foreign matter. However, if the transport path is a blind plate and the air for lifting the wafer is blown upward, the vertical downward laminar flow will be disturbed, increasing the risk of foreign matter adhering to the upper surface of the wafer.

However, in this embodiment, since the conveyance path 2 is formed by a plurality of flow layer forming members 6, a passageway is formed between adjacent flow layer forming members 6, 6. The vertical downward laminar flow in the clean room blows through from between the flow layer forming members 6.6 without being disturbed.

In addition, the air for floating the wafer l is not blown upward, but is blown along the upper curved surface of the flow layer forming member 6 and blown downward, so that the vertical downward laminar flow in the clean room is The flow will blow through from between the flow layer forming members 6.6 without being disturbed by this. Therefore, the adhesion of foreign matter caused by the disturbance of the vertical downward laminar flow in the clean room is prevented. That will happen.

According to the embodiment described above, the following effects can be obtained.

(11) By spraying the fluid onto the surface of the flow layer forming member, a flow layer of this fluid can be formed on the surface of the flow layer forming member. The conveyed object can be conveyed in a floating state from the flow layer forming member.

(2) By floating and conveying the object by the flow layer formed on the flow layer forming member, the flow layer is bent along the flow forming member and blows downward, so the fluid in this flow layer It is possible to prevent foreign matter from being caught on the upper surface of the transported object, and it is possible to prevent foreign matter from adhering to the upper surface of the transported object.

(3) By arranging the flow layer forming members side by side and forming the flow layer atrium so that the spaces are adjacent to each other,
The atrium of a clean room with a vertically downward laminar flow can form a space, which can prevent the air used to levitate objects from disturbing the vertically downward laminar flow.
As a result, it is possible to prevent foreign matter from adhering to the transported object.

[Embodiment 2] FIG. 3 is a plan view showing a wafer transfer apparatus which is Embodiment 2 of the present invention.

The difference between the second embodiment and the first embodiment is that the conveyance path 2A is bent at a right angle. That is, the conveyance path 2A
At the bending part, the flow layer forming member 6A# on the front side of the bend is configured such that the end on the inner side of the bend becomes gradually shorter as it goes in the conveying direction, and the flow layer forming member 6B group on the back side of the bend is on the inner side of the bend. The ends of the paper are arranged so that the ends of the paper are arranged in rows (and therefore gradually become longer) in the conveying direction.

In this embodiment, when the wafer 1 reaches a bend in the transport path 2A, the flow layer 9 of the flow layer forming member 6A on the front side of the bend
From the group, the flow layer forming member 6B on the rear side of the bend orthogonal thereto.
The flow layer forming member 6 on the rear side of the bend moves to the flow layer 9 group.
A is sent out in the conveyance direction by the flow in flow N9 (.

(Embodiment 3) FIG. 4 is a longitudinal cross-sectional view showing a wafer transfer apparatus which is Embodiment 3 of the present invention.

In the third embodiment, the flow layer forming member 10 is formed in the shape of a wing, and the air supply pipe 11 is disposed close to the front side of the flow layer forming member 10 at an appropriate location, and this pipe An air outlet 12 is provided at 11 so as to blow air onto the front edge of the flow layer forming member IO.

In Example A, when the air 13 is blown onto the airfoil-shaped flow layer forming member lO, the air 13 is blown onto the flow layer forming member lO.
By flowing in a laminar state over the upper surface of the blade, a flow layer 14
is formed.

The air that has formed the flow layer 14 is transferred to the flow layer forming member lO of the next stage.
A flow layer 14 is formed on the flow layer forming member 10 by being blown onto the flow layer and flowing in a laminar flow over the upper surface of the blade.

In this way, the flow layer 1 formed in each flow layer forming member 1G
When the wafer 1 is placed on the wafer 4, the wafer 1 is transported in the same manner as in the first embodiment. Further, its operation and effects are substantially the same as those of the first embodiment.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the shape, structure, and arrangement of the flow layer forming member, the shape and structure of the outlet for spraying fluid onto the flow layer forming member,
The arrangement, etc. is not limited to the above-mentioned embodiments, but is desirably selected appropriately depending on various conditions such as the weight and size of the object to be transported, the clean room condition, etc.

Further, it is desirable that the pitch of the flow layer forming member, the size of the air outlet, the air pressure, the air speed, the air volume, etc., be configured to be freely adjustable.

The configuration is not limited to using the flow force of air forming a flow layer as the biasing force for sending the conveyed object in one direction, and an air outlet dedicated to the feeding force, a linear motor, etc. may be provided.

The fluid for forming the flow layer is not limited to clean air, but may also be a gas such as nitrogen gas or a liquid such as pure water.

Furthermore, in order to suppress separation of the fluid at the upper surface of the flow layer forming member on which the fluid flow layer is formed, as much as possible,
Fur or the like may be attached to the upper surface of the flow layer forming member.

In the above explanation, the invention made by the present inventor was mainly applied to the wafer transport technology, which is the background field of application. It can be applied to transport devices for transporting masks and transport devices for transporting articles in other fields in general. In particular, the conveyance device according to the present invention exhibits excellent effects when used to convey plate-shaped objects.

[Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly explained as follows.

By spraying the fluid onto the surface of the flow layer forming member,
Since a flow layer of this fluid can be formed on the surface of the flow layer forming member, by placing the object on top of this flow layer, the object can be floated from the flow layer member. It can be transported by

[Brief explanation of the drawing]

FIG. 1 is an enlarged partial front cross-sectional view showing a wafer transfer device according to an embodiment of the present invention, and FIG. 2 is a plan view thereof. . FIG. 3 is a plan view showing a wafer transfer device according to a second embodiment of the present invention. FIG. 4 is a longitudinal cross-sectional view showing a wafer transfer device according to a third embodiment of the present invention. l...Wafer (object to be transported), 2.2A...transport path,
3... Support member, 4... Air supply device, 5 River air supply piping, 6... Flow layer forming member, 7... Air outlet, 8
...Air (fluid), 9...Air flow layer, IO...
Flow layer forming member, 11... Air supply piping, 12...
Air outlet, 13...Air, 14...Air flow layer. Agent: Patent attorney Tatsuya Kajihara.

Claims (1)

[Claims] 1. A fluid is sprayed onto the surface of the flow layer forming member and bent along the surface, so that a flow layer of the fluid is formed on the surface of the flow layer forming member. A conveying device characterized in that it is configured so that an object to be conveyed is conveyed on a layer. 2. The flow layer forming member is formed in the shape of a pipe with a curved surface, and a plurality of flow layer forming members are laid side by side, and the fluid supplied to the hollow part of the pipe is passed through a blower provided in the wall of the pipe. 2. The conveying device according to claim 1, wherein the conveying device is configured to spray from the outlet onto adjacent curved surfaces of the pipes. 3. The conveyance device according to claim 2, wherein the blow-off ports opened in the flow layer forming members are arranged alternately between adjacent flow layer forming members.