JPH0195637U - - Google Patents

Info

Publication number
JPH0195637U
JPH0195637U JP19191987U JP19191987U JPH0195637U JP H0195637 U JPH0195637 U JP H0195637U JP 19191987 U JP19191987 U JP 19191987U JP 19191987 U JP19191987 U JP 19191987U JP H0195637 U JPH0195637 U JP H0195637U
Authority
JP
Japan
Prior art keywords
thermocouple
wavy
mounting structure
guide tube
spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19191987U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19191987U priority Critical patent/JPH0195637U/ja
Publication of JPH0195637U publication Critical patent/JPH0195637U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の実施例である熱電対の取り
付け構造を示す断面図、第2図は、本考案になる
他の実施例を示す断面図である。 1……案内管、11,12……取り付けネジ、
2……シース熱電対、21……先端部、22……
取り付けネジ部、23……中間部の波状部、23
′……中間部の螺旋状部。
FIG. 1 is a cross-sectional view showing a thermocouple mounting structure according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing another embodiment of the present invention. 1... Guide tube, 11, 12... Installation screw,
2...Sheath thermocouple, 21...Tip, 22...
Mounting screw part, 23... Wavy part in the middle part, 23
′...Middle spiral part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 測温接点と少なくとも二種類の熱電対素線を絶
縁物を介してシース内に封入した熱電対と、被温
度測定部に挿入、固定されその内部に前記熱電対
を案内、保護する案内管とから成る熱電対の取り
付け構造において、前記熱電対の少なくとも一部
は波状あるいは螺旋状に成形され、この熱電対の
波状あるいは螺旋状部が前記案内管の内壁面に接
触していることを特徴とする熱電対の取り付け構
造。
A thermocouple in which a temperature measuring junction and at least two types of thermocouple wires are enclosed in a sheath via an insulator, and a guide tube that is inserted into and fixed to a temperature measurement target part and guides and protects the thermocouple therein. In the thermocouple mounting structure, at least a portion of the thermocouple is formed into a wavy or spiral shape, and the wavy or spiral portion of the thermocouple is in contact with the inner wall surface of the guide tube. Thermocouple mounting structure.
JP19191987U 1987-12-17 1987-12-17 Pending JPH0195637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19191987U JPH0195637U (en) 1987-12-17 1987-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19191987U JPH0195637U (en) 1987-12-17 1987-12-17

Publications (1)

Publication Number Publication Date
JPH0195637U true JPH0195637U (en) 1989-06-23

Family

ID=31482803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19191987U Pending JPH0195637U (en) 1987-12-17 1987-12-17

Country Status (1)

Country Link
JP (1) JPH0195637U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185766A (en) * 2009-02-12 2010-08-26 Kobelco Eco-Solutions Co Ltd Stirring apparatus
CN114427917A (en) * 2020-10-29 2022-05-03 株式会社国际电气 Temperature sensor, heater unit, substrate processing apparatus, method for manufacturing semiconductor device, and storage medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010185766A (en) * 2009-02-12 2010-08-26 Kobelco Eco-Solutions Co Ltd Stirring apparatus
CN114427917A (en) * 2020-10-29 2022-05-03 株式会社国际电气 Temperature sensor, heater unit, substrate processing apparatus, method for manufacturing semiconductor device, and storage medium
JP2022072048A (en) * 2020-10-29 2022-05-17 株式会社Kokusai Electric Temperature sensor, heater unit, substrate processor, and method for manufacturing semiconductor device

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