JPH0195764U - - Google Patents
Info
- Publication number
- JPH0195764U JPH0195764U JP1987193189U JP19318987U JPH0195764U JP H0195764 U JPH0195764 U JP H0195764U JP 1987193189 U JP1987193189 U JP 1987193189U JP 19318987 U JP19318987 U JP 19318987U JP H0195764 U JPH0195764 U JP H0195764U
- Authority
- JP
- Japan
- Prior art keywords
- receiving element
- light
- element array
- integrated circuit
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図ａ，ｂは本考案のイメージセンサの平面
図、及び断面図。第２図ａ，ｂは従来装置の平面
図、及び断面図である。
１，１１……税縁基板、２，１２……非晶質半
導体、３，１３……個別電極、４，１４……共通
電極（透明電極）、５，１５……受光素子列、６
，１６……ドライバーＩＣチツプ、７……Ａｕワ
イヤ、８……樹脂、９……Ａｕ膜、１７……埋め
込み孔、１０，２０……ＩＣ電極パツド部、１９
……金属薄膜電極、１８……ボンデイング領域、
２１……接続部領域。
FIGS. 1a and 1b are a plan view and a sectional view of the image sensor of the present invention. FIGS. 2a and 2b are a plan view and a sectional view of a conventional device. 1, 11... Tax-edge substrate, 2, 12... Amorphous semiconductor, 3, 13... Individual electrode, 4, 14... Common electrode (transparent electrode), 5, 15... Light receiving element array, 6
, 16... Driver IC chip, 7... Au wire, 8... Resin, 9... Au film, 17... Buried hole, 10, 20... IC electrode pad portion, 19
...Metal thin film electrode, 18...Bonding area,
21... Connection area.
Claims (1)
素子列を順次駆動させる単結晶半導体集積回路を
接着し、該集積回路と受光素子列との接続を導電
性膜電極で行なう事を特徴としたイメージセンサ
。 A single-crystal semiconductor integrated circuit for sequentially driving the light-receiving element array is bonded onto an insulating substrate on which the light-receiving element array is formed, and the integrated circuit and the light-receiving element array are connected by conductive film electrodes. image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987193189U JPH0195764U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987193189U JPH0195764U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195764U true JPH0195764U (en) | 1989-06-26 |
Family
ID=31484001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987193189U Pending JPH0195764U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195764U (en) |
-
1987
- 1987-12-18 JP JP1987193189U patent/JPH0195764U/ja active Pending
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