JPH0197501U - - Google Patents
Info
- Publication number
- JPH0197501U JPH0197501U JP19523587U JP19523587U JPH0197501U JP H0197501 U JPH0197501 U JP H0197501U JP 19523587 U JP19523587 U JP 19523587U JP 19523587 U JP19523587 U JP 19523587U JP H0197501 U JPH0197501 U JP H0197501U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heat sink
- electronic components
- attaching
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案に係る電子部品の基板への取付
構造を示す斜視図、第２図は本考案に係る電子部
品の基板への取付構造に使用される放熱板の図面
であつて、ａは斜視図、ｂは平面図、ｃは側面図
、第３図は電子部品が取り付けられる基板の平面
図、第４図は第１図のａ部の拡大断面図、第５図
はスリーブを利用して基板に電子部品を取り付け
る従来の電子部品の基板への取付構造を示す斜視
図である。
１０…放熱板、１２１…バーリング孔、１２２
…爪、２０…抵抗器（電子部品）、２１…リード
、３０…基板。
FIG. 1 is a perspective view showing a structure for attaching electronic components to a substrate according to the present invention, and FIG. 2 is a drawing of a heat sink used in the structure for attaching electronic components to a substrate according to the present invention. is a perspective view, b is a plan view, c is a side view, Fig. 3 is a plan view of the board to which electronic components are attached, Fig. 4 is an enlarged sectional view of part a in Fig. 1, and Fig. 5 is a sleeve used. FIG. 2 is a perspective view showing a conventional electronic component mounting structure for mounting an electronic component on a board. 10... Heat sink, 121... Burring hole, 122
...nail, 20...resistor (electronic component), 21...lead, 30...board.
Claims (1)
付構造であつて、前記放熱板にはバーリング孔と
バーリング孔の周囲に形成された爪とを有してお
り、前記爪を基板のホールに遊嵌可能にしたこと
を特徴とする電子部品の基板への取付構造。 The mounting structure is for attaching an electronic component to a board via a heat sink, and the heat sink has a burring hole and a claw formed around the burring hole, and the claw is loosely fitted into the hole of the board. A structure for attaching electronic components to a board, which is characterized by making it possible to attach electronic components to a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19523587U JPH0197501U (en) | 1987-12-22 | 1987-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19523587U JPH0197501U (en) | 1987-12-22 | 1987-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197501U true JPH0197501U (en) | 1989-06-29 |
Family
ID=31485921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19523587U Pending JPH0197501U (en) | 1987-12-22 | 1987-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197501U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11340666A (en) * | 1998-05-28 | 1999-12-10 | Diamond Electric Mfg Co Ltd | Cooling system |
| WO2012077459A1 (en) * | 2010-12-07 | 2012-06-14 | ルビコン株式会社 | Capacitor, method for producing capacitor, and substrate provided with circuit |
| JP2014055848A (en) * | 2012-09-12 | 2014-03-27 | Hioki Ee Corp | Frequency characteristic correction structure heat discharge structure of voltage input resistance part in voltage measurement device |
-
1987
- 1987-12-22 JP JP19523587U patent/JPH0197501U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11340666A (en) * | 1998-05-28 | 1999-12-10 | Diamond Electric Mfg Co Ltd | Cooling system |
| WO2012077459A1 (en) * | 2010-12-07 | 2012-06-14 | ルビコン株式会社 | Capacitor, method for producing capacitor, and substrate provided with circuit |
| JPWO2012077459A1 (en) * | 2010-12-07 | 2014-05-19 | ルビコン株式会社 | Capacitor, capacitor manufacturing method, and circuit board |
| JP2014055848A (en) * | 2012-09-12 | 2014-03-27 | Hioki Ee Corp | Frequency characteristic correction structure heat discharge structure of voltage input resistance part in voltage measurement device |