JPH0198978A - Testing instrument for electronic parts - Google Patents

Abstract

PURPOSE:To perform a stable test by installing a test rack in a laboratory so that a substrates goes to the vertical direction, and preventing dewdrop water from flowing in between terminals of a connector. CONSTITUTION:A connector 7 is provided on the upper part of a test rack 15, a substrate 8 is attached to the lower face of the connector 7 and the test rack 15 is installed in a laboratory 3 so that the substrate 8 goes to the vertical direction. In such a way, since the test rack 15 is constituted of only a rod-like frame body, humidity and temperature are distributed uniformly and quickly extending over the whole area in the laboratory 3. Accordingly, even when many semiconductor devices to be tested 9 have been contained, their test conditions go to roughly equal, and a test having high reliability can be performed. Also, since the substrate 8 is installed in the vertical direction, dewdrop water generated due to a temperature difference is conveyed through the surface of the substrate 8 and drops down onto a test base 5. Therefore, water and contamination do not flow in between terminals of the connector 7, and accordingly, a short circuit accident between the terminals does not occur and a stable test can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a testing device for electronic components such as semiconductor devices.

Conventional Technology Traditionally, high (low) temperature tests and pressure chamber tests have been used to confirm the reliability of semiconductor devices by storing them in a sealed test chamber and changing at least the temperature inside the test chamber. Tests such as THB (high temperature and high humidity bias test) are known.

FIG. 3 shows a conventional test device used for this type of test.

In Figure 3, 1 is a test tank, 2 is a test tank lid that covers the top surface of the test tank, 3 is a test chamber inside test tank 1, 4 is a dew drop prevention car installed above test chamber 3, and 5 is a test tank. 1 is a sample stand installed on the bottom surface, 6 is a test rack installed on the sample stand 5,
7 is a connector provided at the bottom of the test rack 6; 8 is a board inserted into the connector 7; 9 is a semiconductor device under test attached to the board 8; 10 is a power supply unit installed outside the test tank 1; 11 is a connecting wire that connects the power supply unit 10 and the connector 7, 12 is humidifying water injected into the bottom of the test chamber 3, and 13 is a humidifier for heating the humidifying water 12 to increase the humidity in the test chamber 3. A heater 14 is provided around the outside of the test chamber 1 and is a heater for controlling the temperature inside the test chamber 3.

FIG. 4 shows the vicinity of the test rack 6 shown in FIG. 3. The test rack 6 includes a side plate 6a for holding a plurality of substrates 8, and a front plate 6b and a rear plate 6C provided at both ends of the side plate 6a. A connector 7 is provided at the bottom of this test rack 6, and one end of a board 8 is inserted into a groove (not shown) provided on the top surface of this connector 7. As a result, a plurality of terminals (not shown) provided in the groove of the connector 7 and a terminal (not shown) provided at the end of the substrate 8 come into contact and are electrically connected. The test rack 6 is placed on the sample stage 5 with the connector 7 facing downward, as shown in FIG.

To explain the test method using this test device, as shown in FIG. 4, a test rack 6 to which a substrate 8 and a semiconductor device under test 9 are fixed is placed on a sample stage 5 as shown in FIG. The dew drop prevention car 4 is placed and the test chamber lid 2 is closed to seal the test chamber. Then, the humidity and temperature in the test chamber 3 are increased by the humidifying heater 13 and the heating heater 14. When the humidity and temperature in the test chamber 3 have reached the desired values and are thought to be stable, the power supply unit 10 is operated, and the connecting wire 11, connector 7, and board 8 (more precisely, the Power is supplied to the semiconductor device under test 9 via printed wiring, etc.). In this way, the operating characteristics and the like of the semiconductor device under test 9 under predetermined conditions (humidity and temperature) can be tested.

Problems to be Solved by the Invention However, in such a conventional testing device, a connector 7 is provided on the bottom surface of the test rack 6, one end of the board 8 is inserted into the top surface of the connector 7, and the connector is placed on the sample stage 5. Since the test rack 6 is installed with the test rack 7 facing downward, the temperature inside the test room 3 may increase due to the temperature rise inside the test room 3.
Condensed water generated due to a temperature difference between the internal temperature and the temperature of the test rack 6, connector 7, board 8, etc., or dew condensed water generated by humidification flows between the terminals of the connector 7. In addition, condensation water and dirt on the surface of the board 8 also flow between the terminals of the connector 7. If power is supplied to the semiconductor device under test 9 in this state, the insulation resistance between the terminals of the connector 7 will be low, resulting in a short circuit accident. THB (High Temperature High Humidity Bias Test) is considered to be an effective test.
This makes bias application tests such as pressure and pressure tests extremely difficult.

The present invention provides an electronic component testing device that solves these conventional problems.

Means for Solving the Problems The present invention provides a connector on the top of a test rack, attaches a board to the bottom of this connector, and installs the test rack in the test room with the board oriented vertically. .

By doing this, condensed water or dirt on the board surface caused by the temperature difference will not flow between the terminals of the connector. This prevents short-circuit accidents from occurring during power supply.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.

In FIGS. 1 and 2, the same parts as in FIGS. 3 and 4 are given the same reference numerals, and their explanations will be omitted. Reference numeral 15 denotes a test rack, which is composed of a frame made of a rod-shaped member made of stainless steel or the like. A connector 7 is attached to the top of this test rack 15. Although not shown, a groove is provided on the lower surface of the connector 7, and a plurality of terminals are provided within this groove. When the upper end of the board 8 is inserted into the groove of the connector 7, the terminals of the connector 7 and the terminals provided at the upper end of the board 8 come into contact, thereby electrically and mechanically connecting the board 8 to the connector 7. be done.

The test rack 15 with the substrate 8 attached in this manner is placed on the sample stage 5 so that the connector 7 is positioned upward, as shown in FIG. After that, place the dew drop prevention car 4,
The test chamber lid 2 is closed to seal the test chamber 3, and the humidity and temperature inside the test chamber 3 are increased using the humidifying heater 13 and the heating heater 14.

Then, the humidity and temperature in test chamber 3 reach the desired values,
At the point when it seems stable, the power supply unit 10 is operated to supply power to the semiconductor device under test 9.

In this way, since the test rack 15 is made up of only a rod-shaped frame, the test rack 15 is less likely to interfere with changes in the airflow in the test chamber 3 during humidification and heating, and therefore the humidity and The temperature is uniformly and rapidly distributed throughout the test chamber 3. Therefore, even when a large number of semiconductor devices 9 under test are housed, their test conditions are almost the same, making it possible to perform highly reliable tests and improve test efficiency. In addition, since the connector 7 is installed above and the board 8 inserted into the bottom surface is installed vertically, the dew water generated due to the temperature difference flows along the surface of the board 8 and reaches the sample stage 5.
fall on top. Therefore, water and dirt will not flow between the terminals of the connector 7, and short-circuit accidents between the terminals will therefore be eliminated.

Note that although the above embodiments described testing of semiconductor devices, the present invention can also be applied to testing of electronic components other than semiconductor devices.

Effects of the Invention In the present invention, a connector is provided at the top of the test rack, a board is attached to the bottom of the connector, and the test rack is installed in the test room with the board oriented vertically, so that temperature differences, etc. This prevents condensation water from flowing between the connector terminals, making it possible to perform stable tests.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the electronic component testing apparatus of the present invention, and FIG. 2 is a perspective view showing the vicinity of the test rack in FIG. 1.
Figure 3 is a sectional view showing a conventional electronic component testing device;
This figure is a partially cutaway perspective view showing the vicinity of the test rack shown in FIG. 3. 1...Test tank, 3...Test chamber, 5...
...Sample stand, 7...Connector, 8...
. . . Substrate, 9 . . . Semiconductor device under test, 10.
...Power supply unit, 11...Connection wire,
12... Humidifying water, 13... Humidifying heater, 14... Heating heater, 15...
...Test rack.

Claims (1)

[Claims] A connector is provided on the top of the test rack, a board is attached to the bottom of this connector, the electronic component to be tested is attached to this board, and the test rack is installed in the test chamber of the test chamber so that the board is positioned vertically. A testing device for electronic components, characterized in that power is supplied to the electronic component under test via the connector and the board.