JPH0199244A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor integrated circuit device which is easily screened by providing an observation window made of transparent ceramics or glass on an inner semiconductor chip. CONSTITUTION:An observation window 6 made of transparent ceramics of glass is provided on a semiconductor chip 2 in a case. Then, the chip 2 can be observed from an exterior in a state that a protection cover 7 is not attached during screening. Accordingly, surface change, i.e., a crack, a discolor, bent of wiring, etc., generated in the chip 2 due to mechanical, electrical stress to be applied can be detected by a visual observation. Thus, a semiconductor integrated circuit device which can be easily screened is obtained.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor integrated circuit device.

[Conventional technology]

3 and 4 are cross-sectional structural diagrams of conventional highly reliable semiconductor integrated circuit devices, respectively, in which a semiconductor chip 2 is mounted in a ceramic case 14 or a metal can case 11, and a bonding wire 3 is connected to a terminal of the case. 4 and the chip, and a ceramic cap 15 or a metal cap 16 is attached to the case by thermocompression bonding or welding for sealing. In this case, a highly reliable ceramic or metal case is used as the encapsulant, and a variety of screenings including mechanical, thermal, and electrical tests are performed to eliminate defective products. Yes, it has achieved high reliability.

[Problem that the invention seeks to solve]

As mentioned above, conventional high reliability semiconductor integrated circuit devices are
Higher reliability has been obtained by performing various screenings, but these screenings do not apply mechanical, thermal, or electrical stress to the semiconductor chip 2, which may cause the chip to deteriorate prematurely. The purpose of this test is to expose any underlying defects within the testing period. Therefore, depending on the degree of screening, there is a possibility that even a good element itself may be deteriorated, and it is difficult to determine whether or not an inherent defect has completely surfaced through screening.

Therefore, in order to obtain truly high reliability, the only selection method that can be used is to repeatedly screen a large number of devices and use a small number of surviving devices. Moreover, it is even determined whether any of the obtained elements will become defective in the future (means for solving the problem). According to the present invention, a semiconductor integrated circuit device having a structure in which a semiconductor chip is placed in a case The method includes forming an observation window made of transparent ceramic or glass on the semiconductor chip inside the case.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a cross-sectional structural diagram of a semiconductor integrated circuit device showing one embodiment of the present invention. According to this embodiment, a semiconductor chip 2 is mounted inside a ceramic case 1 provided with screw holes, the chip 2 and terminals 4 are connected by bonding wires 3, and a transparent ceramic or glass window 6 is provided. A protective cover 7 is attached to the case 1 with screws 8 so as to cover the entire cap. Here, 9 and 10 represent a nut and a washer, respectively.

The semiconductor integrated circuit device of the present invention having the structure shown in the above-mentioned examples q and 9 is capable of reducing mechanical, thermal, and Surface changes caused to the chip 2 due to electrical stress, i.e.
Discoloration, constriction of the wiring, deformation, and deformation of the bonding wire 3 can be visually detected, so surface observation can detect υ before electrical defects occur due to these changes.
It becomes possible to remove the elements in which these changes have occurred. In addition, by using a laser scanning φ microscope, it is possible to observe changes in electrical characteristics in any part of the device that does not appear on the external terminals during operation while irradiating laser light. Furthermore, defects caused by changes in characteristics inside the chip can also be eliminated in advance.

As described above, after performing screening using optical observation, the ceramic adhesive cover 7 is attached to remove the influence of external light on the chip 2 and to protect the window portion. When installing the protective cover 7, the protective cover 7 is attached to the case 1 using screws 8 to prevent heat stress from being applied to the chip 2.
can be attached to. At this time, of course, be careful not to apply mechanical stress. It is preferable to intervene.

FIG. 2 is a cross-sectional structural diagram of a semiconductor integrated circuit device showing another embodiment of the present invention. According to this embodiment, the semiconductor chip 2
is mounted inside the metal can case 11 and bonded.
The terminal 4 and the chip 2 are connected to the wire 3 and sealed by welding a metal cap 12 provided with a transparent ceramic or glass window 6 as in the previous embodiment. The protective cover 13 is attached to the case 11 by caulking.

The semiconductor integrated circuit device having the structure shown in this embodiment can also perform screening using optical observation in conjunction with the previous embodiment. At this time as well, after the screening is completed, the metal protective cover 13 is attached by caulking without applying stress. However, this metal protective cover 13 does not need to be sealed between it and the case 1, so it is only necessary to attach it to the extent that it will not come loose later.
It is enough even if there is some play. In addition, it is not limited to gold or synthetic materials, but may also be filled with a small amount of resin material of a different color depending on the required number.

Regarding the case with the window mentioned above, there are already ultraviolet erasable programmable read-only memories,
Alternatively, it is widely used as a case for light emitting diodes, semiconductor lasers, etc., and has a sufficient track record of reliability, so there is no problem with the reliability of the case. In addition, although only the cases in which mechanical means are used to attach the protective cover have been described, methods such as thermocompression welding or adhesive bonding may of course be used as long as they do not cause any adverse effects.

〔Effect of the invention〕

As explained in detail above, according to the present invention, a case structure that allows optical and visual observation during screening is adopted, so semiconductor integrated circuit devices with higher reliability can be provided at a lower cost than in the past. It has a possible effect.

[Brief explanation of the drawing]

FIG. 1 shows a semiconductor 3i! which shows an embodiment of the present invention. , FIG. 2 is a cross-sectional structural diagram of a semiconductor integrated circuit vct showing another embodiment of the present invention, FIGS.
Each figure is a cross-sectional structural diagram of a conventional highly reliable semiconductor integrated circuit device. 1.14...Ceramic e case, 2...
... Semiconductor chip, 3 ... Bonding wire, 4 ... Terminal, 5.15 ... Ceramic cap, 6 ... Glass window, 7.・・・
...Ceramic protective cover, 8...Screw, 9
...Natsuto, 10...Washer, 11...
...Metal can case, 12.16...Metal cap, 13...Metal protective cover. Agent Patent Attorney Uchihara Oto 4 G Figure 1/ Figure 2 3rd session 4 tf Figure 4

Claims (1)

[Claims] A semiconductor integrated circuit device having a structure in which a semiconductor chip is placed in a case, wherein the case is formed with an observation window made of transparent ceramic or glass on the semiconductor chip inside. Device.