JPH019979Y2 - - Google Patents

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Publication number
JPH019979Y2
JPH019979Y2 JP5256683U JP5256683U JPH019979Y2 JP H019979 Y2 JPH019979 Y2 JP H019979Y2 JP 5256683 U JP5256683 U JP 5256683U JP 5256683 U JP5256683 U JP 5256683U JP H019979 Y2 JPH019979 Y2 JP H019979Y2
Authority
JP
Japan
Prior art keywords
light emitting
substrate
emitting element
main frame
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5256683U
Other languages
Japanese (ja)
Other versions
JPS59158175U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5256683U priority Critical patent/JPS59158175U/en
Publication of JPS59158175U publication Critical patent/JPS59158175U/en
Application granted granted Critical
Publication of JPH019979Y2 publication Critical patent/JPH019979Y2/ja
Granted legal-status Critical Current

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Automatic Assembly (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

【考案の詳細な説明】 この考案は発光ダイオード、固体ランプ等の固
体発光素子(以下単に発光素子と云う)による多
連バー表示、多連複数列表示、あるいは発光素子
を散在して配置した表示等に用いるライン状表示
器の組立治具に関する。
[Detailed description of the invention] This invention uses solid-state light-emitting elements such as light-emitting diodes and solid-state lamps (hereinafter simply referred to as light-emitting elements) to display multiple bars, multiple rows, or displays in which light-emitting elements are scattered. The present invention relates to an assembly jig for line-shaped display devices used for etc.

一般にこの種のライン状表示器は第1図に示す
ように多数の発光素子1をプリント基板等のマウ
ント基板(以下単に基板と云う)2上に所望高さ
H(基板2の表面2aから発光素子1のレンズ部
1aの先端迄の距離)だけ浮かせて反射枠3の反
射面の形状に合せて固定する必要がある。
In general, this type of line-shaped display device has a large number of light emitting elements 1 mounted on a mounting board (hereinafter simply referred to as the board) 2 such as a printed circuit board at a desired height H (emitting light is emitted from the surface 2a of the board 2) as shown in FIG. It is necessary to fix the element 1 by lifting it up by the distance up to the tip of the lens portion 1a of the element 1 in accordance with the shape of the reflecting surface of the reflecting frame 3.

従来はこのようなライン状表示器を組立てる場
合、第2図に示すようにゴムチユーブ等のような
絶縁チユーブ4を発光素子1のリード1b,1c
にそれぞれ挿入し、基板2の発光素子1の配列対
応位置に設けられた挿通透孔5にそれぞれ挿通し
て所望高さHに浮かせてリード1b,1cを基板
2の裏面2b(パターン面)に半田付けして固定
する。あるいは他の例として第3図に示すように
基板2の表面2aを下方に向けて保持し、基板2
の挿通透孔5に対応する位置に先端をレンズ部1
aと同形に、後端をツバ部(ステー)1dの直径
より多少大きい円筒状の彫り込み6a,6bをそ
れぞれ形成するとともに、この円筒状の彫り込み
6bの深さは発光素子1の所望の高さHになる
ように形成したベークライト等からなる枠6を、
基板2の表面2a側すなわち図において下方から
各発光素子1を覆うように基板2に合体させた
後、リード1b,1cを基板2の裏面2bのパタ
ーン(図示せず)に手作業で1個づつ半田付けし
て、各発光素子1を所望の高さHにそろえて基板
2に固定した後全体を反転して枠6を取り除いて
組立てていた。
Conventionally, when assembling such a line-shaped display, as shown in FIG.
The leads 1b and 1c are inserted into the through-holes 5 provided on the substrate 2 at positions corresponding to the arrangement of the light-emitting elements 1, respectively, and raised to a desired height H, and the leads 1b and 1c are connected to the back surface 2b (pattern surface) of the substrate 2. Solder and secure. Alternatively, as another example, as shown in FIG.
Insert the tip of the lens part 1 into the position corresponding to the insertion hole 5 of the lens part 1.
In the same shape as a, cylindrical engravings 6a and 6b are formed at the rear end to be slightly larger than the diameter of the collar portion (stay) 1d, and the depth of the cylindrical engravings 6b is set to the desired height of the light emitting element 1. A frame 6 made of Bakelite or the like formed into an H shape,
After combining each light emitting element 1 with the substrate 2 so as to cover it from the front surface 2a side of the substrate 2, that is, from the bottom in the figure, one lead 1b, 1c is manually attached to a pattern (not shown) on the back surface 2b of the substrate 2. After soldering each light emitting element 1 one by one to the desired height H and fixing it to the substrate 2, the whole was turned over and the frame 6 was removed to assemble it.

このような従来の組立て方法では、発光素子の
取付固定が1個づつの手作業であるため、発光素
子が傾き、高さが不ぞろいになりやすく、従つて
発光素子の光軸、光度が均一にならず所望の光量
が得られない。また多連に発光素子を取付けるた
め反射枠の所定の穴に嵌合しなくなる。更に作業
に多くの時間と労力を要し、従つて生産能率、歩
止りが悪く加工費が大幅に増大すると云う欠点が
あつた。
In this conventional assembly method, each light emitting element is manually installed and fixed one by one, so the light emitting elements tend to be tilted and their heights are uneven, making it difficult for the optical axis and luminous intensity of the light emitting elements to be uniform. Otherwise, the desired amount of light cannot be obtained. Furthermore, since multiple light emitting elements are mounted, they do not fit into the predetermined holes of the reflective frame. Furthermore, the process requires a lot of time and effort, resulting in poor production efficiency and yield, resulting in a significant increase in processing costs.

この考案は叙上の点に鑑みてなされたもので、
断面が上下2段の段差を有する〓形に形成された
主枠によつて複数の固体発光素子とマウント基板
との関係位置を位置決めし、主枠の下方の段差の
上面とマウント基板との間に補助枠を挿入するこ
とによつて各固体発光素子とマウント基板を主枠
に押圧し、これら主枠と補助枠とマウント基板と
各固体発光素子とを一体的に所望関係位置にクラ
ンプ等によつて仮固定して各固体発光素子のリー
ドをマウント基板に半田付けできるように構成す
ることによつて作業性が良好で歩止りのよい大量
生産に適したライン状表示器の組立治具を提供す
ることを目的とするものである。
This idea was made in view of the points mentioned above.
The relationship between the plurality of solid-state light emitting elements and the mount substrate is determined by a main frame formed in the shape of a square whose cross section has two steps, upper and lower, and between the upper surface of the step below the main frame and the mount substrate. By inserting the auxiliary frame into the main frame, each solid-state light emitting element and the mount board are pressed against the main frame, and the main frame, the auxiliary frame, the mount board, and each solid-state light emitting element are integrally clamped or otherwise placed in a desired relationship position. Therefore, by configuring the lead of each solid-state light-emitting element to be temporarily fixed and soldered to the mounting board, we have created an assembly jig for a line-shaped display that is suitable for mass production with good workability and high yield. The purpose is to provide

以下第4図乃至第7図によりこの考案の一実施
例につき詳細に説明する。なお第1図乃至第3図
と同一物に対しては同一符号を付して説明を省略
する。
An embodiment of this invention will be described in detail below with reference to FIGS. 4 to 7. Components that are the same as those in FIGS. 1 to 3 are denoted by the same reference numerals, and explanations thereof will be omitted.

第4図において、プリント配線された基板2の
多数の挿通透孔5にそれぞれ各発光素子1を順次
挿通して発光素子1′のようにそのツバ部1′dの
底面が基板2の表面2aに当接する位置まで落し
込み配列させる。
In FIG. 4, each light emitting element 1 is sequentially inserted into a large number of insertion holes 5 of a printed wiring board 2, so that the bottom surface of the collar 1'd of the light emitting element 1' is on the surface of the board 2. Arrange them by dropping them down to the position where they contact 2a.

第5図において、発光素子1の位置決め用の主
枠7は厚肉部による段差7aと薄肉部による段差
7cとによつて2つの段差を構成した断面がほぼ
〓状に形成されたベークライト等の材料からなつ
ている。厚肉部による段差7aの上面の端縁部に
は基板2と同じ厚さで、基板2の一方の側面2c
と当接してこれを位置決めするためのガイド部7
bが形成されている。厚肉部による段差7aの薄
肉部による段差7cに対する段差の立上り量mは
高さHからレンズ部1aの高さとツバ部1dの
厚さhとを引いた値となる。すなわちm=H−
(+h)となる。従つて基板2の表面2aから
の発光素子1の高さHはツバ部1dが外嵌可能な
直径Rでかつこれを納置する深さhの受座7dと
前記段差7aと7cの高低差による立上り量mに
よつて定まる。
In FIG. 5, the main frame 7 for positioning the light emitting element 1 is made of Bakelite or the like, which has a substantially square cross-section and has two steps formed by a step 7a formed by a thick portion and a step 7c formed by a thin portion. It is made of materials. The edge of the upper surface of the step 7a due to the thick part has the same thickness as the substrate 2, and one side surface 2c of the substrate 2 is provided.
a guide portion 7 for positioning this by contacting with the
b is formed. The rising amount m of the step 7a due to the thick portion relative to the step 7c due to the thin portion is the value obtained by subtracting the height H of the lens portion 1a and the thickness h of the flange portion 1d from the height H. That is, m=H-
(+h). Therefore, the height H of the light emitting element 1 from the surface 2a of the substrate 2 is equal to the height difference between the seat 7d, which has a diameter R that allows the collar portion 1d to be externally fitted, and has a depth h in which the collar portion 1d is placed, and the steps 7a and 7c. It is determined by the rise amount m.

主枠7の段差7cの上面から発光素子1の配列
対応位置に前記受座7dを後端とし先端がレンズ
部1aが外嵌する直径r(レンズ部1aの外径よ
りやや大)の貫通穴8を主枠7の底面7eに向け
て貫通し、かつ貫通穴8の軸心は段差7aの上面
に載置された基板2の表面2aに対し垂直になる
ように設けられている。
From the upper surface of the step 7c of the main frame 7 to the position corresponding to the arrangement of the light emitting elements 1, there is a through hole with the rear end of the seat 7d and the tip of which the lens portion 1a fits externally, a through hole having a diameter r (slightly larger than the outer diameter of the lens portion 1a). 8 toward the bottom surface 7e of the main frame 7, and the axis of the through hole 8 is perpendicular to the surface 2a of the substrate 2 placed on the top surface of the step 7a.

上記薄肉部による段差7cの上面の切欠き部
分、すなわち基板2の表面2aとの間を充当する
ための補助枠9はベークライト材あるいは硬質ゴ
ム材等からなり、その上面の図において右側端縁
部には基板2の他方の側面2dに当接してガイド
部7bとの間で挾圧するための厚みが基板2の厚
みと等しいガイド部9aが設けられている。補助
枠9は基板2にリード1b,1cを挿通した発光
素子1が各々該当する貫通穴8に納置されたの
ち、主枠7の厚肉部による段差7aの上面に基板
2を載置してから矢印p方向に横に前記切欠き部
分に挿入し、ガイド部9aが他方の側面2dを押
接したとき発光素子1の裏面すなわちツバ部1d
の裏面の一部が補助枠9の底面9bの先端9cと
面接触するように形成されている。なおこの場合
リード1b,1cに触れないことが必要である。
The auxiliary frame 9, which fills the notch on the top surface of the step 7c due to the thin part, that is, the space between the top surface 2a of the substrate 2 and the top surface 2a, is made of Bakelite material or hard rubber material, and the right edge of the top surface is A guide portion 9a having a thickness equal to the thickness of the substrate 2 is provided for abutting against the other side surface 2d of the substrate 2 and clamping it with the guide portion 7b. In the auxiliary frame 9, after the light emitting elements 1 having the leads 1b and 1c inserted through the substrate 2 are placed in the corresponding through holes 8, the substrate 2 is placed on the upper surface of the step 7a formed by the thick part of the main frame 7. When the guide portion 9a presses against the other side surface 2d, the back surface of the light emitting element 1, that is, the collar portion 1d.
A part of the back surface is formed so as to be in surface contact with the tip 9c of the bottom surface 9b of the auxiliary frame 9. In this case, it is necessary not to touch the leads 1b and 1c.

クランプ10a,10bはピアノ線または板ば
ね等の弾性体によつて作られ、主枠7、補助枠
9、基板2を上述のように合体したのち、これら
を両側および基板2の裏面2bおよび主枠7の底
面から弾性的にクランプして固定する。
The clamps 10a and 10b are made of an elastic body such as piano wire or a leaf spring, and after combining the main frame 7, the auxiliary frame 9, and the board 2 as described above, they are attached to both sides and the back surface 2b of the board 2 and the main frame. It is elastically clamped and fixed from the bottom of the frame 7.

このように構成された治具を用いてライン状表
示器の組立てるには、第4図のように各発光素子
1を基板2の対応する挿通透孔5に挿通して、落
し込んだ後主枠7を基板2の表面2aの上からガ
イド部7bが基板2の側面2cに当接するごとく
覆せたのち、主枠7と基板2もろとも、上下を逆
転させる。次に第5図に示すようにすべての発光
素子1をそれぞれ対応する貫通穴8に落し込んで
ツバ部1dを主枠7の段差7cの上面に納置す
る。かくすることにより、各発光素子1は基板2
からの高さHが所望の高さに揃えられる。
In order to assemble a line-shaped display using a jig constructed in this way, each light emitting element 1 is inserted into the corresponding insertion hole 5 of the substrate 2 as shown in FIG. 4, and then dropped. After the main frame 7 is overturned from above the surface 2a of the substrate 2 so that the guide portion 7b comes into contact with the side surface 2c of the substrate 2, the main frame 7 and the substrate 2 are both turned upside down. Next, as shown in FIG. 5, all the light emitting elements 1 are dropped into the corresponding through holes 8, and the collar portions 1d are placed on the upper surface of the step 7c of the main frame 7. By doing so, each light emitting element 1 is attached to the substrate 2.
The height H from the top is adjusted to the desired height.

次に補助枠9を主枠7の切欠き部すなわち基板
2の表面2aの下に横から矢印p方向に挿入して
ガイド部9aを基板2の他の側面2dに押接して
基板2、主枠7、補助枠9を第5図あるいは第7
図に示すように一体的に合体した後クランプ10
a,10bにより両側からクランプする。次に次
工程のトレーに基板2の裏面2b(パターン面)
を下にして並べる。そこでこのパターン面を半田
デイツプ槽等(図示せず)に浸すことによつて一
回の操作で同時にすべての半田付けを終了するこ
とができる。あるいは自動搬送機構を備えた自動
半田装置で連続的に多数の基板2の半田付けも可
能である。
Next, insert the auxiliary frame 9 into the notch of the main frame 7, that is, under the surface 2a of the board 2 from the side in the direction of arrow p, press the guide part 9a against the other side surface 2d of the board 2, and press the guide part 9a against the other side surface 2d of the board 2. Frame 7 and auxiliary frame 9 are shown in Figure 5 or Figure 7.
After the clamp 10 is integrated as shown in the figure,
Clamp from both sides with a and 10b. Next, the back side 2b (pattern side) of the substrate 2 is placed on the tray for the next process.
Arrange them face down. Therefore, by dipping this patterned surface into a solder dip tank (not shown), all the soldering can be completed at the same time in one operation. Alternatively, it is also possible to successively solder a large number of boards 2 using an automatic soldering device equipped with an automatic transport mechanism.

半田付けが終了したのちクランプ10a,10
bを取り除き、主枠7、補助枠9を基板2から分
離してライン状表示器の組立が終了する。なお第
5図に示す貫通穴8は半田付けの時半田およびフ
ラツクスの蒸気を逃がし、かつこれらが付着した
時の洗浄を容易にする役目をもつている。
After soldering is completed, clamps 10a, 10
b is removed, the main frame 7 and the auxiliary frame 9 are separated from the substrate 2, and the assembly of the linear display is completed. The through holes 8 shown in FIG. 5 have the function of allowing vapors of solder and flux to escape during soldering, and facilitating cleaning when these adhere.

以上のようにこの考案によれば、多数の発光素
子をそのリードが所定位置に挿通された基板上の
所望位置および高さに仮固定するように主枠、補
助枠とを設けたから (1) 基板のパターン面を下にして、半田付け作業
が可能となる。
As described above, according to this invention, the main frame and the auxiliary frame are provided so as to temporarily fix a large number of light emitting elements at desired positions and heights on the board through which their leads are inserted into predetermined positions (1) Soldering can be done with the pattern side of the board facing down.

(2) 各発光素子の位置決め状態が組立途中におい
て側面から確認できる。
(2) The positioning status of each light emitting element can be confirmed from the side during assembly.

(3) 各発光素子の高さ、位置およびその光軸が確
実に決まる。
(3) The height and position of each light emitting element and its optical axis are reliably determined.

(4) 半田デイツプ槽に浸すことによつて一回の操
作ですべての発光素子のリードの半田付けが同
時にできる。
(4) By immersing the device in a solder dip bath, the leads of all the light emitting devices can be soldered at the same time in one operation.

(5) 自動半田付け装置で多数の基板への連続半田
付け作業が可能である。
(5) Automatic soldering equipment can perform continuous soldering work on multiple boards.

(6) 半田付け作業のミスがなくなる。(6) Eliminates mistakes in soldering work.

(7) 半田付けの仕上りがすべて均一になる。(7) All soldering finishes are uniform.

(8) 能率が極端に向上する。(8) Efficiency will be dramatically improved.

(9) 加工費が大幅に低減する。(9) Processing costs are significantly reduced.

等の効果がある。There are other effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第3図はライン状表示器の従来の組
立構造を示すもので、第1図は多連バー状表示器
の一例を示す要部側断面図、第2図は発光素子を
基板に取付けた状態を示す側面図、第3図は他の
例を示す要部側断面図、第4図乃至第7図はこの
考案の実施例を示すもので第4図は基板へ発光素
子を挿通する状態を示す斜視図、第5図は発光素
子を所望位置にクランプした状態を示す全体断面
図、第6図は発光素子の底面と補助枠位置との関
係を示す背面図、第7図はクランプを除く全体斜
視図である。 1……固体発光素子、1a……レンズ部、1
b,1c……リード、1d……ツバ部、2……マ
ウント基板、7……主枠、7a,7c……段差、
7d……受座、8……貫通穴、9……補助枠。
Figures 1 to 3 show the conventional assembly structure of a line-shaped display. Figure 1 is a sectional side view of the main part showing an example of a multiple bar-shaped display, and Figure 2 shows a light-emitting element mounted on a substrate. 3 is a side sectional view of main parts showing another example, and FIGS. 4 to 7 show embodiments of this invention. FIG. 5 is a perspective view showing the state of insertion; FIG. 5 is an overall sectional view showing the light emitting element clamped at a desired position; FIG. 6 is a rear view showing the relationship between the bottom of the light emitting element and the auxiliary frame position; FIG. 7 is an overall perspective view excluding the clamp. 1...Solid light emitting element, 1a...Lens portion, 1
b, 1c...Lead, 1d...Brim portion, 2...Mount board, 7...Main frame, 7a, 7c...Step,
7d...Catch, 8...Through hole, 9...Auxiliary frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上面にマウント基板を載置する段差とかつ補助
枠を載置する他の段差とを有し、前記他の段差は
その面に固体発光素子のレンズ部が遊嵌可能に挿
入されかつレンズのツバ部が当接する受座を前記
面より一定距離に有する貫通穴を形成した主枠を
有し、この主枠の前記段差に固体発光素子のレン
ズ部が前記貫通穴に位置するように載置してツバ
部を受座に当接させ、かつ前記他の段差とマウン
ト基板との間に補助枠を挿入載置させてマウント
基板に配列した複数個の固体発光素子の高さを一
定に揃えるようにしたライン状表示器の組立治
具。
The upper surface has a step on which the mount board is placed and another step on which the auxiliary frame is placed, and the lens portion of the solid-state light emitting element is loosely inserted into the surface of the other step, and the lens flange is formed on the surface of the other step. a main frame having a through hole formed therein, the receiving seat being abutted by the solid-state light emitting element being positioned at a certain distance from the surface; The flange portion is brought into contact with the seat, and an auxiliary frame is inserted and placed between the other step and the mount substrate, so that the heights of the plurality of solid-state light emitting elements arranged on the mount substrate are made to be uniform. Assembly jig for line-shaped display.
JP5256683U 1983-04-11 1983-04-11 Line display assembly jig Granted JPS59158175U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5256683U JPS59158175U (en) 1983-04-11 1983-04-11 Line display assembly jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5256683U JPS59158175U (en) 1983-04-11 1983-04-11 Line display assembly jig

Publications (2)

Publication Number Publication Date
JPS59158175U JPS59158175U (en) 1984-10-23
JPH019979Y2 true JPH019979Y2 (en) 1989-03-20

Family

ID=30182911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5256683U Granted JPS59158175U (en) 1983-04-11 1983-04-11 Line display assembly jig

Country Status (1)

Country Link
JP (1) JPS59158175U (en)

Also Published As

Publication number Publication date
JPS59158175U (en) 1984-10-23

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