JPH0210207B2 - - Google Patents
Info
- Publication number
- JPH0210207B2 JPH0210207B2 JP28594586A JP28594586A JPH0210207B2 JP H0210207 B2 JPH0210207 B2 JP H0210207B2 JP 28594586 A JP28594586 A JP 28594586A JP 28594586 A JP28594586 A JP 28594586A JP H0210207 B2 JPH0210207 B2 JP H0210207B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- solder
- soldered
- metals
- ferric chloride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000005868 electrolysis reaction Methods 0.000 claims description 16
- 150000002739 metals Chemical class 0.000 claims description 14
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 13
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241000287127 Passeridae Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Description
【発明の詳細な説明】
発明の技術分野
本発明は、半田及び又はスズメツキされた金属
から有価金属を回収する方法に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for recovering valuable metals from soldered and/or tinned metals.
発明の従来技術
従来、半田メツキの剥離のため、塩化第二鉄に
より、初めから剥離処理が行われていた。Prior Art of the Invention Conventionally, in order to remove solder plating, a removal treatment was performed from the beginning using ferric chloride.
この方法では、塩化鉄の経費が高くなり、工業
上好ましくなく、さらに、剥離液中の金属を回収
する場合、塩化鉄との分離が好ましく行われず、
よりよい方法が望まれていた。 In this method, the cost of iron chloride is high, which is not desirable from an industrial standpoint.Furthermore, when recovering the metal in the stripping solution, separation from iron chloride is not preferably carried out.
A better method was desired.
また、硅弗化浴又は硅弗化浴電解による、燐青
銅又は鉄ベースニツケル合金を母材とする金属ス
クラツプからの有価金属の回収においても、回収
すべき母材及びメツキ金属の不純物品位が高く、
効率の良い回収は、困難であり、より好ましい方
法が望まれていた。 In addition, when recovering valuable metals from metal scrap whose base material is phosphor bronze or iron-based nickel alloy by silica fluoride bath or silica fluoride bath electrolysis, the impurity level of the base metal and plating metal to be recovered is high. ,
Efficient recovery is difficult, and a more preferable method has been desired.
本発明者等は、鋭意検討した結果以下の発明を
なした。 The inventors of the present invention have made the following invention as a result of intensive studies.
発明の構成
本発明は、半田及び又はスズメツキされた金属
を、アルカリ電解により、半田及び又はスズメツ
キを粗剥離した後、塩化第二鉄と塩酸の混液によ
り残留する半田及び又はスズの剥離を行うことを
特徴とする半田及び又はスズメツキされた金属か
らの有価金属の回収法に関する。Structure of the Invention The present invention involves roughly peeling off the solder and/or tin plated metal by alkaline electrolysis, and then peeling off the remaining solder and/or tin using a mixed solution of ferric chloride and hydrochloric acid. This invention relates to a method for recovering valuable metals from soldered and/or soldered metals.
また、他の発明として、半田及び又はスズメツ
キされた金属を、アルカリ電解により、半田及び
又はスズメツキを粗剥離した後、塩化第二鉄と塩
酸の混液により残留する半田及び又はスズ、さら
に銅下地メツキ仕上げの剥離を行うことを特徴と
する半田及び又はスズメツキされた金属からの有
価金属の回収法を提供する。 In addition, as another invention, after the solder and/or tin plated metal is roughly peeled off by alkaline electrolysis, the remaining solder and/or tin is removed by a mixture of ferric chloride and hydrochloric acid, and further the copper base plating is removed. Provided is a method for recovering valuable metals from soldered and/or tinned metals, characterized by performing finish stripping.
発明の具体的説明
本発明の対象となる金属は、半田及び又はスズ
メツキされたものである。DETAILED DESCRIPTION OF THE INVENTION The metal to which the present invention is applied is soldered and/or tin-plated.
これらの金属としては、銅、鉄これらの合金等
である。 These metals include copper, iron, and alloys thereof.
例えば、燐青銅、42合金等である。 For example, phosphor bronze, 42 alloy, etc.
上記の金属にメツキされた半田及び又はスズ
を、アルカリ電解処理することである。 Solder and/or tin plated on the above metals is subjected to alkaline electrolytic treatment.
アルカリ電解は、電流密度100〜300A/m2が好
ましく、電解液は、カセイソーダ等を用いる。カ
セイソーダである場合は、50〜150ｇ/であるこ
とが好ましい。 In alkaline electrolysis, a current density of 100 to 300 A/m 2 is preferable, and caustic soda or the like is used as the electrolytic solution. In the case of caustic soda, the amount is preferably 50 to 150 g/.
電解液温は、65〜75℃、アルカリ電解時間は、
16〜28時間であることが好ましい。 The electrolyte temperature is 65 to 75℃, and the alkaline electrolysis time is
Preferably it is 16 to 28 hours.
このうち、後半の２〜６時間は水分解を生じて
も継続して電解することが好ましい。スズの剥離
が完全になされるためである。 Among these, it is preferable to continue electrolysis for the latter 2 to 6 hours even if water decomposition occurs. This is because the tin is completely peeled off.
アノードはボツクス状をなし、カソード側は、
孔を有するものを用いる。ここに処理対象物を装
入する。アノードは、SUS製あるいは鉄板製等
である。 The anode is box-shaped, and the cathode side is
Use one with holes. The object to be processed is loaded here. The anode is made of SUS or iron plate.
例えば、装入物の量はかさ密度で0.3〜0.9t/m3
である。 For example, the amount of charge is 0.3 to 0.9 t/m 3 in bulk density.
It is.
カソードは、鉄製、SUS製、チタン製等であ
る。カソードにおいては、隔膜を設け電着する
Sn及び又はPbが剥離した際、分散をしないよう
にしておくことが望ましい。 The cathode is made of iron, SUS, titanium, etc. At the cathode, a diaphragm is provided and electrodeposited.
When Sn and/or Pb is peeled off, it is desirable to prevent it from dispersing.
この方法により、大部分のスズ及び又は半田を
金属状で回収する。これにより、回収後の処理が
極めて行い易い、また上記アルカリ電解であるた
め酸化膜が形成され、母材の浸食が防止でき、母
材に欠陥を与えることもない。 By this method, most of the tin and/or solder is recovered in metallic form. As a result, post-recovery processing is extremely easy to perform, and since the above-mentioned alkaline electrolysis is used, an oxide film is formed, preventing erosion of the base material and causing no defects to the base material.
さらに、残留するスズ及び又は半田を回収する
ため、塩化第二鉄による剥離を行う。 Further, in order to recover residual tin and/or solder, stripping is performed using ferric chloride.
また、銅下地メツキ等がなされている場合に
は、これも除去する。 Also, if copper undercoat plating has been done, this will also be removed.
この場合の条件は、剥離液としては塩化第二鉄
10〜15ｇ/であることが好ましい。さらに剥離
速度を増加させるため、10〜70ｇ/の塩酸を加
えておくことが好適である。 In this case, the stripping solution is ferric chloride.
It is preferable that it is 10-15g/. In order to further increase the peeling speed, it is preferable to add 10 to 70 g/h of hydrochloric acid.
剥離液温度としては、常温であることが好まし
い。剥離は、電解後の対象処理物をバスケツト等
に入れ、どぶ漬け、あるいは回転ドラム等に入れ
て、回転しつつ剥離を行わせしめる。 The temperature of the stripping solution is preferably room temperature. For peeling, the object to be treated after electrolysis is placed in a basket or the like, soaked in a pot, or placed in a rotating drum or the like, and peeled off while being rotated.
バスケツト等の装入時のかさ密度は、0.1〜0.6
ｔ／m3で好ましく行われる。 The bulk density when charging the basket, etc. is 0.1 to 0.6.
It is preferably carried out at t/m 3 .
塩化第二鉄により剥離する時間は５〜10分であ
る。上記塩酸を添加することにより、例えば10分
の処理時間が２分と短縮される。 The time required for stripping with ferric chloride is 5 to 10 minutes. By adding the above-mentioned hydrochloric acid, the processing time of 10 minutes, for example, is shortened to 2 minutes.
以上のように処理した場合、回収母材の品質
は、スズメツキであればSn＜0.01％、半田メツキ
であればSn＜0.01％、Pb＜0.01％となる。 When processed as described above, the quality of the recovered base material is Sn<0.01% for sparrow plating, Sn<0.01% and Pb<0.01% for solder plating.
以上のように本発明を実施することにより、以
下の効果を有する。 By implementing the present invention as described above, the following effects can be obtained.
発明の効果
(1) 半田及びスズメツキされた金属から、容易に
高純度の金属状のスズ及び鉛、又はスズを回収
できる。Effects of the invention (1) High purity metallic tin, lead, or tin can be easily recovered from soldered and tin-plated metals.
(2) アリカリ電解と塩化第二鉄の処理を組合せる
ことにより、塩化第二鉄の使用量を激減させる
ことにより、処理コストが極めて少なくて良
い。(2) By combining alkali electrolysis and ferric chloride treatment, the amount of ferric chloride used can be drastically reduced, resulting in extremely low treatment costs.
塩化第二鉄で処理した場合のコストの1/7で
良い。 The cost is 1/7 of the cost of treatment with ferric chloride.
(3) また、回収母材の品質も半田メツキの場合
は、Sn＜0.01％、Pb＜0.01％スズメツキの場合
はSn＜0.01％と極めて低い値とすることができ
る。(3) In addition, the quality of the recovered base material can be extremely low, such as Sn<0.01% in the case of solder plating and Sn<0.01% in the case of Pb<0.01%.
(4) さらにアルカリ電解であるため、酸性と異な
り酸化皮膜を形成することから母材の浸食もな
く、より好ましい母材に再生することができ
る。(4) Furthermore, since it is an alkaline electrolysis method, unlike acid electrolysis, it forms an oxide film, so there is no erosion of the base material, and it is possible to regenerate it into a more preferable base material.
(5) また、塩化第二鉄による剥離の場合、塩酸を
適量に入れることにより、反応を早めることが
できる。(5) Furthermore, in the case of stripping using ferric chloride, the reaction can be accelerated by adding an appropriate amount of hydrochloric acid.
実施例 １
42合金（Ni42％残鉄）に半田メツキされたス
クラツプを、SUS製のアノードボツクスに入れ、
NaOH濃度100ｇ/、電流密度300A/m2、電解温
度70℃、アルカリ電解時間は22時間とし、そのう
ちで後半は、水分解が生じ始めてから４時間、電
解を継続した。これにより、スズがきれいに剥離
された。Example 1 Scrap soldered to 42 alloy (42% Ni remaining iron) was placed in a SUS anode box.
The NaOH concentration was 100 g/m, the current density was 300 A/m 2 , the electrolysis temperature was 70° C., and the alkaline electrolysis time was 22 hours, during which the electrolysis was continued for 4 hours after water decomposition started. As a result, the tin was peeled off cleanly.
この際、原料のかさ密度は、0.6t/m3で行い、
カソードは、SUS製で、ポリプロピレンからな
る布製のものでカソードを包み、隔膜を形成させ
た。これにより電着するスズ、鉛が剥離して分散
することによつて起こるアノードとカソードのシ
ヨートを防止した。 At this time, the bulk density of the raw material was set to 0.6t/ m3 ,
The cathode was made of SUS and wrapped in a cloth made of polypropylene to form a diaphragm. This prevented the anode and cathode from being shot due to the peeling and dispersion of the electrodeposited tin and lead.
カソードでは、高品位の半田が、綿状金属で得
られた、半田の品位は、スズ80％、鉛8.5％あつ
た。 At the cathode, high-grade solder was obtained in the flocculent metal, and the solder quality was 80% tin and 8.5% lead.
次に、残留する半田及び銅の下地メツキを剥離
すべく塩化第二鉄により処理を行つた。 Next, treatment was performed with ferric chloride to remove the remaining solder and copper undercoat.
剥離液は、FeCl313ｇ/、フリーの塩酸60ｇ/
液温度は、25℃、剥離バスケツトへの装入かさ
密度は、0.3t/m3で回転ドラムタイプのバスケツ
トにして処理した。 The stripping solution is FeCl 3 13g/, free hydrochloric acid 60g/
The liquid temperature was 25° C., the bulk density charged into the separation basket was 0.3 t/m 3 , and processing was carried out in a rotating drum type basket.
フリーの塩酸が入つているため反応は、２分で
終了し極めて早く、上記剥離処理が完了した。反
応が早いため、母材に与える悪影響も少なくて済
んだ。 Since free hydrochloric acid was contained, the reaction was completed in 2 minutes, and the peeling process was completed very quickly. Because the reaction is quick, there is less negative impact on the base material.
塩素は、鉄鋼材料に対し好ましい元素でないか
らである。 This is because chlorine is not a desirable element for steel materials.
処理された母材は、Sn＜0.01％、Pb＜0.01％で
あり、そのまま母材として再使用し得る好ましい
品位のものであつた。 The treated base material had Sn<0.01% and Pb<0.01%, and was of a preferable grade that could be reused as a base material as it was.
Claims (1)
カリ電解により、半田及び又はスズメツキを粗剥
離した後、塩化第二鉄と塩酸の混液により残留す
る半田及び又はスズの剥離を行うことを特徴とす
る半田及び又はスズメツキされた金属からの有価
金属の回収法。 ２ 半田及び又はスズメツキされた金属を、アル
カリ電解により、半田及び又はスズメツキを粗剥
離した後、塩化第二鉄と塩酸の混液により残留す
る半田及び又はスズ、さらに銅下地メツキの剥離
を行うことを特徴とする半田及び又はスズメツキ
された金属からの有価金属の回収法。[Scope of Claims] 1. Roughly peeling off the solder and/or tin plated metal by alkaline electrolysis, and then peeling off the remaining solder and/or tin with a mixture of ferric chloride and hydrochloric acid. A method for recovering valuable metals from soldered and/or soldered metals, characterized by: 2 After roughly peeling off the solder and/or tin plated metal using alkaline electrolysis, the remaining solder and/or tin, as well as the copper base plating, are peeled off using a mixture of ferric chloride and hydrochloric acid. A method for recovering valuable metals from soldered and/or soldered metals.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20137186 | 1986-08-29 | ||
| JP61-201371 | 1986-08-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63157821A JPS63157821A (en) | 1988-06-30 |
| JPH0210207B2 true JPH0210207B2 (en) | 1990-03-07 |
Family
ID=16439956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61285945A Granted JPS63157821A (en) | 1986-08-29 | 1986-12-02 | Recovering of valuable metal from solder and/or tin plated metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157821A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4785081B2 (en) * | 2008-05-30 | 2011-10-05 | 白金鍍金工業株式会社 | Method for peeling coating of tin plating material |
| CN102642096A (en) * | 2011-02-18 | 2012-08-22 | 苏州宇邦新型材料有限公司 | Solder, tin-plated solder strip adopting solder and preparation methods of solder and tin-plated solder strip |
| JP2014167149A (en) * | 2013-02-28 | 2014-09-11 | Okuchi Denshi Kk | Method of recovering silver from silver kovar material |
| CN103540956A (en) * | 2013-09-26 | 2014-01-29 | 界首市飞航铜业有限公司 | Wet separation technology for waste copper-tin alloy fitting soldering flakes |
| CN112708781B (en) * | 2020-12-23 | 2022-11-25 | 长春黄金研究院有限公司 | Method for recovering metal Sn from waste circuit board by adopting efficient Sn-removing medicament |
| CN112813272B (en) * | 2020-12-31 | 2022-10-14 | 斯瑞尔环境科技股份有限公司 | Method for recovering metallic tin in waste alloy cutter head |
-
1986
- 1986-12-02 JP JP61285945A patent/JPS63157821A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63157821A (en) | 1988-06-30 |
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