JPH02102791U - - Google Patents
Info
- Publication number
- JPH02102791U JPH02102791U JP1082289U JP1082289U JPH02102791U JP H02102791 U JPH02102791 U JP H02102791U JP 1082289 U JP1082289 U JP 1082289U JP 1082289 U JP1082289 U JP 1082289U JP H02102791 U JPH02102791 U JP H02102791U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating electronic
- electronic component
- casing
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案に係る発熱電子部品の取付構
造の実施例を示し、第１図Ａは発熱電子部品及び
ケース、カバーの分解斜視図、第１図Ｂは発熱電
子部品を組み立てた時の断面図である。第２図は
従来例を示し、第２図Ａは発熱電子部品及びケー
ス、カバーの分解斜視図、第２図Ｂは発熱電子部
品を組み立てた時の断面図である。
主な符号の説明、１：筐体のカバー、１ａ：突
起部、２：筐体のケース、２ａ：突起部、３，４
：フアイナルモジユール、３ａ，４ａ：取付部、
５：取付ネジ。
Figure 1 shows an embodiment of the mounting structure for heat-generating electronic components according to this invention, Figure 1A is an exploded perspective view of the heat-generating electronic components, case, and cover, and Figure 1B shows when the heat-generating electronic components are assembled. FIG. FIG. 2 shows a conventional example, where FIG. 2A is an exploded perspective view of the heat-generating electronic component, case, and cover, and FIG. 2B is a cross-sectional view of the heat-generating electronic component when assembled. Explanation of main symbols: 1: Housing cover, 1a: Projection, 2: Housing case, 2a: Projection, 3, 4
: Final module, 3a, 4a: Mounting part,
5: Mounting screw.
Claims (1)
て放熱を行う発熱電子部品の取付構造において、 筐体内部に設けた突起部と、筐体カバーに設け
た突起部とで、上記発熱電子部品を挾持して取り
付けるように構成したことを特徴とする発熱電子
部品の取付構造。[Scope of Claim for Utility Model Registration] In a mounting structure for a heat-generating electronic component that radiates heat by attaching the heat-generating electronic component to a casing that also serves as a radiator, a protrusion provided inside the casing and a protrusion provided on the casing cover. A mounting structure for a heat-generating electronic component, characterized in that the heat-generating electronic component is configured to be mounted by sandwiching the heat-generating electronic component between the two parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1082289U JPH02102791U (en) | 1989-02-02 | 1989-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1082289U JPH02102791U (en) | 1989-02-02 | 1989-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102791U true JPH02102791U (en) | 1990-08-15 |
Family
ID=31218821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1082289U Pending JPH02102791U (en) | 1989-02-02 | 1989-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102791U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113694A (en) * | 1990-09-03 | 1992-04-15 | Fujitsu Ten Ltd | Heat dissipating structure for electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748646B2 (en) * | 1975-03-10 | 1982-10-18 |
-
1989
- 1989-02-02 JP JP1082289U patent/JPH02102791U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748646B2 (en) * | 1975-03-10 | 1982-10-18 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113694A (en) * | 1990-09-03 | 1992-04-15 | Fujitsu Ten Ltd | Heat dissipating structure for electronic device |
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