JPH0256491U - - Google Patents
Info
- Publication number
- JPH0256491U JPH0256491U JP13550488U JP13550488U JPH0256491U JP H0256491 U JPH0256491 U JP H0256491U JP 13550488 U JP13550488 U JP 13550488U JP 13550488 U JP13550488 U JP 13550488U JP H0256491 U JPH0256491 U JP H0256491U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- generating electronic
- mounting structure
- shaped cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図はこの考案に係る発熱電子部
品の取付構造の実施例を示し、第１図は組立分解
図の斜視図、第２図Ａは取付要部の上面図、第２
図Ｂは取付要部の側面図である。第３図及び第４
図は従来例を示し、第３図は組立分解図の斜視図
、第４図Ａは取付要部の上面図、第４図Ｂは取付
要部の側面図である。
主な符号の説明、１：第１のフアイナルモジユ
ール、１ａ：第１のフアイナルモジユールのＵ字
カツト部、２：放熱板、２ａ：放熱板のＵ字カツ
ト部、３：第２のフアイナルモジユール、３ａ：
第２のフアイナルモジユールのＵ字カツト部、４
：ダイキヤスト製放熱器、４ａ：ダイキヤスト製
放熱器の取付部、４ｃ：突起部。
1 and 2 show an embodiment of the mounting structure for heat-generating electronic components according to this invention, FIG. 1 is an exploded perspective view, FIG. 2A is a top view of the main parts of the installation,
Figure B is a side view of the main parts of the attachment. Figures 3 and 4
The figures show a conventional example; FIG. 3 is a perspective view of an exploded assembly view, FIG. 4A is a top view of the main part of the attachment, and FIG. 4B is a side view of the main part of the attachment. Explanation of main symbols, 1: First final module, 1a: U-shaped cut part of first final module, 2: Heat sink, 2a: U-shaped cut part of heat sink, 3: Second final module Module, 3a:
U-shaped cut part of the second final module, 4
: Die-cast radiator, 4a: Mounting part of the die-cast radiator, 4c: Projection.
Claims (1)
を取り付けて放熱を行う取付構造において、 このダイキヤスト製放熱器やケースの発熱電子
部品取付部に、発熱電子部品の取付面の放熱部に
設けられたＵ字カツト部に係合する突起部を備え
たことを特徴とする発熱電子部品の取付構造。[Scope of Claim for Utility Model Registration] In a mounting structure that radiates heat by attaching a heat-generating electronic component to a die-cast radiator or case, the mounting surface of the heat-generating electronic component is A mounting structure for a heat-generating electronic component, comprising a protrusion that engages with a U-shaped cut provided on a heat radiation part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13550488U JPH0256491U (en) | 1988-10-19 | 1988-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13550488U JPH0256491U (en) | 1988-10-19 | 1988-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256491U true JPH0256491U (en) | 1990-04-24 |
Family
ID=31395191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13550488U Pending JPH0256491U (en) | 1988-10-19 | 1988-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014154648A (en) * | 2013-02-07 | 2014-08-25 | Panasonic Corp | Semiconductor device, electronic circuit device and compressor |
-
1988
- 1988-10-19 JP JP13550488U patent/JPH0256491U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014154648A (en) * | 2013-02-07 | 2014-08-25 | Panasonic Corp | Semiconductor device, electronic circuit device and compressor |