JPH02103271U - - Google Patents
Info
- Publication number
- JPH02103271U JPH02103271U JP1146289U JP1146289U JPH02103271U JP H02103271 U JPH02103271 U JP H02103271U JP 1146289 U JP1146289 U JP 1146289U JP 1146289 U JP1146289 U JP 1146289U JP H02103271 U JPH02103271 U JP H02103271U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sensor element
- semiconductor sensor
- flow sensor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measuring Volume Flow (AREA)
Description
第１図は本考案に係るフローセンサの一実施例
を示す要部拡大斜視図、第２図は第１図の側面図
、第３図は従来のフローセンサを示す斜視図であ
る。
１……基板、１０……センサ素子、１１……シ
リコンチツプ、１２……発熱部、１３，１４……
測温部、１５〜２０……電極、２１，２２……細
線、２５〜３０……配線、３１〜３６……ボンテ
ングワイヤ。
FIG. 1 is an enlarged perspective view of essential parts of an embodiment of a flow sensor according to the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a perspective view of a conventional flow sensor. DESCRIPTION OF SYMBOLS 1...Substrate, 10...Sensor element, 11...Silicon chip, 12...Heating part, 13, 14...
Temperature measuring section, 15-20... electrode, 21, 22... thin wire, 25-30... wiring, 31-36... bonding wire.
Claims (1)
細線により該基板から離隔して、支持し、前記半
導体センサ素子の電極と前記基板に形成された配
線とをワイヤボンデングにより接続したことを特
徴とするフローセンサ。 The semiconductor sensor element of the flow sensor is placed on the substrate.
A flow sensor characterized in that the semiconductor sensor element is supported at a distance from the substrate by a thin wire, and the electrodes of the semiconductor sensor element and wiring formed on the substrate are connected by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011462U JPH0642209Y2 (en) | 1989-02-03 | 1989-02-03 | Flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011462U JPH0642209Y2 (en) | 1989-02-03 | 1989-02-03 | Flow sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02103271U true JPH02103271U (en) | 1990-08-16 |
| JPH0642209Y2 JPH0642209Y2 (en) | 1994-11-02 |
Family
ID=31220041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011462U Expired - Lifetime JPH0642209Y2 (en) | 1989-02-03 | 1989-02-03 | Flow sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642209Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595919A (en) * | 1982-07-01 | 1984-01-12 | Mitsubishi Electric Corp | Heat sensitive type flow rate detector |
| JPS6239721A (en) * | 1985-08-15 | 1987-02-20 | Nippon Soken Inc | Direct heating type flow sensor |
-
1989
- 1989-02-03 JP JP1989011462U patent/JPH0642209Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595919A (en) * | 1982-07-01 | 1984-01-12 | Mitsubishi Electric Corp | Heat sensitive type flow rate detector |
| JPS6239721A (en) * | 1985-08-15 | 1987-02-20 | Nippon Soken Inc | Direct heating type flow sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642209Y2 (en) | 1994-11-02 |