JPH02103282U - - Google Patents
Info
- Publication number
- JPH02103282U JPH02103282U JP1192389U JP1192389U JPH02103282U JP H02103282 U JPH02103282 U JP H02103282U JP 1192389 U JP1192389 U JP 1192389U JP 1192389 U JP1192389 U JP 1192389U JP H02103282 U JPH02103282 U JP H02103282U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat dissipation
- semiconductor device
- microwave
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図ａはこの考案によるマイクロ波用半導体
装置評価用治具の一実施例を示す分解斜視図、同
図ｂは同図ａにおいてＡ−Ａ′で切断し矢印方向
を見た要部を示す縦断面図、同図ｃは同じく同図
ａにおいてＢ−Ｂ′で切断し矢印方向を見た要部
を示す縦断面図、第２図ａは従来のマイクロ波半
導体装置評価用治具を示す分解斜視図、同図ｂは
同図ａにおいてＡ−Ａ′で切断し矢印方向を見た
要部を示す縦断面図、同図ｃは同じく同図ａにお
いてＢ−Ｂ′で切断し矢印方向を見た要部を示す
横断面図である。
１……キヤリアプレート、２……半導体装置、
４……治具本体、５……ヒートシンク、Ｎ２……
ねじ。
Fig. 1a is an exploded perspective view showing an embodiment of the microwave semiconductor device evaluation jig according to this invention, and Fig. 1b shows the main part taken along line A-A' in Fig. 1a and viewed in the direction of the arrow. Figure 2c is a vertical cross-sectional view of the main part taken along line B-B' in figure a and viewed in the direction of the arrow, and Figure 2a is a diagram of a conventional microwave semiconductor device evaluation jig. Figure b is a vertical cross-sectional view of the main part taken along A-A' in Figure A and viewed in the direction of the arrow; Figure C is a longitudinal sectional view taken along B-B' in Figure A and viewed in the direction of the arrow. FIG. 3 is a cross-sectional view showing a main part when viewed in a direction. 1...Carrier plate, 2...Semiconductor device,
4...Jig body, 5...Heat sink, N2...
screw.
Claims (1)
アプレートを矩形状の頭部に載置した放熱用ヒー
トシンクと、この放熱用ヒートシンクの前記矩形
状の頭部を跨ぐとともに前記キヤリアプレートを
挾持する枠体を有しかつ前記マイクロ波用半導体
装置に接続される接続端子を備えた治具本体と、
この治具本体を前記放熱用ヒートシンクに固定す
る固定具とを具備するマイクロ波用半導体装置評
価用治具。 A heat sink for heat dissipation in which a metal carrier plate carrying a microwave semiconductor device is mounted on a rectangular head, and a frame body that straddles the rectangular head of the heat sink for heat dissipation and holds the carrier plate in between. a jig main body having a connection terminal connected to the microwave semiconductor device;
A jig for evaluating semiconductor devices for microwave use, comprising a fixture for fixing the jig main body to the heat sink for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1192389U JPH02103282U (en) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1192389U JPH02103282U (en) | 1989-02-03 | 1989-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02103282U true JPH02103282U (en) | 1990-08-16 |
Family
ID=31220904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1192389U Pending JPH02103282U (en) | 1989-02-03 | 1989-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02103282U (en) |
-
1989
- 1989-02-03 JP JP1192389U patent/JPH02103282U/ja active Pending
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