JPH0210328U - - Google Patents

Info

Publication number
JPH0210328U
JPH0210328U JP8877688U JP8877688U JPH0210328U JP H0210328 U JPH0210328 U JP H0210328U JP 8877688 U JP8877688 U JP 8877688U JP 8877688 U JP8877688 U JP 8877688U JP H0210328 U JPH0210328 U JP H0210328U
Authority
JP
Japan
Prior art keywords
insulating substrate
insulating
substrate
substrates
supply magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8877688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8877688U priority Critical patent/JPH0210328U/ja
Publication of JPH0210328U publication Critical patent/JPH0210328U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の動作前状態を示す
断面図、第２図は本考案の一実施例の動作時を示
す断面図である。 １１：絶縁基板、１２：供給マガジン、１３：
検出器、１４：エレベータ機構、１５：供給アー
ム、１６：圧縮空気吹き出しノズル、１７：電磁
弁。 FIG. 1 is a cross-sectional view showing an embodiment of the present invention before operation, and FIG. 2 is a cross-sectional view showing the embodiment of the present invention during operation. 11: Insulating board, 12: Supply magazine, 13:
Detector, 14: Elevator mechanism, 15: Supply arm, 16: Compressed air blow nozzle, 17: Solenoid valve.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に形成された混成集積回路の回路部
品をレーザ光線により切削し、所定の回路定数を
得るためのレーザトリミング装置に絶縁基板を供
給する基板供給装置において、絶縁基板の供給マ
ガジンから１枚ずつ絶縁基板を取り出す際に、該
供給マガジンの最上位にある絶縁基板と次段の絶
縁基板の間に圧縮空気を吹き付けてこれら２枚の
絶縁基板を引き離す手段と、該圧縮空気の吹き付
けに伴つて上記次段以下の絶縁基板をエレベータ
機構により下降させる検出器とを備えることを特
徴とする基板供給装置。 In a substrate supply device that supplies an insulating substrate to a laser trimming device that uses a laser beam to cut circuit components of a hybrid integrated circuit formed on an insulating substrate to obtain predetermined circuit constants, one sheet is removed from an insulating substrate supply magazine. A means for separating the two insulating substrates by spraying compressed air between the uppermost insulating substrate of the supply magazine and the next insulating substrate when taking out the insulating substrates one by one; and a detector for lowering the insulating substrates of the next stage and below by an elevator mechanism.
JP8877688U 1988-07-04 1988-07-04 Pending JPH0210328U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8877688U JPH0210328U (en) 1988-07-04 1988-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8877688U JPH0210328U (en) 1988-07-04 1988-07-04

Publications (1)

Publication Number Publication Date
JPH0210328U true JPH0210328U (en) 1990-01-23

Family

ID=31313336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8877688U Pending JPH0210328U (en) 1988-07-04 1988-07-04

Country Status (1)

Country Link
JP (1) JPH0210328U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020125173A (en) * 2019-02-01 2020-08-20 大日本印刷株式会社 Card carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020125173A (en) * 2019-02-01 2020-08-20 大日本印刷株式会社 Card carrier

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