JPH02103292A - Cleaning fluid for residual flux - Google Patents
Cleaning fluid for residual fluxInfo
- Publication number
- JPH02103292A JPH02103292A JP25490388A JP25490388A JPH02103292A JP H02103292 A JPH02103292 A JP H02103292A JP 25490388 A JP25490388 A JP 25490388A JP 25490388 A JP25490388 A JP 25490388A JP H02103292 A JPH02103292 A JP H02103292A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- cleaning solution
- amine
- cleaning fluid
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Detergent Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要］
本発明は、はんだ接合用フラックスの残渣洗浄液に関し
、
はんだ接合用フラックス中の活成剤成分の溶解能を高め
たフラックス残渣洗浄液を提供することを目的とし、
活性剤としてアミンハロゲン化水素酸塩を含有するはん
だ接合用フラックスの残渣洗浄液において、
化学式（ｃ２ｕ４ｏ）ｆｉ、 ｎ＝４ 、５ 、６ 、
８で表される大環状ポリエーテルを０．１ｗｔ％〜２ｗ
ｔ％の範囲で添加して構成する。[Detailed Description of the Invention] [Summary] The present invention relates to a flux residue cleaning liquid for solder joints, and an object of the present invention is to provide a flux residue cleaning liquid that has improved ability to dissolve activator components in flux for solder joints. , In a solder bonding flux residue cleaning solution containing amine hydrohalide as an activator, the chemical formula (c2u4o)fi, n=4,5,6,
0.1wt% to 2w of macrocyclic polyether represented by 8
It is constituted by adding in a range of t%.
（産業上の利用分野〕
本発明は、はんだ接合用フラックスの残渣洗浄液に関す
る。(Industrial Application Field) The present invention relates to a flux cleaning solution for solder bonding flux residues.
はんだ接合時に使用するフラックスを、はんだ接合終了
後にはんだ接合部から除去するために、フラックス残渣
洗浄液が用いられる。A flux residue cleaning solution is used to remove the flux used during soldering from the solder joint after soldering is completed.
近年のコンピュータシステムの高速化の要求に伴い、Ｌ
ＳＩ素子の高密度実装が進められている。With the recent demand for faster computer systems, L
High-density packaging of SI devices is progressing.
これに伴って、はんだ接合部の大きさも縮小されるので
、はんだ接合部を腐食させて導通不良の原因となるフラ
ックス残渣は、従来以上に除去することが必要である。Along with this, the size of the solder joint is also reduced, so it is necessary to remove more flux residue than before, which corrodes the solder joint and causes poor continuity.
〔従来の技術］
はんだ接合用フラックスとして、ロジン（まつやに）と
有機溶剤（イソプロピルアルコール等）に、高い活性化
能力を有するアミンハロゲン化水素酸塩を活性剤として
含有するもの（たとえばＲＡタイプ、ＲＭＡタイプのフ
ラックス）が一般的に用いられている。[Prior Art] Fluxes for solder bonding include rosin and organic solvents (isopropyl alcohol, etc.) containing an amine hydrohalide having high activation ability as an activator (for example, RA type, RMA type flux) is commonly used.
従来のフラックス残渣洗浄液においては、ハロゲン化炭
化水素である１、１．１−トリクロルエタンを主成分と
するものが広く用いられていた。In conventional flux residue cleaning solutions, those containing 1,1,1-trichloroethane, which is a halogenated hydrocarbon, as a main component have been widely used.
しかし、１．１１−１−リクロルエタンは、フラックス
の主成分であるロジンの熔解能には優れているが、はん
だ接合部腐食の原因となる活成剤成分（アミンハロゲン
化水素酸塩）は全く溶解しないという欠点があった。However, although 1.1-1-lichloroethane has excellent ability to melt rosin, which is the main component of flux, it does not contain any activator component (amine hydrohalide), which causes corrosion of solder joints. The drawback was that it did not dissolve.
そこで、活性剤成分の溶解度を高めるために、１．１．
１−トリクロルエタンにイソプロピルアルコールを添加
した洗浄液が開発されている。しかし、この洗浄液は、
イソプロピルアルコール中への活性剤成分の溶解能が小
さいという問題があった。Therefore, in order to increase the solubility of the active agent component, 1.1.
A cleaning solution containing isopropyl alcohol added to 1-trichloroethane has been developed. However, this cleaning solution
There was a problem in that the ability to dissolve the active agent component in isopropyl alcohol was low.
（発明が解決しようとする課題〕
本発明は、はんだ接合用フラックス中の活成剤成分の溶
解能を高めたフラックス残渣洗浄液を提供することを目
的とする。(Problems to be Solved by the Invention) An object of the present invention is to provide a flux residue cleaning liquid that has improved ability to dissolve activator components in solder bonding flux.
上記の目的は、本発明によれば、活性剤としてアミンハ
ロゲン化水素酸塩を含有するはんだ接合用フラックスの
残渣洗浄液において、
化学式（ＣｚＨ４０）−、ｎ ＝ ４ 、５．６ 、８
で表される大環状ポリエーテルを０．１ｉｙｔ％〜２ｗ
ｔ％の範囲で添加したことを特徴とするフラックス残渣
洗浄液によって達成される。The above object is achieved according to the present invention in a residue cleaning liquid for solder joint flux containing an amine hydrohalide as an activator, having the chemical formula (CzH40)-, n = 4, 5.6, 8
0.1iyt% to 2w of macrocyclic polyether represented by
This is achieved by using a flux residue cleaning solution characterized in that the flux residue is added in a range of t%.
（作 用］
本発明のフラックス残渣洗浄液は、添加された大環状ポ
リエーテルが、活性剤であるアミンハロゲン化水素酸塩
中のアミノ基を取り込んで錯体（会合体）を形成するこ
とによって、活性剤の熔解能が増大し、高い洗浄能力が
得られる。(Function) The flux residue cleaning solution of the present invention is activated by the added macrocyclic polyether incorporating the amino groups in the amine hydrohalide, which is the activator, to form a complex (association). The dissolving ability of the agent increases and high cleaning ability is obtained.
アミン基を有効に取り込むためには、大環状ポリエーテ
ル（Ｃ２１１４０）Ｉｌのｎとして４．５．６、または
８が適当である。In order to effectively incorporate the amine group, n of the macrocyclic polyether (C21140) Il is suitably 4.5.6 or 8.
大環状ポリエーテルの添加量が０．１ｗｔ％以上で、現
実の生産上で意味のある洗浄能力向上効果が得られる。When the amount of macrocyclic polyether added is 0.1 wt% or more, a significant effect of improving cleaning performance in actual production can be obtained.
この添加■が２ｗｔ％が超えても洗浄能力向上効果は実
質的にそれ以上高まらないので、２４％以下が添加量と
して適当である。Even if this addition amount exceeds 2 wt%, the effect of improving the cleaning ability will not substantially increase any further, so an appropriate addition amount is 24% or less.
験を行った。用いた洗浄液の組成を第１表に示す。Test was carried out. The composition of the cleaning solution used is shown in Table 1.
比較のために、第２表に示す組成の従来のフラックス残
渣洗浄液についても、同様の測定試験を行った。For comparison, similar measurement tests were also conducted on conventional flux residue cleaning solutions having the compositions shown in Table 2.
第 １ 表（本発明）
［実施例〕
第１図は、本発明の原理説明図であり、フラックス残渣
洗浄液に添加しである大環状ポリエーテルが、アミンハ
ロゲン化水素酸塩に接した際に生ずる反応を示す。図中
、１はＣ１□Ｈ２４０６（すなわち、（Ｃ２１１，０）
。においてｎ−６）の大環状ポリエーテルであり、２は
水素原子の付加したアミン基、３はハロゲンイオンであ
る。Table 1 (present invention) [Example] Fig. 1 is a diagram explaining the principle of the present invention, and shows that when a macrocyclic polyether added to a flux residue cleaning solution comes into contact with an amine hydrohalide salt, Show the reaction that occurs. In the figure, 1 is C1□H2406 (i.e. (C211,0)
. is a macrocyclic polyether of n-6), 2 is an amine group to which a hydrogen atom is added, and 3 is a halogen ion.
第１図のポリ環状ポリエーテル（Ｃ２１１４０）６を添
加した本発明のフラックス残渣洗浄液について、溶解能
測定および洗浄後のはんだ接合部の腐食試筆 ２ 表（
比較例）
まず、この両者のアミンハロゲン化水素酸塩の溶解度を
測定した。用いたアミンハロゲン化水素酸塩は塩酸ジエ
チルアミン（（Ｃ２Ｈ８） ２ＮＩＩ・ＨＣｆｆ）であ
る。その結果、従来のものが３．５％（２２°Ｃ）であ
ったのに対し、本発明によるものは、６％（２２°Ｃ）
であり、従来のものに比べて、溶解度が８５％アンプし
た。Regarding the flux residue cleaning solution of the present invention containing polycyclic polyether (C21140) 6 shown in Figure 1, measurement of dissolution ability and corrosion test of solder joints after cleaning Table 2 (
Comparative Example) First, the solubility of both amine hydrohalides was measured. The amine hydrohalide salt used was diethylamine hydrochloride ((C2H8) 2NII.HCff). As a result, while the conventional one was 3.5% (22°C), the one according to the present invention was 6% (22°C).
The solubility was increased by 85% compared to the conventional one.
次にこれらの洗浄液を用いて、第２図に示す接合モデル
を洗浄した。接合に用いたはんだは、Ｉｎ−４８３ｎ（
共晶温度１１７°Ｃ）で、フラックスはＲＡタイプのも
のを用いた。洗浄は、２２°Ｃの洗浄液槽に５ ｍｉｎ
浸漬して行った。そして、この接合モデルを６５゛Ｃ１
８５％ＲＨの雰囲気中に１５日放置した後のはんだ接合
部を観察したところ、従来のフランクス残渣洗浄液（第
２表）で洗浄したものは、はんだ接合部に腐食が認めら
れたが、本発明のフランクス残渣洗浄液（第１表）で洗
浄したものは、腐食が認められなかった。Next, using these cleaning solutions, the bonded model shown in FIG. 2 was cleaned. The solder used for joining was In-483n (
The eutectic temperature was 117°C), and RA type flux was used. Cleaning is done in a cleaning solution bath at 22°C for 5 min.
I dipped it. Then, this joining model is 65゛C1
When the solder joints were observed after being left in an atmosphere of 85% RH for 15 days, corrosion was observed in the solder joints of those cleaned with the conventional Franks residue cleaning solution (Table 2), but the present invention No corrosion was observed in those cleaned with the Franks residue cleaning solution (Table 1).
以上説明した様に、本発明によればはんだ接合部の腐食
原因となるアミンハロゲン化水素酸塩の／８解能を高め
たフランクス残渣洗浄液を得ることができることから、
はんだ接合部の信頼性向上に寄与するところが大きい。As explained above, according to the present invention, it is possible to obtain a Franks residue cleaning solution with improved /8 resolution of amine hydrohalide, which causes corrosion of solder joints.
This greatly contributes to improving the reliability of solder joints.
第１図は本発明の原理説明図、および第２図は評価用接
合モデルを示す斜視図である。FIG. 1 is a diagram explaining the principle of the present invention, and FIG. 2 is a perspective view showing a joint model for evaluation.
Claims (1)
はんだ接合用フラックスの残渣洗浄液において、 化学式（Ｃ＿２Ｈ＿４Ｏ）＿ｎ，ｎ＝４，５，６，８で
表される大環状ポリエーテルを０．１ｗｔ％〜２ｗｔ％
の範囲で添加したことを特徴とするフラックス残渣洗浄
液。1. In a solder bonding flux residue cleaning solution containing amine hydrohalide as an activator, 0.1 wt% or more of macrocyclic polyether represented by the chemical formula (C_2H_4O)_n, n=4,5,6,8 is added. 2wt%
A flux residue cleaning solution characterized in that a flux residue cleaning solution is added in a range of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25490388A JPH02103292A (en) | 1988-10-12 | 1988-10-12 | Cleaning fluid for residual flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25490388A JPH02103292A (en) | 1988-10-12 | 1988-10-12 | Cleaning fluid for residual flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02103292A true JPH02103292A (en) | 1990-04-16 |
Family
ID=17271447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25490388A Pending JPH02103292A (en) | 1988-10-12 | 1988-10-12 | Cleaning fluid for residual flux |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02103292A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0344091A (en) * | 1989-06-22 | 1991-02-25 | Internatl Business Mach Corp <Ibm> | Corrosion suppressing method for electronic components |
-
1988
- 1988-10-12 JP JP25490388A patent/JPH02103292A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0344091A (en) * | 1989-06-22 | 1991-02-25 | Internatl Business Mach Corp <Ibm> | Corrosion suppressing method for electronic components |
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