JPH02103991A - Method and apparatus for dividing circuit board - Google Patents
Method and apparatus for dividing circuit boardInfo
- Publication number
- JPH02103991A JPH02103991A JP25781088A JP25781088A JPH02103991A JP H02103991 A JPH02103991 A JP H02103991A JP 25781088 A JP25781088 A JP 25781088A JP 25781088 A JP25781088 A JP 25781088A JP H02103991 A JPH02103991 A JP H02103991A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- dividing
- knife blade
- punching die
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、回路基板を所定の外形の単品に分割する方法
及び装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method and apparatus for dividing a circuit board into individual pieces having predetermined external shapes.
（従来の技術〕
回路基板の分割方法として、ＩＣ、コンデンサ、抵抗等
のチップ部品やディスクリート部品の実装前に回路基板
にＶ−カットマシンを用いてＶ形溝を穿設し、部品の実
装後に回路基板を前記Ｖ形溝に沿って手動で分割する方
法が知られている。(Conventional technology) As a method of dividing a circuit board, a V-shaped groove is bored in the circuit board using a V-cut machine before mounting chip components such as ICs, capacitors, resistors, etc. or discrete components, and then after mounting the components. A method of manually dividing a circuit board along the V-shaped groove is known.
また、別の方法として、部品の実装前に回路基板に金型
を用いてミシン目又は小穴を穿設し、部品の実装後に回
路基板を前記ミシン目等に沿って手動で分割する方法も
知られている。Another method is to use a mold to make perforations or small holes in the circuit board before mounting the components, and then manually dividing the circuit board along the perforations after mounting the components. It is being
上記の従来技術では、回路基板が、部品の実装工程では
容易に分割されないが回路基板の分割工程では作業性よ
く分割されるように、部品の大きさ、数量、実装密度、
或は回路基板自体の材質、厚み等の諸要素に応じてＶ形
溝の大きさ、深さやミシン目等の大きさ、ピッチ等を最
適に設定することが困難であフた。In the above-mentioned conventional technology, the size, quantity, and packaging density of the components are adjusted so that the circuit board is not easily divided during the component mounting process, but can be divided with good workability during the circuit board dividing process.
Alternatively, it is difficult to optimally set the size and depth of the V-shaped groove, the size of perforations, pitch, etc., depending on various factors such as the material and thickness of the circuit board itself.
即ち、回路基板の分割工程における作業性を向上させる
ために回路基板の分割性を高め過ぎると、部品の実装工
程において回路基板の分割や破損が生じ易く、作業性の
低下を招き、また逆に、部品の実装工程における作業性
を向上させるために回路基板の分割性を抑え過ぎると、
回路基板の分割工程において分割の困難を来し、作業性
の低下を招くと共に時として実装部品の破損を生じ易く
なるので、部品の実装工程と回路基板の分割工程とでは
回路基板に相反・する分割性が要求される。In other words, if the divisibility of the circuit board is increased too much in order to improve the workability in the circuit board division process, the circuit board is likely to be divided or damaged in the component mounting process, leading to a decrease in workability, and vice versa. , if the divisibility of the circuit board is suppressed too much in order to improve workability in the component mounting process,
In the process of dividing the circuit board, it becomes difficult to divide the circuit board, leading to a decrease in work efficiency and sometimes causing damage to the mounted components. Divisibility is required.
また、上記のＶ−カットマシンでは■形状の回転鋸盤が
使用されるために、Ｖ形溝は直線状のものに限定され、
曲線状のＶ形溝は要求があっても穿設が困難である。さ
らに、そのような直線状のＶ形溝によって回路基板を複
数区画に分割する場合、回転鋸盤を繰り返して縦横に移
動させるので、区画数が多くなると相当の作業工数が必
要になる。In addition, since the above V-cut machine uses a ■-shaped rotary saw, the V-shaped groove is limited to a straight one.
Curved V-shaped grooves are difficult to drill even if required. Furthermore, when dividing a circuit board into a plurality of sections using such linear V-shaped grooves, a rotary saw is repeatedly moved vertically and horizontally, which requires a considerable number of man-hours as the number of sections increases.
本発明の目的は、部品の実装工程と回路基板の分割工程
とにおいて回路基板に相反する分割性を要求されず、作
業性を従来技術に比べて格段に向上させた回路基板の分
割方法及び装置を提供することにある。An object of the present invention is to provide a method and apparatus for dividing a circuit board, which does not require contradictory dividing properties of the circuit board in the component mounting process and the circuit board dividing process, and improves workability significantly compared to the conventional technology. Our goal is to provide the following.
本発明に係る回路基板の分割方法は、請求項１に記載さ
れるように、回路基板を、部品の実装後に、所定切断個
所に対応して配置されたナイフ刃及びその刃先と嵌合す
る溝を有する受け台を備えた打抜き型により、その打抜
き型が部品を押圧しないように切断することを特徴とす
る。As described in claim 1, the method for dividing a circuit board according to the present invention includes a knife blade disposed corresponding to a predetermined cutting location and a groove fitted with the cutting edge of the circuit board after mounting the components. The cutting die is characterized in that the cutting die is equipped with a cradle and cuts the part without pressing the die.
ナイフ刃には、刃先硬度が比較的高いトムソン打抜き刃
、超硬刃、セラミック加工処理刃等の鋭利な刃を用いる
ことができ、長手方向に連続的であっても鋸歯状であっ
てもよく、また受け台の溝は断面Ｖ形状であっても矩形
状であってもよい。The knife blade can be a sharp blade such as a Thomson punched blade, a carbide blade, or a ceramic processed blade, which has a relatively high cutting edge hardness, and can be continuous in the longitudinal direction or serrated. Further, the groove of the pedestal may have a V-shaped cross section or a rectangular shape.
さらに、本発明は、上記部品の実装が回路基板の片面の
みならず両面に行なわれる場合を包含する。Furthermore, the present invention includes cases where the above components are mounted not only on one side of the circuit board but also on both sides.
比較的厚みが大きく、強度に優れた回路基板に対しては
、作業工数の若干の増加を招くとしても、請求項２に記
載されるように、回路基板に、部品の実装前に、所定切
断個所に沿ってミシン目、小穴又は溝からなる分割案内
手段を穿設することが好ましい。For a circuit board that is relatively thick and has excellent strength, the circuit board may be cut in a predetermined manner before components are mounted, as described in claim 2, even if it causes a slight increase in the number of man-hours. Preferably, dividing guide means consisting of perforations, eyelets or grooves are provided along the points.
上記のような回路基板の分割方法を実施するための分割
装置は、請求項３に記載されるように、対向して配置さ
れた天板及び底板、並びに天板及び底板の一方及び他方
に回路基板の所定切断個所に対応して配置されたナイフ
刃及びその刃先と嵌合する溝を有する受け台からなる打
抜き型と、打抜き型の天板又は底板をナイフ刃の刃先が
受け台の溝に嵌合するまで加圧するプレス手段とからな
り、前記加圧時に打抜き型における天板、底板その他の
部材が回路基板上に実装された部品を押圧しないように
ナイフ刃及び／又は受け台の高さを選択したことを特徴
とする。As described in claim 3, a dividing device for carrying out the method for dividing a circuit board as described above includes a top plate and a bottom plate arranged opposite to each other, and a circuit board on one and the other of the top plate and the bottom plate. A punching die consisting of a knife blade arranged corresponding to a predetermined cutting location of the substrate and a holder having a groove that fits the edge of the knife, and a top plate or bottom plate of the punching die with the edge of the knife blade in the groove of the holder. The height of the knife blade and/or pedestal is set so that the top plate, bottom plate, and other members of the punching die do not press the components mounted on the circuit board when applying pressure. It is characterized by the selection of
通常の場合は天板にナイフ刃、底板に受け台を各々配置
すればよいが、必要に応じて逆の配置にしても差支えな
い。部品が回路基板の片面のみに実装されている場合は
、実装部品と対向するナイフ刃又は受け台を、また部品
が回路基板の両面に実装されている場合は、各面におけ
る実装部品と各々対向するナイフ刃及び受け台を所要の
高さに選択すればよい。In normal cases, the knife blade may be placed on the top plate and the cradle may be placed on the bottom plate, but the arrangement may be reversed if necessary. If the components are mounted on only one side of the circuit board, use a knife blade or cradle facing the mounted components, and if components are mounted on both sides of the circuit board, place the knife blade or cradle opposite the mounted components on each side. All you have to do is select the knife blade and holder of the required height.
（作 用〕
請求項１記載の回路基板の分割方法に係る発明では、回
路基板が、部品の実装後に、ナイフ刃と受け台とからな
る打抜き型によフて所定切断個所に沿って突切り切断さ
れ、その場合に打抜き型の天板や底板等が部品を押圧し
て、破損させることはない。(Function) In the invention relating to the method for dividing a circuit board according to claim 1, after mounting the components, the circuit board is cut off along predetermined cutting points using a punching die consisting of a knife blade and a holder. When the parts are cut, the top plate, bottom plate, etc. of the punching die will not press against the parts and damage them.
また、請求項２記載の回路基板の分割方法に係る発明で
は、請求項１記載の前記発明において、回路基板は、部
品の実装前にミシン目等の分割案内手段が予め穿設され
た所定切断個所に沿って切断される。この場合の分割案
内手段は、部品の実装工程において容易に分割されない
ように分割性を抑えたものであればよく、従来のように
手動による分割可能性は要求されない。Further, in the invention according to the method for dividing a circuit board according to claim 2, in the invention according to claim 1, the circuit board is cut in a predetermined manner in which a division guide means such as a perforation is pre-drilled before mounting the components. Cut along the points. The division guide means in this case may be of any type that suppresses divisibility so as not to be easily divided during the component mounting process, and does not need to be manually divisible as in the prior art.
さらに、請求項３記載の回路基板の分割装置に係る発明
では、打抜き型がプレス手段によって作動し、回路基板
は、部品が打抜き型の天板や底板等による押圧によって
損傷を受けることなく、所定切断個所に沿って切断され
る。ナイフ刃及び／又は受け台の高さは、対応する部品
の実装高さに応じて選択される。Furthermore, in the invention relating to the circuit board dividing device according to claim 3, the punching die is actuated by the press means, and the circuit board is separated into a predetermined position without damaging the components due to pressure by the top plate, bottom plate, etc. of the punching die. Cut along the cut point. The height of the knife blade and/or the cradle is selected depending on the mounting height of the corresponding component.
〔実施例１〕
第１図は本発明に係る回路基板の分割装置の一例の断面
図である。[Embodiment 1] FIG. 1 is a sectional view of an example of a circuit board dividing apparatus according to the present invention.
同図において、天板（１）と底板（２）とが上下に相対
して配置され、ナイフ刃（３）が天板（１）下面に押え
板（４）を介して突設され、また受け台（５）が底板（
２）上面に押え板（６）を介して突設され、受け台（５
）は上面にナイフ刃（３）の刃先と嵌合する溝（７）を
有し、それらの部材は協働して打抜き型を構成する。ま
た、打抜き型の天板（１）はプレス手段のプレスラム（
図示を省略する）に連結され、昇降可能である。In the figure, a top plate (1) and a bottom plate (2) are arranged vertically facing each other, a knife blade (3) is provided protruding from the lower surface of the top plate (1) via a presser plate (4), and The cradle (5) is the bottom plate (
2) Protruding from the upper surface via a presser plate (6), and a cradle (5)
) has a groove (7) on its upper surface that fits with the cutting edge of the knife blade (3), and these members cooperate to form a punching die. In addition, the top plate (1) of the punching die is attached to the press ram (
(not shown) and is movable up and down.
片面に部品（８）が実装された回路基板（９）が受け台
（５）上に設置され、ナイフ刃（３）及び受け台（５）
が回路基板（９）の所定切断個所に正確に対応するよう
に位置決めされ、さらにナイフ刃（３）の突出高さは実
装された部品（８）の高さを越えるように設定されてい
る。A circuit board (9) with components (8) mounted on one side is placed on the pedestal (5), and the knife blade (3) and the pedestal (5)
is positioned to accurately correspond to a predetermined cutting location on the circuit board (9), and the protruding height of the knife blade (3) is set to exceed the height of the mounted component (8).
上記において、プレス手段により天板（１）をナイフ刃
（３）の刃先が受け台（５）の溝（７）に嵌合するまで
下降させると、回路基板（９）は、実装された部品（８
）が天板（１）や押え板（４）と当接して損傷を受ける
ことなく円滑に切断され、所定の外形の単品に分割され
る。In the above, when the top plate (1) is lowered by the pressing means until the cutting edge of the knife blade (3) fits into the groove (7) of the pedestal (5), the circuit board (9) is removed from the mounted parts. (8
) is smoothly cut without being damaged by coming into contact with the top plate (1) or the presser plate (4), and is divided into individual pieces with a predetermined external shape.
〔実施例２〕
第２図は本発明に係る回路基板の分割装置の別の一例の
断面図である。[Embodiment 2] FIG. 2 is a sectional view of another example of the circuit board dividing device according to the present invention.
同図において、両面に部品（８）が実装された回路基板
（９）が使用され、従ってナイフ刃（３）のみならず受
け台（５）の突出高さも実装された部品（８）の高さを
越えるように設定されている点を除いて、実施例１と同
様の構成を有する。In the same figure, a circuit board (9) with components (8) mounted on both sides is used, and therefore not only the protruding height of the knife blade (3) but also the pedestal (5) is also the height of the mounted component (8). The configuration is similar to that of the first embodiment except that the configuration is set to exceed the height of the second embodiment.
〔発明の効果Ｊ
以上のように、請求項１記載の回路基板の分割方法によ
れば、部品の実装工程と回路基板の分割工程とにおいて
回路基板に相反する分割性を要求されないので、作業性
の向上、工程の簡略化、コストの低減、歩留り率の向上
等をもたらすことができ、また実装部品やボンディング
用ハンダ等は打抜き型によって損傷を受けない。この場
合、ナイフ刃と受け台とからなる打抜き型を使用するの
で、打抜き圧力が少なくて済み１回路基板を分割すべき
区画数に関係なく、また直線状、曲線状の別なく、所定
切断個所に沿って瞬時に切断することができ、切断面の
状態も従来の手動による分割の場合に比べて良好である
。[Effect of the invention J As described above, according to the method for dividing a circuit board according to claim 1, conflicting divisibility is not required for the circuit board in the component mounting process and the circuit board dividing process, so that workability is improved. It is possible to improve the performance, simplify the process, reduce costs, improve yield rate, etc., and the mounted components, solder for bonding, etc. are not damaged by the punching die. In this case, since a punching die consisting of a knife blade and a pedestal is used, the punching pressure is low, and regardless of the number of sections into which one circuit board is to be divided, and regardless of whether it is straight or curved, the predetermined cutting point can be cut. It can be cut instantly along the line, and the condition of the cut surface is better than in the case of conventional manual division.
また、請求項２記載の回路基板の分割方法によれば、打
抜き型による切断に際して回路基板の所定切断個所に沿
って予めミシン目等の分割案内手段が穿設されているの
で、比較的厚みが大きく、強度に優れた回路基板も、強
大な打抜き圧力を必要とせず、また不要個所に亀裂等を
生じることなしに所定切断個所に沿って円滑に切断する
ことができる。Further, according to the method for dividing a circuit board according to claim 2, when the circuit board is cut with a punching die, a dividing guide means such as a perforation is pre-drilled along a predetermined cutting location of the circuit board, so that the thickness can be relatively reduced. Even large circuit boards with excellent strength can be cut smoothly along predetermined cutting points without requiring great punching pressure and without creating cracks or the like in unnecessary areas.
さらに、請求項３記載の回路基板の分割装置によれば、
上記の請求項１及び２記載の回路基板の分割方法を好適
に実施することができる。この場合、ナイフ刃及び受け
台の高さが部品の実装高さに応じて選択されるので、実
装部品やボンディング用ハンダ等嚇打抜き型によって損
傷を受けない。この分割装置では分割後の回路基板が元
の位置に残るので、ワーク吸引装置付きのロボットシス
テム（切断基板自動搬送装置）を導入することにより、
この分割装置を完全自動化ラインへ組み込むことも可能
である。Furthermore, according to the circuit board dividing apparatus according to claim 3,
The method for dividing a circuit board according to claims 1 and 2 above can be suitably implemented. In this case, the height of the knife blade and the pedestal are selected according to the mounting height of the component, so that the mounting component and the solder for bonding are not damaged by the punching die. With this dividing device, the circuit boards remain in their original positions after being divided, so by introducing a robot system (automatic cut board transport device) with a workpiece suction device,
It is also possible to integrate this dividing device into a fully automated line.
第１図は本発明に係る回路基板の分割装置の一例の断面
図、第２図は本発明に係る回路基板の分割装置の別の一
例の断面図である。
〈符号の説明〉
１・・・天板、 ２・−底板、 ３−・・ナイフ刃、
４・・・押え板、 ５−・受け台、 ６・−押え板、
７・−溝、 ８一部品、 ９・−回路基板
以上
特許出願人 株式会社 小池製作所
代理人 弁理士 安 藤 惇 逸FIG. 1 is a cross-sectional view of an example of the circuit board dividing apparatus according to the present invention, and FIG. 2 is a cross-sectional view of another example of the circuit board dividing apparatus according to the present invention. <Explanation of symbols> 1...Top plate, 2--Bottom plate, 3-...Knife blade,
4--pressing plate, 5--cradle, 6--pressing plate,
7.-Groove, 8.1 Part, 9.-Circuit Board Patent Applicant: Koike Seisakusho Co., Ltd. Patent Attorney Atsushi Ando
Claims (3)
応して配置されたナイフ刃及びその刃先と嵌合する溝を
有する受け台を備えた打抜き型により、その打抜き型が
部品を押圧しないように切断することを特徴とする回路
基板の分割方法。(1) After the circuit board is mounted, the parts are pressed by a punching die equipped with a knife blade placed corresponding to a predetermined cutting point and a holder having a groove that fits with the cutting edge. A method for dividing a circuit board, characterized by cutting the circuit board in such a way that the circuit board is not damaged.
ってミシン目、小穴又は溝からなる分割案内手段を穿設
する、請求項１記載の回路基板の分割方法。(2) A method for dividing a circuit board according to claim 1, wherein a dividing guide means consisting of a perforation, a small hole, or a groove is bored in the circuit board along a predetermined cutting point before mounting the components.
び底板の一方及び他方に回路基板の所定切断個所に対応
して配置されたナイフ刃及びその刃先と嵌合する溝を有
する受け台からなる打抜き型と、打抜き型の天板又は底
板をナイフ刃の刃先が受け台の溝に嵌合するまで加圧す
るプレス手段とからなり、前記加圧時に打抜き型が回路
基板上に実装された部品を押圧しないようにナイフ刃及
び／又は受け台の高さを選択したことを特徴とする回路
基板の分割装置。(3) A top plate and a bottom plate placed opposite each other, and a knife blade placed on one and the other of the top plate and the bottom plate corresponding to a predetermined cutting location of the circuit board, and a receiver having a groove that fits the blade edge. It consists of a punching die consisting of a stand, and a press means that presses the top plate or bottom plate of the punching die until the cutting edge of the knife blade fits into the groove of the cradle, and when the pressurization is applied, the punching die is mounted on the circuit board. 1. A circuit board dividing device, characterized in that the height of the knife blade and/or the pedestal is selected so as not to press the components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25781088A JPH02103991A (en) | 1988-10-13 | 1988-10-13 | Method and apparatus for dividing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25781088A JPH02103991A (en) | 1988-10-13 | 1988-10-13 | Method and apparatus for dividing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02103991A true JPH02103991A (en) | 1990-04-17 |
Family
ID=17311434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25781088A Pending JPH02103991A (en) | 1988-10-13 | 1988-10-13 | Method and apparatus for dividing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02103991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611991U (en) * | 1992-07-14 | 1994-02-15 | イズミ電子株式会社 | Component mounting wiring board cutting device |
| JP2005096328A (en) * | 2003-09-26 | 2005-04-14 | Murata Mfg Co Ltd | Apparatus for pressing laminate block |
-
1988
- 1988-10-13 JP JP25781088A patent/JPH02103991A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611991U (en) * | 1992-07-14 | 1994-02-15 | イズミ電子株式会社 | Component mounting wiring board cutting device |
| JP2005096328A (en) * | 2003-09-26 | 2005-04-14 | Murata Mfg Co Ltd | Apparatus for pressing laminate block |
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