JPH0210570B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for supplying a lead frame to be incorporated in manufacturing a package for a semiconductor device.

(Prior art) When manufacturing a so-called cer-dip type package for a semiconductor device, the external lead portion is bent in advance on a ceramic base coated with low-melting point glass to form a U-shaped package with both ends slightly widening. Place a lead frame formed so that
The low melting point glass is melted in a suitable furnace to weld the lead frame onto the ceramic base.

As an apparatus for automatically supplying such a lead frame to a welding jig, there is an apparatus for supplying lead frames for ceramic cases disclosed in Japanese Patent Application Laid-open No. 12794/1983.

The above device will be explained based on FIG. 5. Reference numeral 10 denotes a downwardly open magazine that stores a large number of lead frames 12 stacked up by bending them into a U-shape that widens slightly toward both ends. 12 is supported by a stopper 16 fixed to the tip of the L-shaped lever 14. The L-shaped lever 14 swings around a shaft 18, and when the L-shaped lever 14 rotates in the direction of arrow A, the stopper 16 moves toward the magazine 1.
0, and the lead frame 12 falls naturally.

20 is a wedge whose tip is cut diagonally, and is connected to the rod of the solenoid 22.
When the rod is energized and the rod is attracted, the tip of the wedge 20 enters between the lowermost lead frame and the second lead frame immediately above it. A cam 24 is fixed to and interlocks with the wedge 20, and when the wedge 20 enters between the lead frames as described above, it presses the L-shaped lever 14 and swings in the direction of arrow A.

When the tip of the wedge 20 enters between the lowest lead frame and the second lead frame immediately above it, the L-shaped lever 14 swings and the stopper 16 is removed from the lower position of the magazine 10. As the wedge 20 enters, the second and upper lead frames are supported by the upper surface of the wedge 20, and the lowermost lead frame is pushed downward by the vertical force from the inclined surface at the tip of the wedge 20. The lead frame is separated from the second lead frame, falls downward, and is supplied onto a welding jig.

(Problems to be Solved by the Invention) As described above, the conventional supply device has a stopper 1
While the lead frames are supported alternately by the wedges 6 and 20, the lowermost lead frame is separated and dropped by the vertical force from the inclined surface of the wedge 20 and is automatically supplied.

However, in the above device, there is a problem in that a horizontal component of force acts on the edge of the lead frame from the inclined surface of the wedge 20 at the same time as a vertical component, and the edge of the lead frame is deformed by this horizontal component of force. In particular, with the recent trend toward higher integration of semiconductor devices, the pattern density of the lead frames used has increased, and the lead portions have become thinner, making them more susceptible to deformation.

In addition, the lead frames, which are bent into a U-shape with both ends slightly widening, are stacked in large numbers so that the outer edge of the bottom side strongly bites into the inner wall of the outer lead part of the lower lead frame. It is difficult to separate, and in order to reliably separate it,
It is necessary to have a strong slope at the tip of the wedge 20 and a large stroke of the wedge 20, but if this is done, the horizontal component force will become even larger, leading to deformation of the lead frame.

The present invention has been made to solve the above problems, and its purpose is to provide a supply device for lead frames for semiconductor devices that can reliably separate lead frames one by one without deforming the lead frames. It is in.

(Means for Solving the Invention) A supply device for a lead frame for a semiconductor device according to the present invention has the following configuration in order to solve the above problems.

That is, there is a downwardly open magazine 30 that stores a large number of stacked lead frames 31 formed by bending the external lead portions so that the lead frames 31 are formed in a U-shape that slightly widens at both ends; A first stopper member 38 is provided to be movable forward and backward in the forward direction and supports the lower surface of the lowermost lead frame of the lead frame stored in the magazine 30 in the forward position, and the first stopper member 3
A second stopper member 42 which is alternately moved forward and backward and enters the gap between the lowermost lead frame stored in the magazine 30 and the lead frame immediately above it in the forward position; A push-down member 4 that moves forward and backward into the gap and is pushed down by an appropriate push-down mechanism after the first stopper member 38 is moved back and forth in the forward position to separate the lowermost lead frame.
6.

(Function) First, the lead frame 31 housed in the magazine 30 is supported by the first stopper member 38. The second stopper member 42 and push-down member 46 are then moved forward into the gap between the lowermost lead frame and the lead frame immediately above it. Next, the first stopper member 38 is moved backward, the second and higher lead frames from the bottom are supported by the second stopper member 42, and the lowermost lead frame becomes free. At this stage, the push-down member 46 is pushed down, the lowermost lead frame is separated and falls, and the welding jig 32
It is something that will guide you upwards.

(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In FIG. 1a, 30 is a plurality of rows (for example,
It is a downwardly open magazine that accommodates 20 rows) and is supported by appropriate members (not shown). A welding jig 32 is arranged below the magazine 30. As shown in FIG. 3, the welding jig 32 is made of a ceramic base 3 coated with low melting point glass.
4 (FIG. 1a) can be placed thereon,
A through hole 38 is provided on both sides of this mounting section 36, and the lead frame 31 that is dropped from the magazine 30 is arranged so as to straddle the mounting section 36 and rest on the ceramic base 34, as will be described later. .

Reference numeral 38 designates a stopper pin as a first stopper member, which is implanted in the magazine-side side wall of a movable block 40 that is provided on both sides of the lower part of the magazine 30 so as to be movable forward and backward in a direction perpendicular to the magazine 30. The stopper pin 38 is connected to the moving block 40
By moving forward in the magazine direction, the lowermost lead frames of each row of lead frames 31 stored in the magazine 30 are supported by two lead frames each.

Reference numeral 42 designates a stopper wedge as a second stopper member, which is installed on the magazine-side side wall of a movable body 44 that is provided on both sides of the lower part of the magazine 30 so as to be movable forward and backward in a direction perpendicular to the magazine 30. .

As is clear from FIG. 4, the tip of the stopper wedge 42 is bifurcated, and its upper surface is horizontal and its lower surface is sloped, forming a wedge shape. When the movable body 44 moves forward in the direction of the magazine 30, the tip of the wedge enters the gap between the lowermost lead frame and the lead frame immediately above it in each row of lead frames 31 stored in the magazine 30. Next, the moving block 40 moves back and stops the stopper pin 3.
8 is released, the stopper wedge 42 supports the second or higher lead frame from the bottom on the horizontal surface of the wedge tip. Therefore, the lowermost lead frame is in a free state. In this manner, the stopper pin 38 and the stopper wedge 42 are alternately driven to support the lead frame. The stopper wedge 42 is set to move forward by a stroke sufficient to support the second lead frame from the bottom, and the forward movement is stopped at a position where the inclined surface of the lower surface of the wedge does not come into contact with the lowest lead frame. . The reason why the stopper wedge 42 is provided in a wedge shape is to make it easier for the wedge tip to enter into the gap even if the gap between the stacked lead frames is small, and to prevent the lead frame from being crushed. be. Therefore, it may be a pin-shaped body or a plate-shaped body similar to the stopper pin 38.

Reference numeral 46 denotes a push-down member, which is fixed to a rotating shaft 50 supported by a bearing 48 fixed to the lower surface of the movable body 44, and whose tip is formed into a tip-shaped portion that fits into the forked portion at the tip of the stopper wedge 42. . Therefore, when the movable body 44 moves forward, the push-down member 46 moves forward together with the stopper wedge 42, and the tip of the push-down member 46 moves forward into the gap between the lowermost lead frame and the lead frame immediately above it. Also, the rotation axis 5
As the lead frame rotates, the tip-shaped part is pushed down, causing the lead frame at the bottom to separate and fall.

The present invention is configured as described above. The operation will be summarized based on FIG.

Figure a shows a standby state in which the moving block 40 is in the forward position and the stopper pin 38 supports the lead frame 31 housed in the magazine 30.

From this state, the movable body 44 is moved forward, and the stopper wedge 42 and the push-down member 46 enter the gap between the lowermost lead frame and the lead frame immediately above it.

Subsequently, as shown in Figure b, the moving block 40 moves backward, the stopper pin 38 is no longer supported, the second and higher lead frames from the bottom are supported by the stopper wedge 42, and the lowest lead frame becomes free. .

From this state, as shown in FIG.
is rotated, the tip of the push-down member 46 is pushed down, and the lead frame 31 at the bottom is rotated.
is separated and falls to a predetermined position on the welding jig 32. Next, the push-down member 46 returns to rotation (FIG. 2A), the moving block 40 moves forward and enters the position below the stopper pin 38 or lead frame, and then the moving body 44 moves back and returns to the standby state. .

The welding jig 32 with the ceramic base 34 and the lead frame 31 set therein can be carried into a suitable furnace to weld the lead frame.

Note that the forward movement of the moving block 42 and the moving body 44,
The retraction movement can be carried out, for example, with a pneumatic cylinder,
Further, the rotation shaft 50 can be rotated via a suitable cam mechanism or link mechanism.

Although the moving block 42 and the movable body 44 are alternately moved forward and backward as described above, they may start moving forward and backward at the same time. In any case, it is sufficient that either the stopper pin 38 or the stopper wedge 42 can support the lead frame at all times.

Further, in the above embodiment, the stopper wedge 42
Although the forward and backward movement of the push-down member 46 and the push-down member 46 were simultaneously performed by the forward-backward movement of the movable body 44, the push-down member 46
A mechanism for moving forward and backward may be provided separately.

Further, the push-down member 46 is not driven by reciprocating rotation as described above, but may be driven reciprocating in the up and down direction to achieve the same effect.

(Effect of the invention) As described above, according to the present invention, 1
Rather than supporting and separating the lead frame at the same time using a single wedge, two members, a second stopper member and a push-down member, are provided, and each member supports and separates the lead frame. Since the movement of the push-down member is
The welding jig eliminates the need for forced movements that would deform the lead frame, and as semiconductor devices become more highly integrated, the lead frames, which have become densely patterned, can be reliably separated without being deformed. It is something that can be supplied to the top.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the configuration of the device of the present invention and an overview of its operation, Fig. 2 is an explanatory diagram showing stacked lead frames, Fig. 3 is a perspective view showing an example of a welding jig, and Fig. 4 is FIG. 2 is an explanatory diagram showing the main parts of the device of the present invention. FIG. 5 is an explanatory diagram showing a conventional device. 10...Magazine, 12...Lead frame,
14... L-type lever, 16... Stopper, 18
...shaft, 20 ... wedge, 22 ... solenoid, 24
... cam, 30 ... magazine, 31 ... lead frame, 32 ... welding jig, 34 ... ceramic base, 36 ... mounting section, 38 ... first stopper member, 40 ... moving block, 42...Second
stopper member, 44... moving body, 46... push-down member, 48... bearing, 50... rotating shaft.

Claims (1)

[Scope of Claims] 1. A downwardly open magazine for stacking and storing a large number of lead frames formed by bending the external lead portions to form a U-shape that slightly widens at both ends; and the magazine. a first stopper member that is provided so as to be movable forward and backward toward the lower open portion of the magazine, and supports the lower surface of the lowermost lead frame of the lead frame stored in the magazine in the forward position; a second stopper member that is alternately moved forward and backward and enters a gap between the lowermost lead frame and the lead frame immediately above the lead frame stored in the magazine in the forward position; and a push-down member that is pushed down by an appropriate push-down mechanism after the first stopper member is retracted in the forward position to separate the lowermost lead frame. Frame feeding device.