JPH02133308U - - Google Patents
Info
- Publication number
- JPH02133308U JPH02133308U JP4176389U JP4176389U JPH02133308U JP H02133308 U JPH02133308 U JP H02133308U JP 4176389 U JP4176389 U JP 4176389U JP 4176389 U JP4176389 U JP 4176389U JP H02133308 U JPH02133308 U JP H02133308U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- outer peripheral
- semiconductor wafer
- dicing tape
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 4
- 235000012431 wafers Nutrition 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 2
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
第１図は本考案による第１の実施例を示す平面
図、第２図はウエハを貼付けた状態における第１
図の中央断面図、第３図は本考案による第２の実
施例を示す平面図、第４図はウエハを貼付けた状
態における第３図の中央断面図である。
１……粘着剤層、２……基材テープ、３……ウ
エハ、４……ウエハの円弧状部、５……外周粘着
層、６……外周粘着層（帯状）。
FIG. 1 is a plan view showing the first embodiment of the present invention, and FIG. 2 is a plan view showing the first embodiment with a wafer attached.
FIG. 3 is a plan view showing a second embodiment of the present invention, and FIG. 4 is a center sectional view of FIG. 3 with a wafer attached thereto. DESCRIPTION OF SYMBOLS 1... Adhesive layer, 2... Base tape, 3... Wafer, 4... Arc-shaped part of wafer, 5... Outer periphery adhesive layer, 6... Outer periphery adhesive layer (band-shaped).
Claims (1)
一な厚さを有する粘着剤層と、該粘着剤層の上面
に半導体ウエハの外周径と対応する位置に半導体
ウエハと同じ厚さで形成した外周粘着層と、前記
粘着剤層の下面に配置された基材テープとから構
成したことを特徴とする半導体ウエハのダイシン
グテープ。 In a dicing tape for semiconductor wafers, an adhesive layer having a uniform thickness, an outer peripheral adhesive layer formed on the upper surface of the adhesive layer at a position corresponding to the outer peripheral diameter of the semiconductor wafer and having the same thickness as the semiconductor wafer; A dicing tape for semiconductor wafers, comprising a base tape disposed on the lower surface of an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176389U JPH02133308U (en) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176389U JPH02133308U (en) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02133308U true JPH02133308U (en) | 1990-11-06 |
Family
ID=31552710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176389U Pending JPH02133308U (en) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133308U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009064885A (en) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | Auxiliary member for dicing |
| JP2013021109A (en) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | Adhesive sheet and method for processing disk-like workpiece using adhesive sheet |
| JP2013021110A (en) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | Method for processing disk-like workpiece |
| JP2013247136A (en) * | 2012-05-23 | 2013-12-09 | Disco Abrasive Syst Ltd | Tape and method for processing plate-like object using the tape |
| JP2015050445A (en) * | 2013-09-05 | 2015-03-16 | 古河電気工業株式会社 | Adhesive tape and method of manufacturing semiconductor device |
-
1989
- 1989-04-10 JP JP4176389U patent/JPH02133308U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009064885A (en) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | Auxiliary member for dicing |
| JP2013021109A (en) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | Adhesive sheet and method for processing disk-like workpiece using adhesive sheet |
| JP2013021110A (en) * | 2011-07-11 | 2013-01-31 | Disco Abrasive Syst Ltd | Method for processing disk-like workpiece |
| JP2013247136A (en) * | 2012-05-23 | 2013-12-09 | Disco Abrasive Syst Ltd | Tape and method for processing plate-like object using the tape |
| JP2015050445A (en) * | 2013-09-05 | 2015-03-16 | 古河電気工業株式会社 | Adhesive tape and method of manufacturing semiconductor device |